216-0841009 HD8690M

Part Number 216-0841009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+ 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel

Gauge Evaluator

Login to Download: * EV2300a Device Driver Installer Multilanguage

Model No: EV2300 HPA002

Included:

1 x Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel Gauge Evaluator

Description:

The EV2300 is a USB-based interface board for a PC that can be used to evaluate battery fuel gauge circuits designed with Texas Instruments' ICs. The EV2300 has connections on it for a USB cable and also accepts inputs from a battery fuel gauge circuit's communication port (SMBus or HDQ). By running the appropriate PC software for the correspondingfuel gauge IC, the EV2300 interface board allows the user to evaluate the battery fuel gauge circuit. Note: The driver on this page is for 32 bit Windows. See the 64 bit driver e2e post for 64 bit Windows 7 driver information.

Feature:

USB-based interface board for evaluation of battery fuel gauge circuits developed with fuel gauge ICs using the HDQ and SMBus communication protocol

Provides interface between intelligent battery circuit and a Windows-based PC

Connects to the USB port of a PC

Allows for on screen display and programming of gas gauge register functions when used with the appropriate PC software

DX3003 Adapter for XELTEK SuperPro 6100N

216-0674008

Part Number 216-0674008 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 07+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

XGecu T56 Universal Programmer Support NAND/EMMC/MCU/ISP

Login to Download: Download software Device Support List instruction manual

Programmer Overview

1.1 Performance Introduction

Carefully built low-cost professional programmer, high-density chip production process, a

unified user interface, easy to use, functional integrity, application software, reliable

operation, code small, faster execution. supported operating system:

WINXP WIN2003 WIN2008 VISTA WIN7 WIN8 WIN10 32-bit or 64-bit operating system

? The programming speed is greatly improved. It is suitable for small batch production and supports 4 programmers for one computer.

? A wide range of chip support, the initial version supports the chip 15000+, supports a variety of 24 25 26 27 28 29 37 39 49 50 series of serial and parallel memory chips, microcontroller 51 series, ATMEL AVR ATMEGA AT90 series, MICROCHIP PIC10 PIC12 PIC16 PIC18 series microcontroller , GAL programmable logic device programming, SRAM test, 54/74 and CMOS4000 integrated circuit integrated functional test.

Support NAND Flash chip, the function is complete and comprehensive, the capacity supports to 8Gbits.

25 series Nor Flash capacity support to 512Mbits.

? Pin contact check function, poor contact pin can pinpoint

? Ultra-low power consumption: the entire programmer uses ultra-low-power chips, using USB interface, the first truly all chip programming

without external power integrated programmer. Portable performance super: the world's smallest volume, size 10CM * 6CM * 2.5CM, only the size of the driver's license.

? Programmable VCC from 1.8V to 6.5V, VPP from 1.8V to 18V chip

? Chip serial number secondary development functions: Programmer built a variety of commonly used automatic numbering function. And can use a custom algorithm to achieve any sequence number through DLL dynamic library. This feature allows you to produce

a unique identification info rmation for each chip in mass production. The logo can also be encrypted with a custom algorithm to more effectively protect your product's rights.

? Universal serial programming interface ICSP (to support both high-voltage parallel programming and low-volt age serial programming). Note: ICSP now supports 24-Series 25 Series 93 Series Serial Integrated Circuits, ATMEL89S51,52, AVR ATMEGAxxx Full

Series, and MICROCHIP PIC10Fxxx 12Fxxx 16Fxxx 18Fxxx Full Series, and the new series of SYNCMOS SM59Dxx SM59Rxx fu ll range chips for in-circuit serial programming.

? Powerful 54 / 74F / LS / HC CMOS4000 Series Integrated Functionality Tests: The First Development Programmer to Test Common Logic ICs True, Test Errors Locating Logic Gate Circuits, Test Arbitrary Possible input combinations.

1.2 Programmer chip support range

? Variety of 26 27 28 29 37 39 49 50 series of parallel ROM, EPROM, EEPROM

Fast, full support. Support TSOP32 TSOP40 TSOP48 chips to 64MBits, will join the TSOP56 pin support.

