Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Fujitsu Lifebook DC Power Jack Connector: S2000, S2010, S2020, S5582, S6110, S6120, S6240

Sony DC Power Jack Connector: PCG-731

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Compatible model:

FOR Lenovo IdeaPad Flex 2-15D F15M HIGH-TEK (KW2) 5C10G00126, # VJ-24

Item includes:

1 X DC Power Jack

HP ZV6000 Series DC Power Jack Connector: ZV6000 CTO, ZV6000, ZV6001XX, ZV6002XX, ZV6003XX, ZV6004EA, ZV6004XX, ZV6005US, ZV6006EA, ZV6007US, ZV6008CL, ZV6009EA, ZV6009US, ZV6010EA, ZV6010US, ZV6011EA, ZV6013EA, ZV6015US, ZV6017EA, ZV6020EA, ZV6024EA, ZV6025EA, ZV6026EA, ZV6027EA, ZV6028EA, ZV6029EA, ZV6061EA, ZV6062EA, ZV6064EA, ZV6065EA, ZV6066EA, ZV6067EA, ZV6068EA, ZV6069EA, ZV6090EA, ZV6100 CTO, ZV6100, ZV6107WM, ZV6114EA, ZV6115EA, ZV6116EA, ZV6117EA, ZV6118EA, ZV6120EA, ZV6123CL, ZV6125CL, ZV6126EA, ZV6127EA, ZV6128EA, ZV6129EA, ZV6130EA, ZV6130US, ZV6131EA, ZV6131US, ZV6147EA, ZV6148EA, ZV6149EA, ZV6150EA, ZV6151EA, ZV6152EA, ZV6153EA, ZV6156EA, ZV6158EA, ZV6159EA, ZV6170CA, ZV6170US, ZV6174EA, ZV6179EA, ZV6180EA, ZV6181EA, ZV6195EA, ZV6196EA, ZV6201CL, ZV6201EA, ZV6203CL, ZV6209US, ZV6211EA, ZV6212EA, ZV6213EA, ZV6214EA, ZV6215EA, ZV6216EA, ZV6217EA, ZV6218EA, ZV6220EA, ZV6223CL, ZV6230CA, ZV6233NR, ZV6242EA, ZV6243EA, ZV6244EA, ZV6245EA, ZV6246EA, ZV6247EA, ZV6248EA, ZV6249EA, ZV6250EA, ZV6251EA, ZV6252EA, ZV6253EA, ZV6254EA, ZV6255EA, ZV6270CA, ZV6270US, ZV6273EA, ZV6274EA, ZV6275EA, ZV6276EA, ZV6278EA, ZV6279EA, ZV6295EA, ZV6296EA, ZV6302US

