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  • Categories: Programmer & Sockets
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A1465 EMC 2558 Bios Chip EFI Firmware 820-3208 Mid2012 Core i7 I73667U MD845LLA

PO000052
€18.00 €22.50

A1465 EMC 2558 Bios EFI Firmware 820-3208 Mid-2012 Core i7 I7-3667U MD845LL/A

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AM963PAEY44AB Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000457
€4.35

AM963PAEY44AB Stencil Template

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Wellon VP598 Universal Programmer Auto ECU Chip Tunning Auto Programming Tool

Login to Download: * User Manual Items List

Features:

? 48 Pin ZIF socket with Popular pin-drivers.

? Interface with LAPTOP, PC or compatibles through USB port

? Accepts standard file formats: JEDEC, INTEL (Extended) HEX, HOLTEK, EMC(.CDS), INTEL HEX16, Motorola S record

? Manages 16 and 32-bit word split (Set Programming)

? Features Test Vector capability and multiarray fuse map editor

? Test TTL/CMOS logic ICs and Dynamic/Static Random Access Memory devices

? Optimum programming for each individual device

? Automaticly Identifies the manufacturer and type of E(E)PROMs, Auto identifies TTL/CMOS logic IC

? Device insertion and poor-pin-contact check

? Support 1.5v Low voltage devices

? Not need exterior adapter for mostly devices.

? Universal DIP, PLCC, QFP, TSOP, PSOP, SOIC, SSOP, SDIP adapters

? Auto-run mode starts programming automatically upon detection of chip insertion

? Supports WindowsXP/Vista/ Windows 7 (32bit and 64bit)/ Windows 8 (32bit and 64bit)

? Supports ten languages, such as Chinese(Simplified), Chinese(Traditional), English, Korean, Poland, Italian, Portuguese, Dutch, Turkish and Hungary.

Specification:

? Dimension: 1689823mm

? weight: 265g

? Electrical spec. of the AC adapter: AC input 100V to 240V, 50/60Hz, DC output 9V/0.6A

Device Support:

? PROM: N/CMOS E(E)PROM, SeriesE(E)PROM, and FLASH Memory

? PLD: CPLD, EPLD, GAL, PEEL, PALCE and more

? Microcontroller: Atmel, Intel, Microchip, Signetics, Zilog, etc.

IC Test:

? TTL (74 series), CMOS (40/45 series) Logic IC

? DRAM SRAM memory device

Package Including:

1pc x Wellon Programmer VP-598

1pc x USB cable

1pc x VP-598 Manual

1pc x power adapter

CH001248
€202.64

Wellon VP598 Universal Programmer Auto ECU Chip Tunning Auto Programming Tool

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A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i5 I53317U MD628LLA

PO000053
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i5 I5-3317U MD628LL/A

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i53337U SR0XL Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000461
€9.97

i5-3337U SR0XL Stencil Template 90*90

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N10MNESA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000465
€5.40

N10M-NE-S-A3 Stencil Template

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A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i5 I53427U MD231LLA

PO000054
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i5 I5-3427U MD231LL/A

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PLCC20 Adapter for PLCC20DIP20 turn programmer test IC adapter for USB programmer universal

Product Description

Package includes: 1PCS PLCC20 Socket

PLCC20 Adapter for PLCC20-DIP20

Stock: in stock

Condition: NEW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001260
€3.11

PLCC20 Adapter for PLCC20-DIP20 turn programmer test IC adapter for USB programmer universal

wishlist
Compare
Quickview

i32377M SR0CW Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000466
€5.40

i3-2377M SR0CW Stencil Template

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A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i7 I73667U MD846LLA

PO000055
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i7 I7-3667U MD846LL/A

  • -20%

A1465 EMC 2558 Bios Chip EFI Firmware 820-3208 Mid2012 Core i7 I73667U MD845LLA

PO000052
€18.00 €22.50

A1465 EMC 2558 Bios EFI Firmware 820-3208 Mid-2012 Core i7 I7-3667U MD845LL/A

wishlist
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AM963PAEY44AB Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000457
€4.35

AM963PAEY44AB Stencil Template

wishlist
Compare

Wellon VP598 Universal Programmer Auto ECU Chip Tunning Auto Programming Tool

Login to Download: * User Manual Items List

Features:

? 48 Pin ZIF socket with Popular pin-drivers.

? Interface with LAPTOP, PC or compatibles through USB port

? Accepts standard file formats: JEDEC, INTEL (Extended) HEX, HOLTEK, EMC(.CDS), INTEL HEX16, Motorola S record

? Manages 16 and 32-bit word split (Set Programming)

? Features Test Vector capability and multiarray fuse map editor

? Test TTL/CMOS logic ICs and Dynamic/Static Random Access Memory devices

? Optimum programming for each individual device

? Automaticly Identifies the manufacturer and type of E(E)PROMs, Auto identifies TTL/CMOS logic IC

? Device insertion and poor-pin-contact check

? Support 1.5v Low voltage devices

? Not need exterior adapter for mostly devices.

? Universal DIP, PLCC, QFP, TSOP, PSOP, SOIC, SSOP, SDIP adapters

? Auto-run mode starts programming automatically upon detection of chip insertion

? Supports WindowsXP/Vista/ Windows 7 (32bit and 64bit)/ Windows 8 (32bit and 64bit)

? Supports ten languages, such as Chinese(Simplified), Chinese(Traditional), English, Korean, Poland, Italian, Portuguese, Dutch, Turkish and Hungary.

Specification:

? Dimension: 1689823mm

? weight: 265g

? Electrical spec. of the AC adapter: AC input 100V to 240V, 50/60Hz, DC output 9V/0.6A

Device Support:

? PROM: N/CMOS E(E)PROM, SeriesE(E)PROM, and FLASH Memory

? PLD: CPLD, EPLD, GAL, PEEL, PALCE and more

? Microcontroller: Atmel, Intel, Microchip, Signetics, Zilog, etc.

IC Test:

? TTL (74 series), CMOS (40/45 series) Logic IC

? DRAM SRAM memory device

Package Including:

1pc x Wellon Programmer VP-598

1pc x USB cable

1pc x VP-598 Manual

1pc x power adapter

CH001248
€202.64

Wellon VP598 Universal Programmer Auto ECU Chip Tunning Auto Programming Tool

wishlist
Compare
  • -20%

A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i5 I53317U MD628LLA

PO000053
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i5 I5-3317U MD628LL/A

wishlist
Compare

i53337U SR0XL Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000461
€9.97

i5-3337U SR0XL Stencil Template 90*90

wishlist
Compare

N10MNESA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000465
€5.40

N10M-NE-S-A3 Stencil Template

wishlist
Compare
  • -20%

A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i5 I53427U MD231LLA

PO000054
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i5 I5-3427U MD231LL/A

wishlist
Compare

PLCC20 Adapter for PLCC20DIP20 turn programmer test IC adapter for USB programmer universal

Product Description

Package includes: 1PCS PLCC20 Socket

PLCC20 Adapter for PLCC20-DIP20

Stock: in stock

Condition: NEW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001260
€3.11

PLCC20 Adapter for PLCC20-DIP20 turn programmer test IC adapter for USB programmer universal

wishlist
Compare

i32377M SR0CW Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000466
€5.40

i3-2377M SR0CW Stencil Template

wishlist
Compare
  • -20%

A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i7 I73667U MD846LLA

PO000055
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i7 I7-3667U MD846LL/A

wishlist
Compare
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