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Battery for Acer Acer TimelineX 3830T 4830T 5830T 111V 4400mAh AS11A5E AS11A3E

Battery for Acer Acer TimelineX 3830T 4830T 5830T (11.1V 4400mAh) AS11A5E AS11A3E

Battery Type Li-ion Product Type Replacement Battery

Voltage 11,1V Color Black

Capacity 4400mAh Condition Original and New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002104
€27.23

Battery for Acer Acer TimelineX 3830T 4830T 5830T (11.1V 4400mAh) AS11A5E AS11A3E

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ASUS X99 BGA2084 PC Connector Foxconn Socket LGA20113 CPU Base

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002112
€19.77

ASUS X99 BGA2084 PC Connector Foxconn Socket LGA2011-3 CPU Base

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Foxconn INTEL i7 PC LGA1366 CPU BGA Socket Base Connector

Foxconn INTEL i7 PC LGA1366 CPU BGA Socket Base Connector

Part Number LGA1366 Manufacturer Foxconn

BGA Alloy No Pb/Lead Free Socket type BGA1366

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002144
€6.09

Foxconn INTEL i7 PC LGA1366 CPU BGA Socket Base Connector

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CP1515 Goot Wick Desoldering

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002178
€2.74

CP-1515 Goot Wick Desoldering

Battery for Acer Acer TimelineX 3830T 4830T 5830T 111V 4400mAh AS11A5E AS11A3E

Battery for Acer Acer TimelineX 3830T 4830T 5830T (11.1V 4400mAh) AS11A5E AS11A3E

Battery Type Li-ion Product Type Replacement Battery

Voltage 11,1V Color Black

Capacity 4400mAh Condition Original and New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002104
€27.23

Battery for Acer Acer TimelineX 3830T 4830T 5830T (11.1V 4400mAh) AS11A5E AS11A3E

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Compare

ASUS X99 BGA2084 PC Connector Foxconn Socket LGA20113 CPU Base

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002112
€19.77

ASUS X99 BGA2084 PC Connector Foxconn Socket LGA2011-3 CPU Base

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Foxconn INTEL i7 PC LGA1366 CPU BGA Socket Base Connector

Foxconn INTEL i7 PC LGA1366 CPU BGA Socket Base Connector

Part Number LGA1366 Manufacturer Foxconn

BGA Alloy No Pb/Lead Free Socket type BGA1366

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002144
€6.09

Foxconn INTEL i7 PC LGA1366 CPU BGA Socket Base Connector

wishlist
Compare

CP1515 Goot Wick Desoldering

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002178
€2.74

CP-1515 Goot Wick Desoldering

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