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  • Categories: Apple Parts, BIOS EMC, SMC
  • Categories: Other BGA Chips & ICs
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Intersil ISL6236IRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000606
€3.45

Intersil ISL6236IRZ

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gTool iCorner iPhone 5 5S 6 Corner Tool

gTool iCorner iPhone 5 5S 6 Corner Tool

Part Number Corner Tool Manufacturer gTool iCorner

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Original new

iPhone6?iPhone6plus Corner and edge repair

iPhone5?iPhone5S Corner and edge repair

iPad2?iPad3?iPad4 Corner and edge repair

iPad Mini?Mini Ret?iPad Air Corner repair

iPod 4th Corner repair

I52---iPhone5/5S Corner and edge repair

I51---iPhone5/5S Corner and edge repair

IP2---ipad2/3/4 Corner and edge repair

IP1---ipad2/3/4 Corner and edge repair

AM2---ipad mini /ipad Air Corner and edge repair

TH4---ipod Corner and edge repair

I61---iPhone6 Corner and edge repair

I62---iPhone6 PULS Corner and edge repair

P61---iPhone6 Corner and edge repair

P62---iPhone6 PULS Corner and edge repair

CH003604
€57.06

gTool iCorner iPhone 5 5S 6 Corner Tool

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MXIC MX25L1005MC

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000608
€3.45

MXIC MX25L1005MC

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TI TPS51211

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000610
€3.45

TI TPS51211

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Apple BIOS MBP15 2012 A1398 8203332 EMC2512

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003681
€30.71

Apple BIOS MBP15 2012 A1398 820-3332 EMC2512

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Intersil ISL6324ACRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000612
€3.45

Intersil ISL6324ACRZ

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Apple BIOS MBP12 2016 A1534 82000244 EMC2991

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003748
€44.38

Apple BIOS MBP12 2016 A1534 820-00244 EMC2991

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Realtek RTL8211CL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000614
€3.45

Realtek RTL8211CL

Intersil ISL6236IRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000606
€3.45

Intersil ISL6236IRZ

wishlist
Compare

gTool iCorner iPhone 5 5S 6 Corner Tool

gTool iCorner iPhone 5 5S 6 Corner Tool

Part Number Corner Tool Manufacturer gTool iCorner

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Original new

iPhone6?iPhone6plus Corner and edge repair

iPhone5?iPhone5S Corner and edge repair

iPad2?iPad3?iPad4 Corner and edge repair

iPad Mini?Mini Ret?iPad Air Corner repair

iPod 4th Corner repair

I52---iPhone5/5S Corner and edge repair

I51---iPhone5/5S Corner and edge repair

IP2---ipad2/3/4 Corner and edge repair

IP1---ipad2/3/4 Corner and edge repair

AM2---ipad mini /ipad Air Corner and edge repair

TH4---ipod Corner and edge repair

I61---iPhone6 Corner and edge repair

I62---iPhone6 PULS Corner and edge repair

P61---iPhone6 Corner and edge repair

P62---iPhone6 PULS Corner and edge repair

CH003604
€57.06

gTool iCorner iPhone 5 5S 6 Corner Tool

wishlist
Compare

MXIC MX25L1005MC

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000608
€3.45

MXIC MX25L1005MC

wishlist
Compare

TI TPS51211

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000610
€3.45

TI TPS51211

wishlist
Compare

Apple BIOS MBP15 2012 A1398 8203332 EMC2512

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003681
€30.71

Apple BIOS MBP15 2012 A1398 820-3332 EMC2512

wishlist
Compare

Intersil ISL6324ACRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000612
€3.45

Intersil ISL6324ACRZ

wishlist
Compare

Apple BIOS MBP12 2016 A1534 82000244 EMC2991

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003748
€44.38

Apple BIOS MBP12 2016 A1534 820-00244 EMC2991

wishlist
Compare

Realtek RTL8211CL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000614
€3.45

Realtek RTL8211CL

wishlist
Compare
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