• Show Sidebar

There are 1762 products.

Active filters

  • Categories: BGA Reballing Kits, Stencils
  • Categories: Laptop Parts, Repair tool
  • Categories: Laptop used parts, scrap parts

N13EGTWA2 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000628
€9.97

N13E-GT-W-A2 Stencil Template 90*90

21607290x9090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000631
€9.97

216-0729051 Stencil Template 90*90

TMZL6250AX5DY Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000662
€5.40

TMZL6250AX5DY Stencil Template

N13PLPA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000665
€5.40

N13P-LP-A2 Stencil Template

i32375M SR0U4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000667
€5.40

i3-2375M SR0U4 Stencil Template

HAYEAR MINi 16MP Electronic Video Stereo Digital USB Industrial Microscope Camera 150X Cmount Lens Stand

This is mainly a hdmi camera, if you need it get higher image quality for usb output pls choose the professional usb camera or contact us before place the order so we will give you some suggestion.

For USB output, the white balance, exposure and color adjustment are automatic, they can't be adjusted.

Specification:

Image sensor: SONY CMOS 1/2.9

Pexil size: 2.85 2.85m

Video output: full hd 1080p ( via HDMI), 720P( via USB)

Image resolution: 4608*3456( via HDMI)

Video recording: 1080p ( via HDMI )

Image format: jpeg

Lens: C/CS

Resolution:1920*1080@30fos, 720p 160@fps

TF card interface: max 64G

Pc support: windows XP/7/8/10 system, HAYEAR measure software ( gift )

Digital zoom: 4 times digital zoom

Language: English, Chinese, Japanese, French, Germany, Italy, Korean, Turkey, Russia

Camera dimension: 50mm*50mm*43mm

Package dimension:16cm*10cm*8cm / 0.3kg

Supply USB2.0,HDMI HD video,Two output ports

We sell much to the industry factory, they can see the problems directly in the Monitor via the camera.

C-MOUNT Lens:

Zoom c-mount Lens

Magnification Power by 0.12 - 2X (about 8 - 120X on the display)

Work distance:55mm-200mm

Visual field :2.4mm-32mm

Size: 115mm(L) * 40mm(DIA)

Package Including:

1 x 16 MP Camera

1 x power supply

1 x USB line

1 x HDMI line

1 x Software DISC

1 x 120x Zoom C-mount Lens

1 x Camera Stand

CH000898
€141.73

HAYEAR MINi 16MP Electronic Video Stereo Digital USB Industrial Microscope Camera 150X C-mount Lens Stand

FH82QM370 SR40D Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000668
€9.95

FH82QM370 SR40D Stencil Template 90*90

N13EGTWA2 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000628
€9.97

N13E-GT-W-A2 Stencil Template 90*90

21607290x9090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000631
€9.97

216-0729051 Stencil Template 90*90

TMZL6250AX5DY Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000662
€5.40

TMZL6250AX5DY Stencil Template

N13PLPA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000665
€5.40

N13P-LP-A2 Stencil Template

i32375M SR0U4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000667
€5.40

i3-2375M SR0U4 Stencil Template

HAYEAR MINi 16MP Electronic Video Stereo Digital USB Industrial Microscope Camera 150X Cmount Lens Stand

This is mainly a hdmi camera, if you need it get higher image quality for usb output pls choose the professional usb camera or contact us before place the order so we will give you some suggestion.

For USB output, the white balance, exposure and color adjustment are automatic, they can't be adjusted.

Specification:

Image sensor: SONY CMOS 1/2.9

Pexil size: 2.85 2.85m

Video output: full hd 1080p ( via HDMI), 720P( via USB)

Image resolution: 4608*3456( via HDMI)

Video recording: 1080p ( via HDMI )

Image format: jpeg

Lens: C/CS

Resolution:1920*1080@30fos, 720p 160@fps

TF card interface: max 64G

Pc support: windows XP/7/8/10 system, HAYEAR measure software ( gift )

Digital zoom: 4 times digital zoom

Language: English, Chinese, Japanese, French, Germany, Italy, Korean, Turkey, Russia

Camera dimension: 50mm*50mm*43mm

Package dimension:16cm*10cm*8cm / 0.3kg

Supply USB2.0,HDMI HD video,Two output ports

We sell much to the industry factory, they can see the problems directly in the Monitor via the camera.

C-MOUNT Lens:

Zoom c-mount Lens

Magnification Power by 0.12 - 2X (about 8 - 120X on the display)

Work distance:55mm-200mm

Visual field :2.4mm-32mm

Size: 115mm(L) * 40mm(DIA)

Package Including:

1 x 16 MP Camera

1 x power supply

1 x USB line

1 x HDMI line

1 x Software DISC

1 x 120x Zoom C-mount Lens

1 x Camera Stand

CH000898
€141.73

HAYEAR MINi 16MP Electronic Video Stereo Digital USB Industrial Microscope Camera 150X C-mount Lens Stand

FH82QM370 SR40D Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000668
€9.95

FH82QM370 SR40D Stencil Template 90*90