(TL866II programming voltage VPP only supports up to 18V, for early 27C series ROM, the

chip with 21V 25V VPP voltage no longer supports writing, but can be read. If it is used,

the VPP with the same type of programming voltage can be used as 13V or 12V chip replacement, for example: 27C32 21V or 13V Vpp chip,Pay attention to the VPP voltage)

? 24 25 35 45 85 93 95 Series Serial EEPROM

Serial Series Chip Support Full, Supports Chip Capacity 25 Series 8 or 16PIN to 512MBits (64M Bytes)

? NAND FLASH chip supports up to 8Gbits

? MCU series, hundreds of models of 51 series of microcomputer

? AVR microcontroller package scratch ATMEGA series ATtiny series AT90XXX series of microcontrollers, all AVR ATMEGAxxx chip also supports the ICSP interface for SPI serial download programming. Support AVR one-to-one soft-key with RC correction byte.

? MICROCHIP PIC10 PIC12 PIC16 PIC18 Series Microcontroller:

PIC series of more than 300 models, more than 900 package chip support, currently supports

one of the most complete PIC chip integrated programmer. For vario

us types of PIC monolithic, in strict accordance with the manufacturer's manual requirements, the optimal programming, programming speed is excellent. The vast majority of chips support both ISCP online programming and programming through programming sockets.

? GAL programmable logic device programming

? SRAM test

Support for common 24 61 62 DS12 series SRAM test, respectively, to data line testing,

address line testing, memory unit incremental testing and unit testing.

? Super performance 54 / 74F / LS / HC CMO

S4000 series integrated circuit integrated

Function test:

The first development-type programmer to really test common logic ICs to test for errors

that can be located to logic gates, and to test any possible combinations of inputs in an integrated circuit when testing.

N10P-GV2-C1

Part Number N10P-GV2-C1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Description:

LA1010 is a logic analyzer product with high cost performance. It has 16 input channels and the sample rate is up to 100MHz.

Along with the PC software KingstVIS, 16 channels of digital signal could be sampled at the same time, and then they could be

converted to digital waveform and displayed on the PC screen. The signal could be analyzed with many standard protocols,

to get more straightforward communication data. It helps a lot in testing and analyzing digital system(MCU/ARM/FPGA, etc.),

developing and debugging several communication programs, or monitoring and recording some digital signals for a long time.

Software and user manual: http://www.kingst.org/download/?fl=vis.zip

Features:

Portable and lightweight

Max sampling rate: 100M@3channels, 50M@6channels, 32M@9channels, 16M@16channels

Large sampling depth and support compression

The built-in PWM generator

Compatible USB2.0/3.0 interface

Powerful software and easy to use

Support online upgrade automatically

Specifications:

Input channels number: 16

Max sampling rate: 100M

Measurement bandwidth: 20M

Min pulse width can be captured: 20ns

Max sampling depth: 10G/channel

Input voltage range: -50V ~ +50V

Input impedance: 220KO, 12pF

Adjustable threshold voltage: -4V ~ +4V, step: 0.01V

PWM channels number: 2

PWM frequency range: 0.1 ~ 10MHz

PWM frequency adjust step: 10ns

PWM pulse width adjust step: 10ns

PWM output voltage: +3.3V

PWM output impedance: 50O

Standby current: 100mA

Max operating current: 150mA

Dimensions: 95mm * 55mm * 23mm

Supported OS: Windows XP, Vista, Windows 7/8/10(32/64bit)

Supported standard protocols: UART/RS-232/485, I2C, SPI, CAN, DMX512, HDMI CEC, I2S/PCM, JTAG,

LIN, Manchester, Modbus, 1-Wire, UNI/O, SDIO, SMBus, USB1.1, PS/2, NEC InfraRed, Parallel, etc...

Package included:

1 x LA1010 Host

2 x 9P Flat Cable

1 x 2P Flat Cable

20 x Test Hook

1 x USB Cable

1 x CD

216-0835063

Part Number 216-0835063 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Product use:

The universal programming block and universal test stand are used to write and test the IC chip of QFN32

Applicable package:

MLF32/QFN32, pin spacing 0.5mm; support chip at the bottom of the package with pin function

Test Adapters:

QFN-32 (40) BT-0.5-02

Characteristic:

Draw all PIN from both sides; compatible with 2.54mm universal board; use special long head to support wire or insert user board; test seat belt center pin

Product description:

Pin spacing e (mm): 0.5

Pin: 32

D*E(mm): 5*5

A(mm): 1

BD82HM76 SLJ8E

Part Number BD82HM76 SLJ8E Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1324

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

216-0810001 HD6770

Part Number 216-0810001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 360 Description Refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Packing Include:

1. FFC Line 200MM 0.5mm-32P 1pcs

2. FFC Line 200MM 1.0mm-32P 1pcs

3. FPC Base Under 0.5mm-32P 1pcs

4. FPC Base Under 1.0mm-32P 1pcs