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  • Categories: Bios Chip Programming
  • Categories: EFI Rom Cable
  • Categories: Other BGA Chips & ICs
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A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I54288U ME866LLA

PO000089
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I5-4288U ME866LL/A

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Intersil ISL6236IRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000606
€3.45

Intersil ISL6236IRZ

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A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i7 I74558U ME867LLA

PO000090
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i7 I7-4558U ME867LL/A

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MXIC MX25L1005MC

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000608
€3.45

MXIC MX25L1005MC

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TI TPS51211

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000610
€3.45

TI TPS51211

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A1502 EMC 2678 Bios Chip EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I54288U ME866LLA

PO000092
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I5-4288U ME866LL/A

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A1502 EMC 2678 Bios Chip EFI Firmware 820-3476 Retina Late 2013 13 Core i7 I74558U ME867LLA

PO000093
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3476 Retina Late 2013 13 Core i7 I7-4558U ME867LL/A

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Intersil ISL6324ACRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000612
€3.45

Intersil ISL6324ACRZ

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Realtek RTL8211CL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000614
€3.45

Realtek RTL8211CL

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A1502 EMC 2875 Bios Chip EFI Firmware 820-4924 Retina Mid2014 13 Core i5 I54308U MGX92LLA

PO000095
€18.00 €22.50

A1502 EMC 2875 Bios EFI Firmware 820-4924 Retina Mid-2014 13 Core i5 I5-4308U MGX92LL/A

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388S1251AZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000619
€3.45

388S1251-AZ

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A1502 EMC 2875 Bios Chip EFI Firmware 820-4924 Retina Mid2014 13 Core i7 I74578U MGXD2LLA

PO000096
€18.00 €22.50

A1502 EMC 2875 Bios EFI Firmware 820-4924 Retina Mid-2014 13 Core i7 I7-4578U MGXD2LL/A

  • -20%

A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I54288U ME866LLA

PO000089
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I5-4288U ME866LL/A

wishlist
Compare

Intersil ISL6236IRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000606
€3.45

Intersil ISL6236IRZ

wishlist
Compare
  • -20%

A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i7 I74558U ME867LLA

PO000090
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i7 I7-4558U ME867LL/A

wishlist
Compare

MXIC MX25L1005MC

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000608
€3.45

MXIC MX25L1005MC

wishlist
Compare

TI TPS51211

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000610
€3.45

TI TPS51211

wishlist
Compare
  • -20%

A1502 EMC 2678 Bios Chip EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I54288U ME866LLA

PO000092
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3476 Retina Late 2013 13 Core i5 I5-4288U ME866LL/A

wishlist
Compare
  • -20%

A1502 EMC 2678 Bios Chip EFI Firmware 820-3476 Retina Late 2013 13 Core i7 I74558U ME867LLA

PO000093
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3476 Retina Late 2013 13 Core i7 I7-4558U ME867LL/A

wishlist
Compare

Intersil ISL6324ACRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000612
€3.45

Intersil ISL6324ACRZ

wishlist
Compare

Realtek RTL8211CL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000614
€3.45

Realtek RTL8211CL

wishlist
Compare
  • -20%

A1502 EMC 2875 Bios Chip EFI Firmware 820-4924 Retina Mid2014 13 Core i5 I54308U MGX92LLA

PO000095
€18.00 €22.50

A1502 EMC 2875 Bios EFI Firmware 820-4924 Retina Mid-2014 13 Core i5 I5-4308U MGX92LL/A

wishlist
Compare

388S1251AZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000619
€3.45

388S1251-AZ

wishlist
Compare
  • -20%

A1502 EMC 2875 Bios Chip EFI Firmware 820-4924 Retina Mid2014 13 Core i7 I74578U MGXD2LLA

PO000096
€18.00 €22.50

A1502 EMC 2875 Bios EFI Firmware 820-4924 Retina Mid-2014 13 Core i7 I7-4578U MGXD2LL/A

wishlist
Compare
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