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  • Categories: Adapter, DC cable
  • Categories: Bios Chip Programming
  • Categories: Other BGA Chips & ICs
  • Categories: Programmer
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A1369 EMC 2392 Bios Chip EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9400 MC503LLA

PO000044
€18.00 €22.50

A1369 EMC 2392 Bios EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9400 MC503LL/A

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BROADCOM BCM5784MKMLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000477
€3.45

BROADCOM BCM5784MKMLG

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A1369 EMC 2392 Bios Chip EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9600 MC905LLA

PO000045
€18.00 €22.50

A1369 EMC 2392 Bios EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9600 MC905LL/A

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Intersil ISL6532

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000478
€3.45

Intersil ISL6532

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A1370 EMC 2471 Bios Chip EFI Firmware 820-3024 Mid2011 Core i5 I52467M MC968LLA

PO000046
€18.00 €22.50

A1370 EMC 2471 Bios EFI Firmware 820-3024 Mid-2011 Core i5 I5-2467M MC968LL/A

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VT1311MF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000481
€3.45

VT1311MF

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A1370 EMC 2471 Bios Chip EFI Firmware 820-3024 Mid2011 Core i7 I72677M MD214LLA

PO000047
€18.00 €22.50

A1370 EMC 2471 Bios EFI Firmware 820-3024 Mid-2011 Core i7 I7-2677M MD214LL/A

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ITE IT8512F EXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000482
€3.45

ITE IT8512F (EXS)

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ENE KB9016QF A3

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000485
€3.97

ENE KB9016QF A3

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Realtek RTL8110SBL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000489
€3.45

Realtek RTL8110SBL

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A1465 EMC 2558 Bios Chip EFI Firmware 820-3208 Mid2012 Core i5 I53317U MD223LLA

PO000051
€18.00 €22.50

A1465 EMC 2558 Bios EFI Firmware 820-3208 Mid-2012 Core i5 I5-3317U MD223LL/A

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ATHEROS AR8131AL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000490
€3.45

ATHEROS AR8131-AL

  • -20%

A1369 EMC 2392 Bios Chip EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9400 MC503LLA

PO000044
€18.00 €22.50

A1369 EMC 2392 Bios EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9400 MC503LL/A

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Compare

BROADCOM BCM5784MKMLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000477
€3.45

BROADCOM BCM5784MKMLG

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  • -20%

A1369 EMC 2392 Bios Chip EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9600 MC905LLA

PO000045
€18.00 €22.50

A1369 EMC 2392 Bios EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9600 MC905LL/A

wishlist
Compare

Intersil ISL6532

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000478
€3.45

Intersil ISL6532

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Compare
  • -20%

A1370 EMC 2471 Bios Chip EFI Firmware 820-3024 Mid2011 Core i5 I52467M MC968LLA

PO000046
€18.00 €22.50

A1370 EMC 2471 Bios EFI Firmware 820-3024 Mid-2011 Core i5 I5-2467M MC968LL/A

wishlist
Compare

VT1311MF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000481
€3.45

VT1311MF

wishlist
Compare
  • -20%

A1370 EMC 2471 Bios Chip EFI Firmware 820-3024 Mid2011 Core i7 I72677M MD214LLA

PO000047
€18.00 €22.50

A1370 EMC 2471 Bios EFI Firmware 820-3024 Mid-2011 Core i7 I7-2677M MD214LL/A

wishlist
Compare

ITE IT8512F EXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000482
€3.45

ITE IT8512F (EXS)

wishlist
Compare

ENE KB9016QF A3

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000485
€3.97

ENE KB9016QF A3

wishlist
Compare

Realtek RTL8110SBL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000489
€3.45

Realtek RTL8110SBL

wishlist
Compare
  • -20%

A1465 EMC 2558 Bios Chip EFI Firmware 820-3208 Mid2012 Core i5 I53317U MD223LLA

PO000051
€18.00 €22.50

A1465 EMC 2558 Bios EFI Firmware 820-3208 Mid-2012 Core i5 I5-3317U MD223LL/A

wishlist
Compare

ATHEROS AR8131AL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000490
€3.45

ATHEROS AR8131-AL

wishlist
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