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21607290x9090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000631
€9.97

216-0729051 Stencil Template 90*90

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DC Power Jack Part PJ081

Samsung NP R60 Series DC Power Jack Connector: NP R60, NP R60-xxxxx, NP R60-T2130, NP R60-T2330, NP R60-T2370, NP R60-T2390, NP R60-T5250, NP R60-T5450, NP R60-T5550, NP R60-T5750, NP R60-T7250, NP R60-X002, NP R60-X003, for motherboard BA92-04779B

Samsung NP R70 Series DC Power Jack Connector: NP R70, NP R70-xxxxx, NP R70-T5250, NP R70-T7100, NP R70-T7250, NP R70-T7300, NP R70-T7500, NP R70-T8300, for motherboards BA92-04575A, BA92-04575B, BA92-04804A

Samsung NP R700 Series DC Power Jack Connector: NP R700, NP R700-xxxxx, NP R700-A000xx, NP R700-A001xx, NP R700-A002xx, NP R700-A003xx, NP R700-A004xx, NP R700-A005xx, NP R700-A006xx, NP R700-A008xx, NP R700-A009xx, NP R700-A00Axx, NP R700-A00Bxx, NP R700-A00Cxx, NP R700-A00Dxx, NP R700-A00Exx, NP R700-A00Fxx, NP R700-A00Gxx, NP R700-A00Hxx, NP R700-AA01xx, NP R700-AA02xx, NP R700-AA0Axx, NP R700-AAA0xx, NP R700-AA01xx, NP R700-AA02xx, NP R700-AS01xx, NP R700-AS02xx, NP R700-AS03xx, NP R700-AS04xx, NP R700-AS05xx, NP R700-AS06xx, NP R700-AS07xx, NP R700-ASS0xx, NP R700-ASS1xx, NP R700-Aura, NP R700-B000xx, NP R700-B001xx, NP R700-BA01xx, NP R700-FA00xx, NP R700-FA01xx, NP R700-FA02xx, NP R700-FAA0xx, NP R700-FS01xx, NP R700-FS02xx, NP R700-FSS0xx, NP R700-XAA0xx, NP R700-XEV 2390, NP R700BMxx, for motherboards BA41-00862A, BA41-00863A, BA41-008621A

Samsung NT R700 Series DC Power Jack Connector: NT R700, NT R700-xxxxx, NT R700, NT R700-xxxxx, NT R700/A1, NT R700/A1G, NT R700-AA210, NT R700-AS240, NT R700-AS241, NT R700A-A1

CH003091
€7.21

DC Power Jack, Part #PJ081

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TMZL6250AX5DY Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000662
€5.40

TMZL6250AX5DY Stencil Template

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DC Power Jack Part PJ086

Samsung Series 5 Chromebook DC Power Jack Connector: XE500C21, XE500C21-AZ2, XE500C21-A01xx, XE500C21-A03xx, XE500C21-A04xx, XE500C21-HZ3, XE500C21-HZ3, XE500C21-H01xx, XE500C21-H03xx, XE500C21-H04xx, Motherboard BA92-08314A, BA92-09334A, BA92-09664B

CH003094
€7.21

DC Power Jack, Part #PJ086

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N13PLPA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000665
€5.40

N13P-LP-A2 Stencil Template

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i32375M SR0U4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000667
€5.40

i3-2375M SR0U4 Stencil Template

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FH82QM370 SR40D Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000668
€9.95

FH82QM370 SR40D Stencil Template 90*90

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SR2W8 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000671
€9.97

SR2W8 Stencil Template 90*90

21607290x9090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000631
€9.97

216-0729051 Stencil Template 90*90

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DC Power Jack Part PJ081

Samsung NP R60 Series DC Power Jack Connector: NP R60, NP R60-xxxxx, NP R60-T2130, NP R60-T2330, NP R60-T2370, NP R60-T2390, NP R60-T5250, NP R60-T5450, NP R60-T5550, NP R60-T5750, NP R60-T7250, NP R60-X002, NP R60-X003, for motherboard BA92-04779B

Samsung NP R70 Series DC Power Jack Connector: NP R70, NP R70-xxxxx, NP R70-T5250, NP R70-T7100, NP R70-T7250, NP R70-T7300, NP R70-T7500, NP R70-T8300, for motherboards BA92-04575A, BA92-04575B, BA92-04804A

Samsung NP R700 Series DC Power Jack Connector: NP R700, NP R700-xxxxx, NP R700-A000xx, NP R700-A001xx, NP R700-A002xx, NP R700-A003xx, NP R700-A004xx, NP R700-A005xx, NP R700-A006xx, NP R700-A008xx, NP R700-A009xx, NP R700-A00Axx, NP R700-A00Bxx, NP R700-A00Cxx, NP R700-A00Dxx, NP R700-A00Exx, NP R700-A00Fxx, NP R700-A00Gxx, NP R700-A00Hxx, NP R700-AA01xx, NP R700-AA02xx, NP R700-AA0Axx, NP R700-AAA0xx, NP R700-AA01xx, NP R700-AA02xx, NP R700-AS01xx, NP R700-AS02xx, NP R700-AS03xx, NP R700-AS04xx, NP R700-AS05xx, NP R700-AS06xx, NP R700-AS07xx, NP R700-ASS0xx, NP R700-ASS1xx, NP R700-Aura, NP R700-B000xx, NP R700-B001xx, NP R700-BA01xx, NP R700-FA00xx, NP R700-FA01xx, NP R700-FA02xx, NP R700-FAA0xx, NP R700-FS01xx, NP R700-FS02xx, NP R700-FSS0xx, NP R700-XAA0xx, NP R700-XEV 2390, NP R700BMxx, for motherboards BA41-00862A, BA41-00863A, BA41-008621A

Samsung NT R700 Series DC Power Jack Connector: NT R700, NT R700-xxxxx, NT R700, NT R700-xxxxx, NT R700/A1, NT R700/A1G, NT R700-AA210, NT R700-AS240, NT R700-AS241, NT R700A-A1

CH003091
€7.21

DC Power Jack, Part #PJ081

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TMZL6250AX5DY Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000662
€5.40

TMZL6250AX5DY Stencil Template

wishlist
Compare

DC Power Jack Part PJ086

Samsung Series 5 Chromebook DC Power Jack Connector: XE500C21, XE500C21-AZ2, XE500C21-A01xx, XE500C21-A03xx, XE500C21-A04xx, XE500C21-HZ3, XE500C21-HZ3, XE500C21-H01xx, XE500C21-H03xx, XE500C21-H04xx, Motherboard BA92-08314A, BA92-09334A, BA92-09664B

CH003094
€7.21

DC Power Jack, Part #PJ086

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N13PLPA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000665
€5.40

N13P-LP-A2 Stencil Template

wishlist
Compare

i32375M SR0U4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000667
€5.40

i3-2375M SR0U4 Stencil Template

wishlist
Compare

FH82QM370 SR40D Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000668
€9.95

FH82QM370 SR40D Stencil Template 90*90

wishlist
Compare

SR2W8 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000671
€9.97

SR2W8 Stencil Template 90*90

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Compare
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