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BD82NM70 ALJTA Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000567
€5.40

BD82NM70 ALJTA Stencil Template

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21508390x9090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000577
€9.97

215-0839097 Stencil Template 90*90

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Apple BIOS MBP15 2013 A1398 8203787 EMC2745

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003341
€30.71

Apple BIOS MBP15 2013 A1398 820-3787 EMC2745

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GFGO7600HNA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000578
€5.40

GF-GO7600-H-N-A2 Stencil Template

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N13PGTWA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000588
€5.40

N13P-GT-W-A2 Stencil Template

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Apple BIOS MacMini 2011 A1347 8202993 EMC2442

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003378
€30.71

Apple BIOS MacMini 2011 A1347 820-2993 EMC2442

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GM204650KDA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000597
€7.46

GM204-650-KD-A1 Stencil Template

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DCin Board Socket Jack Cable For Macbook Pro 15 Retina A1398 20122015

DC-in Board Socket Jack Cable For Macbook Pro 15" Retina A1398 2012-2015

Product Condition: New

Compatible Models:

Macbook Pro 15" Retina A1398 2012-2015

Package Include:

1 X DC Power Jack

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003438
€12.31

DC-in Board Socket Jack Cable For Macbook Pro 15 Retina A1398 2012-2015

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MacBook Air 133 Screen Bezel 6043991A A1369 A1466 Frame Rahmen Front Display B cover

Product name:

LCD LED Display Front Screen Bezel

Compatible model:

Air 13" A1369 A1466

Product condition:

New and original parts

Compatible order NO.:

A1369 Late 2010 (MC503, MC504)

A1369 Mid 2011 (MC956, MC966)

A1466 Mid 2012 (MD231, MD232)

A1466 Mid 2013 (MD760(LL/A), MD761(LL/A))

A1466 Early 2014 (MD760(LL/B), MD761(LL/B))

Compatible EMC NO.:

2392, 2469, 2559, 2632

Content: 1pcs screen front bezel, not LCD Screen, Show as the real picture.

CH003477
€19.77

MacBook Air 13.3 Screen Bezel 604-3991-A A1369 A1466 Frame Rahmen Front Display B cover

BD82NM70 ALJTA Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000567
€5.40

BD82NM70 ALJTA Stencil Template

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Compare

21508390x9090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000577
€9.97

215-0839097 Stencil Template 90*90

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Apple BIOS MBP15 2013 A1398 8203787 EMC2745

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003341
€30.71

Apple BIOS MBP15 2013 A1398 820-3787 EMC2745

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GFGO7600HNA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000578
€5.40

GF-GO7600-H-N-A2 Stencil Template

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GENUINE IPHONE 6 PLUS 55 LCD SCREEN FPC PLUG CONNECTOR PART FOR LOGIC BOARD

LCD Display Screen FPC Connector

Brand New, High Quality.

Replacement LCD Screen Connector

Replacement for a broken / Non-Functional Button

Compatible with Apple iPhone 6 Plus

Compatible Model No. A1522 / A1524 / A1593

Package Included:

1 x Replacement LCD Display Screen Connector for iPhone 6 Plus

CH003342
€4.97

GENUINE IPHONE 6 PLUS 5.5 LCD SCREEN FPC PLUG CONNECTOR PART FOR LOGIC BOARD

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N13PGTWA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000588
€5.40

N13P-GT-W-A2 Stencil Template

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Apple BIOS MacMini 2011 A1347 8202993 EMC2442

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003378
€30.71

Apple BIOS MacMini 2011 A1347 820-2993 EMC2442

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Compare

GM204650KDA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000597
€7.46

GM204-650-KD-A1 Stencil Template

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DCin Board Socket Jack Cable For Macbook Pro 15 Retina A1398 20122015

DC-in Board Socket Jack Cable For Macbook Pro 15" Retina A1398 2012-2015

Product Condition: New

Compatible Models:

Macbook Pro 15" Retina A1398 2012-2015

Package Include:

1 X DC Power Jack

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003438
€12.31

DC-in Board Socket Jack Cable For Macbook Pro 15 Retina A1398 2012-2015

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MacBook Air 133 Screen Bezel 6043991A A1369 A1466 Frame Rahmen Front Display B cover

Product name:

LCD LED Display Front Screen Bezel

Compatible model:

Air 13" A1369 A1466

Product condition:

New and original parts

Compatible order NO.:

A1369 Late 2010 (MC503, MC504)

A1369 Mid 2011 (MC956, MC966)

A1466 Mid 2012 (MD231, MD232)

A1466 Mid 2013 (MD760(LL/A), MD761(LL/A))

A1466 Early 2014 (MD760(LL/B), MD761(LL/B))

Compatible EMC NO.:

2392, 2469, 2559, 2632

Content: 1pcs screen front bezel, not LCD Screen, Show as the real picture.

CH003477
€19.77

MacBook Air 13.3 Screen Bezel 604-3991-A A1369 A1466 Frame Rahmen Front Display B cover

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