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  • Categories: BGA Reballing Kits, Stencils
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N3510 SR1LV Stencil Template

N3510 SR1LV Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000676
€6.22

N3510 SR1LV Stencil Template

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A1502 EMC 2835 Bios Chip EFI Firmware 820-4924 Retina Early 2015 13 Core i5 I55287U MF841LLA

PO000098
€18.00 €22.50

A1502 EMC 2835 Bios EFI Firmware 820-4924 Retina Early 2015 13 Core i5 I5-5287U MF841LL/A

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i32350M SR0DQ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000682
€9.97

i3-2350M SR0DQ Stencil Template 90*90

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A1502 EMC 2835 Bios Chip EFI Firmware 820-4924 Retina Early 2015 13 Core i7 I75557U MF843LLA

PO000099
€18.00 €22.50

A1502 EMC 2835 Bios EFI Firmware 820-4924 Retina Early 2015 13 Core i7 I7-5557U MF843LL/A

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G84602A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000686
€5.40

G84-602-A2 Stencil Template

  • -20%
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A1708 EMC 2978 Bios Chip EFI Firmware 820-00875 Late 2016 13 Core i5 I56360U MLL42LLA

PO000100
€18.00 €22.50

A1708 EMC 2978 Bios EFI Firmware 820-00875 Late 2016 13 Core i5 I5-6360U MLL42LL/A

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A1708 EMC 2978 Bios Chip EFI Firmware 820-00875 Late 2016 13 Core i7 I76660U BTOCTO

PO000101
€18.00 €22.50

A1708 EMC 2978 Bios EFI Firmware 820-00875 Late 2016 13 Core i7 I7-6660U BTO/CTO

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Pentium DualCore Mobile 987 SR0V4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000688
€5.40

Pentium Dual-Core Mobile 987 SR0V4 Stencil Template

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BD82HM65 SLH9D Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000689
€5.40

BD82HM65 SLH9D Stencil Template

  • -20%
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A1706 EMC 3071 Bios Chip EFI Firmware 820-00239 Late 2016 13 Core i5 I56287U BTOCTO

PO000103
€18.00 €22.50

A1706 EMC 3071 Bios EFI Firmware 820-00239 Late 2016 13 Core i5 I5-6287U BTO/CTO

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AM950BADY23AB Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000694
€9.97

AM950BADY23AB Stencil Template 90*90

  • -20%
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A1706 EMC 3071 Bios Chip EFI Firmware 820-00239 Late 2016 13 Core i7 I76567U BTOCTO

PO000104
€18.00 €22.50

A1706 EMC 3071 Bios EFI Firmware 820-00239 Late 2016 13 Core i7 I7-6567U BTO/CTO

N3510 SR1LV Stencil Template

N3510 SR1LV Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000676
€6.22

N3510 SR1LV Stencil Template

wishlist
Compare
  • -20%

A1502 EMC 2835 Bios Chip EFI Firmware 820-4924 Retina Early 2015 13 Core i5 I55287U MF841LLA

PO000098
€18.00 €22.50

A1502 EMC 2835 Bios EFI Firmware 820-4924 Retina Early 2015 13 Core i5 I5-5287U MF841LL/A

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i32350M SR0DQ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000682
€9.97

i3-2350M SR0DQ Stencil Template 90*90

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  • -20%

A1502 EMC 2835 Bios Chip EFI Firmware 820-4924 Retina Early 2015 13 Core i7 I75557U MF843LLA

PO000099
€18.00 €22.50

A1502 EMC 2835 Bios EFI Firmware 820-4924 Retina Early 2015 13 Core i7 I7-5557U MF843LL/A

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G84602A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000686
€5.40

G84-602-A2 Stencil Template

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Compare
  • -20%

A1708 EMC 2978 Bios Chip EFI Firmware 820-00875 Late 2016 13 Core i5 I56360U MLL42LLA

PO000100
€18.00 €22.50

A1708 EMC 2978 Bios EFI Firmware 820-00875 Late 2016 13 Core i5 I5-6360U MLL42LL/A

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  • -20%

A1708 EMC 2978 Bios Chip EFI Firmware 820-00875 Late 2016 13 Core i7 I76660U BTOCTO

PO000101
€18.00 €22.50

A1708 EMC 2978 Bios EFI Firmware 820-00875 Late 2016 13 Core i7 I7-6660U BTO/CTO

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Pentium DualCore Mobile 987 SR0V4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000688
€5.40

Pentium Dual-Core Mobile 987 SR0V4 Stencil Template

wishlist
Compare

BD82HM65 SLH9D Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000689
€5.40

BD82HM65 SLH9D Stencil Template

wishlist
Compare
  • -20%

A1706 EMC 3071 Bios Chip EFI Firmware 820-00239 Late 2016 13 Core i5 I56287U BTOCTO

PO000103
€18.00 €22.50

A1706 EMC 3071 Bios EFI Firmware 820-00239 Late 2016 13 Core i5 I5-6287U BTO/CTO

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Compare

AM950BADY23AB Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000694
€9.97

AM950BADY23AB Stencil Template 90*90

wishlist
Compare
  • -20%

A1706 EMC 3071 Bios Chip EFI Firmware 820-00239 Late 2016 13 Core i7 I76567U BTOCTO

PO000104
€18.00 €22.50

A1706 EMC 3071 Bios EFI Firmware 820-00239 Late 2016 13 Core i7 I7-6567U BTO/CTO

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Compare
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