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  • Categories: BGA Reballing Kits, Stencils
  • Categories: DC Jacks, Connector
  • Categories: Laptop Parts, Repair tool
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DC Power Jack Part PJ076

Alienware M15X Series DC Power Jack Connector: M15X P08G

HP Compaq Notebook PC DC Power Jack Connector: 6530S, 6730S, 6910P, 8510P, 8710P

HP Compaq Mobile Workstation DC Power Jack Connector: 8710W

HP EliteBook Notebook PC DC Power Jack Connector: 2730P, 8730P

Dell Inspiron DC Power Jack Connector: M4010, N4020, N4030

Dell Inspiron DC Power Jack Connector: M5010, N5010, N5110 (15R)

Dell Vostro DC Power Jack Connector: 3550

CH002303
€7.96

DC Power Jack, Part #PJ076

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i53337U SR0XL Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000461
€9.97

i5-3337U SR0XL Stencil Template 90*90

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DC Power Jack Part PJ056

Acer Aspire DC Power Jack Connector: 3650, 3660, 3680, 5040, 5050, 5570, 5570Z

Acer Extensa DC Power Jack Connector: 3000, 4200, 4220, 4620

Acer TravelMate DC Power Jack Connector: 4200, 4220

Packard Bell Easynote DC Power Jack Connector: TJ75, TJ 75, MS2288

CH002315
€7.21

DC Power Jack, Part #PJ056

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N10MNESA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000465
€5.40

N10M-NE-S-A3 Stencil Template

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i32377M SR0CW Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000466
€5.40

i3-2377M SR0CW Stencil Template

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1000X USB Digital Microscope Endoscope Magnifier Video Camera with Stand 8 LEDs

1000X USB Digital Microscope Endoscope Magnifier Video Camera with Stand 8 LEDs

Login to Download: Download software

Features

Mini USB digital zoom microscope

50X-1000X magnification power

Image resolution up to 1600x1200 & 2MP

8 white-light LEDs equipped with adjustable brightness

Compatible with Windows XP, Vista & 7

USB 2.0 & USB 1.1 compatible

Lift tray included for convenient adjustment of object distance

Excellent for inspection of various tiny objects and small details with image capture

Applications

Industrial inspection

Computer & electronic component inspection

School & laboratory research

Medical analysis

Biological specimen dissection examination

Skin examination

Scalp examination

Textile inspection

Jewelry inspection

Painting inspection

Collection inspection (stamps, coins, paper notes)

Reading aid

Presentation aid

Specifications

Image Sensor: CMOS

Magnification Range: 50X ~ 1000X (Manually)

Digital Zoom: 5X Sequence Mode

Image Resolution: 320x240, 640x480, 800x600, 1280x960, 1600x1200

Frame Rate: 30 f/s under 600 lux brightness

Focus Range: 0mm ~ 40mm

Light Source: 8pcs of white-light LEDs

Brightness Control: Manual Adjustment

Power Supply: USB Port (5V DC)

USB 2.0 & USB 1.1 Compatible

Operation System: Windows XP, Vista, 7 (32 bit and 64 bit)

System Requirement: Pentium Computer with 1GHz or above, 150MB HD Space, CD-ROM Driver, 128MB RAM, Direct X VGA Card

Language: English, Chinese and other languages by selection

Dimension: 132mm x 33mm

Item Weight: 380g

One Set Included

1 x Mini USB Microscope with USB Cable

1 x Lift Tray

1 x Calibration Ruler

1 x Software CD

Standard factory package

CH000663
€17.28

1000X USB Digital Microscope Endoscope Magnifier Video Camera with Stand 8 LEDs

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i73820QM SR0MK Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000469
€5.40

i7-3820QM SR0MK Stencil Template

DC Power Jack Part PJ076

Alienware M15X Series DC Power Jack Connector: M15X P08G

HP Compaq Notebook PC DC Power Jack Connector: 6530S, 6730S, 6910P, 8510P, 8710P

HP Compaq Mobile Workstation DC Power Jack Connector: 8710W

HP EliteBook Notebook PC DC Power Jack Connector: 2730P, 8730P

Dell Inspiron DC Power Jack Connector: M4010, N4020, N4030

Dell Inspiron DC Power Jack Connector: M5010, N5010, N5110 (15R)

Dell Vostro DC Power Jack Connector: 3550

CH002303
€7.96

DC Power Jack, Part #PJ076

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i53337U SR0XL Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000461
€9.97

i5-3337U SR0XL Stencil Template 90*90

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Compare

DC Power Jack Part PJ056

Acer Aspire DC Power Jack Connector: 3650, 3660, 3680, 5040, 5050, 5570, 5570Z

Acer Extensa DC Power Jack Connector: 3000, 4200, 4220, 4620

Acer TravelMate DC Power Jack Connector: 4200, 4220

Packard Bell Easynote DC Power Jack Connector: TJ75, TJ 75, MS2288

CH002315
€7.21

DC Power Jack, Part #PJ056

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N10MNESA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000465
€5.40

N10M-NE-S-A3 Stencil Template

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DC Power Jack Part PJ022

Gateway DC Power Jack Connector: 200ARC

Samsung DC Power Jack Connector: X10, V20, V25, VM6000, VM7000

Micron DC Power Jack Connector: Metrobook VL Plus and Transport GX Series

CH002318
€7.21

DC Power Jack, Part #PJ022

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i32377M SR0CW Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000466
€5.40

i3-2377M SR0CW Stencil Template

wishlist
Compare

1000X USB Digital Microscope Endoscope Magnifier Video Camera with Stand 8 LEDs

1000X USB Digital Microscope Endoscope Magnifier Video Camera with Stand 8 LEDs

Login to Download: Download software

Features

Mini USB digital zoom microscope

50X-1000X magnification power

Image resolution up to 1600x1200 & 2MP

8 white-light LEDs equipped with adjustable brightness

Compatible with Windows XP, Vista & 7

USB 2.0 & USB 1.1 compatible

Lift tray included for convenient adjustment of object distance

Excellent for inspection of various tiny objects and small details with image capture

Applications

Industrial inspection

Computer & electronic component inspection

School & laboratory research

Medical analysis

Biological specimen dissection examination

Skin examination

Scalp examination

Textile inspection

Jewelry inspection

Painting inspection

Collection inspection (stamps, coins, paper notes)

Reading aid

Presentation aid

Specifications

Image Sensor: CMOS

Magnification Range: 50X ~ 1000X (Manually)

Digital Zoom: 5X Sequence Mode

Image Resolution: 320x240, 640x480, 800x600, 1280x960, 1600x1200

Frame Rate: 30 f/s under 600 lux brightness

Focus Range: 0mm ~ 40mm

Light Source: 8pcs of white-light LEDs

Brightness Control: Manual Adjustment

Power Supply: USB Port (5V DC)

USB 2.0 & USB 1.1 Compatible

Operation System: Windows XP, Vista, 7 (32 bit and 64 bit)

System Requirement: Pentium Computer with 1GHz or above, 150MB HD Space, CD-ROM Driver, 128MB RAM, Direct X VGA Card

Language: English, Chinese and other languages by selection

Dimension: 132mm x 33mm

Item Weight: 380g

One Set Included

1 x Mini USB Microscope with USB Cable

1 x Lift Tray

1 x Calibration Ruler

1 x Software CD

Standard factory package

CH000663
€17.28

1000X USB Digital Microscope Endoscope Magnifier Video Camera with Stand 8 LEDs

wishlist
Compare

i73820QM SR0MK Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000469
€5.40

i7-3820QM SR0MK Stencil Template

wishlist
Compare
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