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  • Categories: Bios Chip Programming
  • Categories: EFI Rom Cable
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A1466 EMC 2925 Bios Chip EFI Firmware 820-00165 Early 2015 Core i5 I55250U MJVE2LLA

PO000066
€18.00 €22.50

A1466 EMC 2925 Bios EFI Firmware 820-00165 Early 2015 Core i5 I5-5250U MJVE2LL/A

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Intersil ISL6235

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000536
€3.45

Intersil ISL6235

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A1466 EMC 2925 Bios Chip EFI Firmware 820-00165 Early 2015 Core i7 I75650U BTOCTO

PO000067
€18.00 €22.50

A1466 EMC 2925 Bios EFI Firmware 820-00165 Early 2015 Core i7 I7-5650U BTO/CTO

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A1466 EMC 3178 Bios Chip EFI Firmware 820-00165 13inch 2017 Core i5 I55350U MQD32LLA

PO000068
€18.00 €22.50

A1466 EMC 3178 Bios EFI Firmware 820-00165 13-inch, 2017 Core i5 I5-5350U MQD32LL/A

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RICHTEK RT8167B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000538
€3.45

RICHTEK RT8167B

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Diodes APL3510BXI TRG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000542
€3.45

Diodes APL3510BXI TRG

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A1278 EMC 2326 Bios Chip EFI Firmware 820-2530 Mid2009 13 Core 2 Duo P7550 MB990LLA

PO000070
€18.00 €22.50

A1278 EMC 2326 Bios EFI Firmware 820-2530 Mid-2009 13 Core 2 Duo P7550 MB990LL/A

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Realtek RTL8100CL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000546
€3.45

Realtek RTL8100CL

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ITE IT8572E AXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000547
€3.45

ITE IT8572E AXS

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88E1145BBM MARVELL

88E1145-BBM MARVELL

Part Number 88E1145-BBM Manufacturer MARVELL

BGA Alloy No Pb/Lead Free Date Code 07+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000549
€10.33

88E1145-BBM MARVELL

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A1278 EMC 2351 Bios Chip EFI Firmware 820-2879 Mid2010 13 Core 2 Duo P8600 MC374LLA

PO000072
€18.00 €22.50

A1278 EMC 2351 Bios EFI Firmware 820-2879 Mid-2010 13 Core 2 Duo P8600 MC374LL/A

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Realtek RTD2045L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000558
€3.45

Realtek RTD2045L

  • -20%

A1466 EMC 2925 Bios Chip EFI Firmware 820-00165 Early 2015 Core i5 I55250U MJVE2LLA

PO000066
€18.00 €22.50

A1466 EMC 2925 Bios EFI Firmware 820-00165 Early 2015 Core i5 I5-5250U MJVE2LL/A

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Intersil ISL6235

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000536
€3.45

Intersil ISL6235

wishlist
Compare
  • -20%

A1466 EMC 2925 Bios Chip EFI Firmware 820-00165 Early 2015 Core i7 I75650U BTOCTO

PO000067
€18.00 €22.50

A1466 EMC 2925 Bios EFI Firmware 820-00165 Early 2015 Core i7 I7-5650U BTO/CTO

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  • -20%

A1466 EMC 3178 Bios Chip EFI Firmware 820-00165 13inch 2017 Core i5 I55350U MQD32LLA

PO000068
€18.00 €22.50

A1466 EMC 3178 Bios EFI Firmware 820-00165 13-inch, 2017 Core i5 I5-5350U MQD32LL/A

wishlist
Compare

RICHTEK RT8167B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000538
€3.45

RICHTEK RT8167B

wishlist
Compare

Diodes APL3510BXI TRG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000542
€3.45

Diodes APL3510BXI TRG

wishlist
Compare
  • -20%

A1278 EMC 2326 Bios Chip EFI Firmware 820-2530 Mid2009 13 Core 2 Duo P7550 MB990LLA

PO000070
€18.00 €22.50

A1278 EMC 2326 Bios EFI Firmware 820-2530 Mid-2009 13 Core 2 Duo P7550 MB990LL/A

wishlist
Compare

Realtek RTL8100CL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000546
€3.45

Realtek RTL8100CL

wishlist
Compare

ITE IT8572E AXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000547
€3.45

ITE IT8572E AXS

wishlist
Compare

88E1145BBM MARVELL

88E1145-BBM MARVELL

Part Number 88E1145-BBM Manufacturer MARVELL

BGA Alloy No Pb/Lead Free Date Code 07+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000549
€10.33

88E1145-BBM MARVELL

wishlist
Compare
  • -20%

A1278 EMC 2351 Bios Chip EFI Firmware 820-2879 Mid2010 13 Core 2 Duo P8600 MC374LLA

PO000072
€18.00 €22.50

A1278 EMC 2351 Bios EFI Firmware 820-2879 Mid-2010 13 Core 2 Duo P8600 MC374LL/A

wishlist
Compare

Realtek RTD2045L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000558
€3.45

Realtek RTD2045L

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Compare
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