HP ZD8000 Series DC Power Jack Connector: ZD8000 CTO, ZD8001AP, ZD8001XX, ZD8002AP, ZD8002XX, ZD8003AP, ZD8003XX, ZD8004AP, ZD8004XX, ZD8005AP, ZD8007EA, ZD8008EA, ZD8009EA, ZD8010EA, ZD8010XX, ZD8011XX, ZD8015EA, ZD8017EA, ZD8019EA, ZD8020EA, ZD8030EA, ZD8043EA, ZD8044EA, ZD8045EA, ZD8047EA, ZD8048EA, ZD8050EA, ZD8050LA, ZD8050XX, ZD8051EA, ZD8052EA, ZD8053EA, ZD8054EA, ZD8055US, ZD8060CA, ZD8060US, ZD8070EA, ZD8072EA, ZD8075EA, ZD8076EA, ZD8077EA, ZD8078EA, ZD8079EA, ZD8080EA, ZD8080us, ZD8100 CTO, ZD8105CA, ZD8105EA, ZD8110EA, ZD8110US, ZD8112EA, ZD8115EA, ZD8115US, ZD8120CL, ZD8120EA, ZD8122EA, ZD8123EA, ZD8124EA, ZD8125CL, ZD8125EA, ZD8126EA, ZD8127EA, ZD8129EA, ZD8130EA, ZD8135EA, ZD8139EA, ZD8147EA, ZD8148EA, ZD8150EA, ZD8151EA, ZD8155EA, ZD8156EA, ZD8157EA, ZD8158EA, ZD8159EA, ZD8160EA, ZD8162EA, ZD8179EA, ZD8180EA, ZD8181EA, ZD8182EA, ZD8183EA, ZD8184EA, ZD8185EA, ZD82xxus, ZD8200 CTO, ZD8201AP, ZD8202AP, ZD8203AP, ZD8204AP, ZD8205TU, ZD8205US, ZD8210CA, ZD8214EA, ZD8215US, ZD8217EA, ZD8218EA, ZD8219EA, ZD8220us, ZD8223EA, ZD8224EA, ZD8225CA, ZD8225EA, ZD8226EA, ZD8227EA, ZD8228EA, ZD8229EA, ZD8230EA, ZD8230us, ZD8231EA, ZD8234EA, ZD8235EA, ZD8237EA, ZD8238EA, ZD8239EA, ZD8245EA, ZD8250LA, ZD8251EA, ZD8252EA, ZD8253EA, ZD8254EA, ZD8255EA, ZD8256EA, ZD8270EA, ZD8280EA, ZD8289EA, ZD8290EA, ZD8291EA, ZD8301EA, ZD8302EA, ZD8303EA, ZD8304EA, ZD8305EA, ZD8306EA, ZD8307EA, ZD8308EA, ZD8315CA, ZD8315EA, ZD8316EA, ZD8317EA, ZD8318EA, ZD8319EA, ZD8320EA, ZD8323EA, ZD8325EA, ZD8333CL, ZD8342EA, ZD8350LA, ZD8367EA, ZD8368EA, ZD8369EA, ZD8388EA, ZD8389EA, ZD8390EA, ZD8398EA, ZD8399EA, ZD8399xx, ZD8401EA, ZD8410EA, ZD8430CA, ZD8460EA, ZD8480EA, ZD8490EA

HP/Compaq Business Notebook DC Power Jack Connector: NX9600 Series

Compaq Presario X6000 Series DC Power Jack Connector: X6000 CTO, X6001XX, X6002XX, X6003XX, X6050CA, X6050US, X6070US, X6100 CTO, X6105CL, X6110US, X6125CL

Compaq Presario R4000 Series DC Power Jack Connector: R4000 CTO, R4000, R4001XX, R4002XX, R4003EA, R4003XX, R4005EA, R4006EA, R4009EA, R4010CA, R4010US, R4012EA, R4012US, R4015EA, R4016EA, R4017EA, R4024EA, R4025CA, R4025EA, R4025US, R4026EA, R4028EA, R4029EA, R4030EA, R4031EA, R4035CA, R4060EA, R4065EA, R4075EA, R4207EA, R4221EA, R4100 CTO, R4114EA, R4115EA, R4115US, R4125CA, R4125EA, R4125US, R4126EA, R4127EA, R4127US, R4130EA, R4145EA, R4146EA, R4150EA, R4155EA, R4157EA, R4205EA, R4206EA, R4208EA, R4209EA, R4218EA, R4219EA, R4220EA, R4222EA, R4225CA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Micro USB 3.0 A Type SMT Female Socket Connector for Hard Disk Drives Data Interface

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SMD muRata GRM31 series: * SMD muRata GRM31 series

1206 SMD capacitors

Japanese muRata (Murata) GRM31 series

80 models, 25 for each, 2000 in total. Products list:

Description:

Condition: Brand New

Warranty: 6 months

Compatible with: Dell Inspiron 15-7000 15-7579 15-7558 15-7568 11 3148 JDX1R 0JDX1R

Package content:

1 DC Jack

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock