216-0842009 HD8730M

Part Number 216-0842009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1234

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

QFN8-DIP8 Programador Adaptador WSON8-DIP8 8x6mm 6x5mm for RT809H RT809F TL866II TL866A TL866CS TNM5000 XELTEK

N15V-GM-S-A2

Part Number N15V-GM-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

GX2020 Adapter for XELTEK SuperPro 7500

FH82HM370 SR40B

Part Number SR408 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Lattice USB download line FPGA CPLD ISP download simulation HW-USBN-2A

Login to Download: Download software

Features:

1. Using Lattice original design, to ensure the use of stable and reliable;

2. Support wide target voltage 1.2V- 5V;

3.USB power supply, no external power supply alone;

4. Supports all LATTICE development environments (LSC ISPVM, LATTICE DEMIOND, LATTICE ISPEVER, and LATTICE PROGRAMMER);

Supports a full range of Lattice FPGAs such as SC (M) / XP / XP2 / ECP2 (M) / ECP3 / ECP5 (G) / MachXO / MachXO2 / MachXO3 / ICE40 series;

6. Support Lattice full range of CPLDs, such as 1000/2000/4000 / ispMACH series;

7. Support JTAG, internal FLASH, SPI FLASH programming mode;

8. No need to install a separate driver, direct support for Diamond / ispLever6.x / 7.x / classic / ispVM various versions of drivers;

9. Has a current-limit input, ESD protection measures to ensure that the download line is complete;

10. Using Lattice official 2 * 5Pin pitch 2.54mm JTAG interface;

11. Support operating system Win2000 / XP, Windows7 / 8/10, Linux and so on

Download Wire Pin Description:

1.SCLK / TCK: connect with chip's SCLK / TCK pin;

2.GND: Downloader and the target board of the public, its internal 2,4-pin connection, in use, need to be a 2,4 feet connected to the target board;

3.MODE / TMS: with the chip's MODE / TMS pin connection;

4.GND: Downloader and the target board of the public, the internal 2,4-pin connection, in the need to use these two in a 2,4 feet connected to the target board;

5. SDI / TDI: SDI / TDI pin connection with the chip;

6.VCC: Used to detect whether the target board connected to the downloader is powered on or not used to power the target board. The official downloader does not have the ability to supply power to the target board. This needs attention;

7.SDO / TDO: SDO / TDO pin connection with the chip;

8.INTI: need to connect INTI pins when downloading and debugging some chips, not every chip needs to be connected;

9.TRST: In some chip download debugging need to connect TRST pin, not every chip needs to connect;

10.ispEN / Enable / PROG: It is necessary to connect the ispEN / Enable / PROG pins when downloading and debugging some chips, and not every chip needs to be connected.

Shipping list:

1.Lattice USB download cable (1)

2.USB 2.0 data cable (1)

3.10P 2.54MM spacing of the cable (1)

4.10P high-quality lattice special fly line (1)

5.2.54mm pitch 2X5 turn 8P standard definition line (1)

QD-FX-350MT-N-A3

Part Number QD-FX-350MT-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Limit frame specification: 9.0*11.0mm

G73-VZA-N-A2

Part Number G73-VZA-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1018

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N13P-GS-W-KB-A2

Part Number N13P-GS-W-KB-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel

Gauge Evaluator

Login to Download: * EV2300a Device Driver Installer Multilanguage

Model No: EV2300 HPA002

Included:

1 x Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel Gauge Evaluator

Description:

The EV2300 is a USB-based interface board for a PC that can be used to evaluate battery fuel gauge circuits designed with Texas Instruments' ICs. The EV2300 has connections on it for a USB cable and also accepts inputs from a battery fuel gauge circuit's communication port (SMBus or HDQ). By running the appropriate PC software for the correspondingfuel gauge IC, the EV2300 interface board allows the user to evaluate the battery fuel gauge circuit. Note: The driver on this page is for 32 bit Windows. See the 64 bit driver e2e post for 64 bit Windows 7 driver information.

Feature:

USB-based interface board for evaluation of battery fuel gauge circuits developed with fuel gauge ICs using the HDQ and SMBus communication protocol

Provides interface between intelligent battery circuit and a Windows-based PC

Connects to the USB port of a PC

Allows for on screen display and programming of gas gauge register functions when used with the appropriate PC software