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  • Categories: BGA Reballing Kits, Stencils
  • Categories: Bios Chip Programming
  • Categories: Programmer Spare Part
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A1502 EMC 2678 Bios Chip EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I54258U ME864LLA

PO000091
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I5-4258U ME864LL/A

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21607290x9090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000631
€9.97

216-0729051 Stencil Template 90*90

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TMZL6250AX5DY Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000662
€5.40

TMZL6250AX5DY Stencil Template

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A1502 EMC 2678 Bios Chip EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I54288U ME866LLA

PO000092
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I5-4288U ME866LL/A

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A1502 EMC 2678 Bios Chip EFI Firmware 820-3476 Retina Late 2013 13 Core i7 I74558U ME867LLA

PO000093
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3476 Retina Late 2013 13 Core i7 I7-4558U ME867LL/A

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N13PLPA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000665
€5.40

N13P-LP-A2 Stencil Template

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A1502 EMC 2875 Bios Chip EFI Firmware 820-4924 Retina Mid2014 13 Core i5 I54278U MGX72LLA

PO000094
€18.00 €22.50

A1502 EMC 2875 Bios EFI Firmware 820-4924 Retina Mid-2014 13 Core i5 I5-4278U MGX72LL/A

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i32375M SR0U4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000667
€5.40

i3-2375M SR0U4 Stencil Template

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FH82QM370 SR40D Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000668
€9.95

FH82QM370 SR40D Stencil Template 90*90

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A1502 EMC 2875 Bios Chip EFI Firmware 820-4924 Retina Mid2014 13 Core i5 I54308U MGX92LLA

PO000095
€18.00 €22.50

A1502 EMC 2875 Bios EFI Firmware 820-4924 Retina Mid-2014 13 Core i5 I5-4308U MGX92LL/A

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A1502 EMC 2875 Bios Chip EFI Firmware 820-4924 Retina Mid2014 13 Core i7 I74578U MGXD2LLA

PO000096
€18.00 €22.50

A1502 EMC 2875 Bios EFI Firmware 820-4924 Retina Mid-2014 13 Core i7 I7-4578U MGXD2LL/A

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SR2W8 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000671
€9.97

SR2W8 Stencil Template 90*90

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A1502 EMC 2678 Bios Chip EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I54258U ME864LLA

PO000091
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I5-4258U ME864LL/A

wishlist
Compare

21607290x9090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000631
€9.97

216-0729051 Stencil Template 90*90

wishlist
Compare

TMZL6250AX5DY Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000662
€5.40

TMZL6250AX5DY Stencil Template

wishlist
Compare
  • -20%

A1502 EMC 2678 Bios Chip EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I54288U ME866LLA

PO000092
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I5-4288U ME866LL/A

wishlist
Compare
  • -20%

A1502 EMC 2678 Bios Chip EFI Firmware 820-3476 Retina Late 2013 13 Core i7 I74558U ME867LLA

PO000093
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3476 Retina Late 2013 13 Core i7 I7-4558U ME867LL/A

wishlist
Compare

N13PLPA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000665
€5.40

N13P-LP-A2 Stencil Template

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Compare
  • -20%

A1502 EMC 2875 Bios Chip EFI Firmware 820-4924 Retina Mid2014 13 Core i5 I54278U MGX72LLA

PO000094
€18.00 €22.50

A1502 EMC 2875 Bios EFI Firmware 820-4924 Retina Mid-2014 13 Core i5 I5-4278U MGX72LL/A

wishlist
Compare

i32375M SR0U4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000667
€5.40

i3-2375M SR0U4 Stencil Template

wishlist
Compare

FH82QM370 SR40D Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000668
€9.95

FH82QM370 SR40D Stencil Template 90*90

wishlist
Compare
  • -20%

A1502 EMC 2875 Bios Chip EFI Firmware 820-4924 Retina Mid2014 13 Core i5 I54308U MGX92LLA

PO000095
€18.00 €22.50

A1502 EMC 2875 Bios EFI Firmware 820-4924 Retina Mid-2014 13 Core i5 I5-4308U MGX92LL/A

wishlist
Compare
  • -20%

A1502 EMC 2875 Bios Chip EFI Firmware 820-4924 Retina Mid2014 13 Core i7 I74578U MGXD2LLA

PO000096
€18.00 €22.50

A1502 EMC 2875 Bios EFI Firmware 820-4924 Retina Mid-2014 13 Core i7 I7-4578U MGXD2LL/A

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Compare

SR2W8 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000671
€9.97

SR2W8 Stencil Template 90*90

wishlist
Compare
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