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  • Categories: Other BGA Chips & ICs
  • Categories: Programmer & Sockets
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Diodes APL5912

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000626
€3.45

Diodes APL5912

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MAX77686

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000629
€4.77

MAX77686

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98EX125BCD

98EX125-BCD

Part Number 98EX125-BCD Manufacturer MARVELL

BGA Alloy No Pb/Lead Free Date Code 05+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000634
€53.69

98EX125-BCD

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RICHTEK RT8204C H6

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000635
€3.45

RICHTEK RT8204C (H6=)

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Maxim MAX4019

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000637
€9.53

Maxim MAX4019

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TQFP44 to DIP44 Programmer Adapter Socket for RT809H XELTEK USB programmer

CHIP PROGRAMMER SOCKET TQFP44 TO DIP44 adapter socket support ATMEGA8 series

Description:

Best quality, QFP44 to 44Dip Adapter

Suitable for QFP44 IC

patch size : 0.8mm 10mm * 10mm

Feature:

Support Atmel Atmega TQFP44 device

eg.mega328 mega8A mega48 mega8 mega88 mega16 mega162 mega168

Comes with AVRISP header, directly connect to AVRISP, USBASP, MkII, for direct burning of firmware or arduino bootloaders

Crysal header so that crystal can be replaced easily

Convert to DIP44 Atmega328 format, Pin to pin comptabile with Atmega DIP44 MCU format

Package included:

Programmer Adapter QFP44 to DIP44

Note:

Type A: Use for XELTEK USB Programmer - Overlapping

Type B: Use for TNM5000 Programmer - Pin to Pin

CH001885
€28.00

TQFP44 to DIP44 Programmer Adapter Socket for RT809H XELTEK USB programmer

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Diodes AP6680GM

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000638
€3.45

Diodes AP6680GM

Diodes APL5912

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000626
€3.45

Diodes APL5912

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MAX77686

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000629
€4.77

MAX77686

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98EX125BCD

98EX125-BCD

Part Number 98EX125-BCD Manufacturer MARVELL

BGA Alloy No Pb/Lead Free Date Code 05+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000634
€53.69

98EX125-BCD

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RICHTEK RT8204C H6

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000635
€3.45

RICHTEK RT8204C (H6=)

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Maxim MAX4019

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000637
€9.53

Maxim MAX4019

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TQFP44 to DIP44 Programmer Adapter Socket for RT809H XELTEK USB programmer

CHIP PROGRAMMER SOCKET TQFP44 TO DIP44 adapter socket support ATMEGA8 series

Description:

Best quality, QFP44 to 44Dip Adapter

Suitable for QFP44 IC

patch size : 0.8mm 10mm * 10mm

Feature:

Support Atmel Atmega TQFP44 device

eg.mega328 mega8A mega48 mega8 mega88 mega16 mega162 mega168

Comes with AVRISP header, directly connect to AVRISP, USBASP, MkII, for direct burning of firmware or arduino bootloaders

Crysal header so that crystal can be replaced easily

Convert to DIP44 Atmega328 format, Pin to pin comptabile with Atmega DIP44 MCU format

Package included:

Programmer Adapter QFP44 to DIP44

Note:

Type A: Use for XELTEK USB Programmer - Overlapping

Type B: Use for TNM5000 Programmer - Pin to Pin

CH001885
€28.00

TQFP44 to DIP44 Programmer Adapter Socket for RT809H XELTEK USB programmer

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Diodes AP6680GM

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000638
€3.45

Diodes AP6680GM

wishlist
Compare
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