• Show Sidebar

There are 713 products.

Active filters

  • Categories: Bios Chip Programming
  • Categories: CPU and Graphic Chips
  • Categories: Car Service Equipment
  • Categories: Pin Holder
wishlist
Compare
Quickview

N10PGV2C1

N10P-GV2-C1

Part Number N10P-GV2-C1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001310
€25.93

N10P-GV2-C1

  • -20%
wishlist
Compare
Quickview

A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I54258U ME864LLA

PO000088
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I5-4258U ME864LL/A

wishlist
Compare
Quickview

2160835063

216-0835063

Part Number 216-0835063 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001312
€60.95

216-0835063

  • -20%
wishlist
Compare
Quickview

A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I54288U ME866LLA

PO000089
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I5-4288U ME866LL/A

wishlist
Compare
Quickview

BD82HM76 SLJ8E

BD82HM76 SLJ8E

Part Number BD82HM76 SLJ8E Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1324

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001326
€45.95

BD82HM76 SLJ8E

  • -20%
wishlist
Compare
Quickview

A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i7 I74558U ME867LLA

PO000090
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i7 I7-4558U ME867LL/A

wishlist
Compare
Quickview

2160810001 HD6770

216-0810001 HD6770

Part Number 216-0810001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 360 Description Refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001356
€31.35

216-0810001 HD6770

wishlist
Compare
Quickview

MCP79MVLB2

MCP79MVL-B2

Part Number MCP79MVL-B2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001359
€25.93

MCP79MVL-B2

  • -20%
wishlist
Compare
Quickview

A1502 EMC 2678 Bios Chip EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I54288U ME866LLA

PO000092
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I5-4288U ME866LL/A

wishlist
Compare
Quickview

SR32Q i77700HQ

SR32Q i7-7700HQ

Part Number i7-7700HQ SR32Q Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1440 Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001372
€205.13

SR32Q i7-7700HQ

  • -20%
wishlist
Compare
Quickview

A1502 EMC 2678 Bios Chip EFI Firmware 820-3476 Retina Late 2013 13 Core i7 I74558U ME867LLA

PO000093
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3476 Retina Late 2013 13 Core i7 I7-4558U ME867LL/A

wishlist
Compare
Quickview

SR0HR

SR0HR

Part Number SR0HR Manufacturer INTEL

Socket Type rPGA988B Date Code 13+

Package/Case 1 PCS Description Brand new

SR0HR FF8062700848702 B830 Mobile Celeron Dual-Core 1.8 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001381
€10.50

SR0HR

N10PGV2C1

N10P-GV2-C1

Part Number N10P-GV2-C1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001310
€25.93

N10P-GV2-C1

wishlist
Compare
  • -20%

A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I54258U ME864LLA

PO000088
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I5-4258U ME864LL/A

wishlist
Compare

2160835063

216-0835063

Part Number 216-0835063 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001312
€60.95

216-0835063

wishlist
Compare
  • -20%

A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I54288U ME866LLA

PO000089
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I5-4288U ME866LL/A

wishlist
Compare

BD82HM76 SLJ8E

BD82HM76 SLJ8E

Part Number BD82HM76 SLJ8E Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1324

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001326
€45.95

BD82HM76 SLJ8E

wishlist
Compare
  • -20%

A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i7 I74558U ME867LLA

PO000090
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i7 I7-4558U ME867LL/A

wishlist
Compare

2160810001 HD6770

216-0810001 HD6770

Part Number 216-0810001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 360 Description Refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001356
€31.35

216-0810001 HD6770

wishlist
Compare

MCP79MVLB2

MCP79MVL-B2

Part Number MCP79MVL-B2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001359
€25.93

MCP79MVL-B2

wishlist
Compare
  • -20%

A1502 EMC 2678 Bios Chip EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I54288U ME866LLA

PO000092
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I5-4288U ME866LL/A

wishlist
Compare

SR32Q i77700HQ

SR32Q i7-7700HQ

Part Number i7-7700HQ SR32Q Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1440 Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001372
€205.13

SR32Q i7-7700HQ

wishlist
Compare
  • -20%

A1502 EMC 2678 Bios Chip EFI Firmware 820-3476 Retina Late 2013 13 Core i7 I74558U ME867LLA

PO000093
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3476 Retina Late 2013 13 Core i7 I7-4558U ME867LL/A

wishlist
Compare

SR0HR

SR0HR

Part Number SR0HR Manufacturer INTEL

Socket Type rPGA988B Date Code 13+

Package/Case 1 PCS Description Brand new

SR0HR FF8062700848702 B830 Mobile Celeron Dual-Core 1.8 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001381
€10.50

SR0HR

wishlist
Compare
Back to top