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  • Categories: BGA Reballing Kits, Stencils
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21607290x9090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000631
€9.97

216-0729051 Stencil Template 90*90

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TMZL6250AX5DY Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000662
€5.40

TMZL6250AX5DY Stencil Template

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A1502 EMC 2678 Bios Chip EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I54288U ME866LLA

PO000092
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I5-4288U ME866LL/A

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N13PLPA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000665
€5.40

N13P-LP-A2 Stencil Template

  • -20%
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A1502 EMC 2678 Bios Chip EFI Firmware 820-3476 Retina Late 2013 13 Core i7 I74558U ME867LLA

PO000093
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3476 Retina Late 2013 13 Core i7 I7-4558U ME867LL/A

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i32375M SR0U4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000667
€5.40

i3-2375M SR0U4 Stencil Template

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FH82QM370 SR40D Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000668
€9.95

FH82QM370 SR40D Stencil Template 90*90

  • -20%
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A1502 EMC 2875 Bios Chip EFI Firmware 820-4924 Retina Mid2014 13 Core i5 I54308U MGX92LLA

PO000095
€18.00 €22.50

A1502 EMC 2875 Bios EFI Firmware 820-4924 Retina Mid-2014 13 Core i5 I5-4308U MGX92LL/A

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A1502 EMC 2875 Bios Chip EFI Firmware 820-4924 Retina Mid2014 13 Core i7 I74578U MGXD2LLA

PO000096
€18.00 €22.50

A1502 EMC 2875 Bios EFI Firmware 820-4924 Retina Mid-2014 13 Core i7 I7-4578U MGXD2LL/A

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SR2W8 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000671
€9.97

SR2W8 Stencil Template 90*90

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GF110375A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000675
€5.59

GF110-375-A1 Stencil Template

  • -20%
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A1502 EMC 2835 Bios Chip EFI Firmware 820-4924 Retina Early 2015 13 Core i5 I55257U MF839LLA

PO000097
€18.00 €22.50

A1502 EMC 2835 Bios EFI Firmware 820-4924 Retina Early 2015 13 Core i5 I5-5257U MF839LL/A

21607290x9090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000631
€9.97

216-0729051 Stencil Template 90*90

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Compare

TMZL6250AX5DY Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000662
€5.40

TMZL6250AX5DY Stencil Template

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Compare
  • -20%

A1502 EMC 2678 Bios Chip EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I54288U ME866LLA

PO000092
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I5-4288U ME866LL/A

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N13PLPA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000665
€5.40

N13P-LP-A2 Stencil Template

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Compare
  • -20%

A1502 EMC 2678 Bios Chip EFI Firmware 820-3476 Retina Late 2013 13 Core i7 I74558U ME867LLA

PO000093
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3476 Retina Late 2013 13 Core i7 I7-4558U ME867LL/A

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i32375M SR0U4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000667
€5.40

i3-2375M SR0U4 Stencil Template

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Compare

FH82QM370 SR40D Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000668
€9.95

FH82QM370 SR40D Stencil Template 90*90

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Compare
  • -20%

A1502 EMC 2875 Bios Chip EFI Firmware 820-4924 Retina Mid2014 13 Core i5 I54308U MGX92LLA

PO000095
€18.00 €22.50

A1502 EMC 2875 Bios EFI Firmware 820-4924 Retina Mid-2014 13 Core i5 I5-4308U MGX92LL/A

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  • -20%

A1502 EMC 2875 Bios Chip EFI Firmware 820-4924 Retina Mid2014 13 Core i7 I74578U MGXD2LLA

PO000096
€18.00 €22.50

A1502 EMC 2875 Bios EFI Firmware 820-4924 Retina Mid-2014 13 Core i7 I7-4578U MGXD2LL/A

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SR2W8 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000671
€9.97

SR2W8 Stencil Template 90*90

wishlist
Compare

GF110375A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000675
€5.59

GF110-375-A1 Stencil Template

wishlist
Compare
  • -20%

A1502 EMC 2835 Bios Chip EFI Firmware 820-4924 Retina Early 2015 13 Core i5 I55257U MF839LLA

PO000097
€18.00 €22.50

A1502 EMC 2835 Bios EFI Firmware 820-4924 Retina Early 2015 13 Core i5 I5-5257U MF839LL/A

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