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  • Categories: BGA Reballing Kits, Stencils
  • Categories: Bios Chip Programming
  • Categories: Programmer Spare Part

A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i7 I73540M BTOCTO

PO000085
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i7 I7-3540M BTO/CTO

GL82CM236 SR2CE Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000601
€9.97

GL82CM236 SR2CE Stencil Template 90*90

A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i5 I53230M ME662LLA

PO000086
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i5 I5-3230M ME662LL/A

V527A184SR2EZ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000605
€9.97

V527A184SR2EZ Stencil Template 90*90

A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i7 I73540M BTOCTO

PO000087
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i7 I7-3540M BTO/CTO

i77500U SR341 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000609
€9.97

i7-7500U SR341 Stencil Template 90*90

EME300GBB22GV Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000622
€7.46

EME300GBB22GV Stencil Template

A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I54258U ME864LLA

PO000088
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I5-4258U ME864LL/A

i56260U SR2JC Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000624
€4.35

i5-6260U SR2JC Stencil Template

A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I54288U ME866LLA

PO000089
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I5-4288U ME866LL/A

N13EGTWA2 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000628
€9.97

N13E-GT-W-A2 Stencil Template 90*90

A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i7 I74558U ME867LLA

PO000090
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i7 I7-4558U ME867LL/A

  • -20%

A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i7 I73540M BTOCTO

PO000085
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i7 I7-3540M BTO/CTO

GL82CM236 SR2CE Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000601
€9.97

GL82CM236 SR2CE Stencil Template 90*90

  • -20%

A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i5 I53230M ME662LLA

PO000086
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i5 I5-3230M ME662LL/A

V527A184SR2EZ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000605
€9.97

V527A184SR2EZ Stencil Template 90*90

  • -20%

A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i7 I73540M BTOCTO

PO000087
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i7 I7-3540M BTO/CTO

i77500U SR341 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000609
€9.97

i7-7500U SR341 Stencil Template 90*90

EME300GBB22GV Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000622
€7.46

EME300GBB22GV Stencil Template

  • -20%

A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I54258U ME864LLA

PO000088
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I5-4258U ME864LL/A

i56260U SR2JC Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000624
€4.35

i5-6260U SR2JC Stencil Template

  • -20%

A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I54288U ME866LLA

PO000089
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I5-4288U ME866LL/A

N13EGTWA2 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000628
€9.97

N13E-GT-W-A2 Stencil Template 90*90

  • -20%

A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i7 I74558U ME867LLA

PO000090
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i7 I7-4558U ME867LL/A