Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N13P-GS-W-KB-A2

Part Number N13P-GS-W-KB-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DC-in Board Socket Jack Cable For Macbook Pro 15" Retina A1398 2012-2015

Product Condition: New

Compatible Models:

Macbook Pro 15" Retina A1398 2012-2015

Package Include:

1 X DC Power Jack

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

216-0841009 HD8690M

Part Number 216-0841009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+ 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Product name:

LCD LED Display Front Screen Bezel

Compatible model:

Air 13" A1369 A1466

Product condition:

New and original parts

Compatible order NO.:

A1369 Late 2010 (MC503, MC504)

A1369 Mid 2011 (MC956, MC966)

A1466 Mid 2012 (MD231, MD232)

A1466 Mid 2013 (MD760(LL/A), MD761(LL/A))

A1466 Early 2014 (MD760(LL/B), MD761(LL/B))

Compatible EMC NO.:

2392, 2469, 2559, 2632

Content: 1pcs screen front bezel, not LCD Screen, Show as the real picture.

216-0674008

Part Number 216-0674008 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 07+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

LED LVDS Screen Cable Connector For MacBook Pro 13 A1278 A1342 2008-2011

Part Number A1278 A1342 Connector Manufacturer Apple

Model 13 A1278 Date Code 2008-2011

Package/Case 1 PCS Description Original new

1.The product only support computer model is 2013 version Apple MacBook Pro retina model is A1398 A1502 (ME864 ME865 ME866 ME293 ME294),

2014 version Apple MacBook Pro retina model is A1502 A1398 (MGX72 MGX82 MGX92 MGXA2 MGXC2),

2015 version Apple MacBook Pro retina model is A1502 A1398(MF839 MF840 MF841 MGXA2 MGXC2),

2013-2014 version Apple MacBook Air model is A1465 A1466(MD711 MD712 MD760 MD761),

2015 version Apple MacBook Air model is A1465 A1466(MJVM2 MJVP2 MJVE2 MJVG2) laptop using SSD.

2.The product only support read data and write data in SSD,not support as the system startup disk.

3.Board Size:(L*W)12.00*10.90cm/4.72"*4.29"

Notice:

1:Only sales adapter card,images of SSD and mainboard is not sales!

2:The computer must have a PCI Express 4x socket,version 2.0 or higher.The motherboard must be Intel 7 series chipset or higher version than 7 Series chipset.

3:Mac OS and some digital camera system use disk format can't compatible with Microsoft system,new SSD if there is no partition,open the "my computer"can't see the ssd, please use the Disk Manager in Windows to delete the partitions or to create a new partition on the SSD.

4:The adapter card and SSD and PCIe slot contact is clean, avoid poor contact.

5:Update your computer BIOS to the latest version

6:This product performance is being improved unceasingly, like has the change, not separate informs

About MacBook Air SSD interface standard:

1: 2010 and 2011 version MacBook Air SSD is 6+12 pin, only one side have contact,size is 109 mm*24 mm.It's SATA interface.

2: 2012 version MacBook Air SSD is 7+17 pin, size is 109 mm*24 mm.2012 version MacBook Pro SSD is 7+17 pin, size is 89 mm*33 mm.It's SATA interface.

3: 2013 and 2014 and 2015 version MacBook Air SSD is both side have contact,one sid is 16+12 pin,the other side is 11+14 pin,size is 89 mm*24 mm.It's PCIe X4 interface.

4: 2013 and 2014 and 2015 version MacBook Pro SSD is both side have contact,one sid is 16+12 pin,the other side is 11+14 pin,size is 89 mm*33 mm.It's PCIe X4 interface.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N10P-GV2-C1

Part Number N10P-GV2-C1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

100% brand new and high quality

Color: As picture showed.

Material: Metal.

Quantity: 10pcs/set

Compatible With:

MacBook Pro 13" A1278 2009 2010 2011 2012

MacBook Pro 15" A1286 2008 2009 2010 2011 2012

MacBook Pro 17" A1297 2009 2010 2011

Package Includes:

10pcs * Bottom Case Screw (3 Long 7 Short)

216-0835063

Part Number 216-0835063 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

BD82HM76 SLJ8E

Part Number BD82HM76 SLJ8E Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1324

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock