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PMC PM6640

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002682
€3.45

PMC PM6640

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SR1US J2900

SR1US J2900

Part Number SR1US J2900 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1429

Package/Case 240 PCS Description Original new

SR1US J2900 FH8065301614904 Intel Pentium CPU BGA1170 2 41 GHz Cores4

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002683
€44.80

SR1US J2900

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N5000 SR3RZ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002684
€14.92

N5000 SR3RZ Stencil Template 90*90

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G84603A2 8600MGT 64Bit 128Mb

G84-603-A2 8600MGT 64Bit 128Mb

Part Number G84-603-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1244

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002686
€16.38

G84-603-A2 8600MGT 64Bit 128Mb

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6in1 Repair Opening Metal Spudger Pry Tools Disassemble Set for Cell Phone GPS

Features:

1. Brand new 6in1 Repair Opening Pry Tools Set

2. Light weight,convenient to carry

3. With these repair tools, you'll be able to easily disassemble your phones

4. Quick disassemble and install your Phone without any damage

5. Can be reused for many times

Package include:

5 x Plastic Pry Tools

1 x Metal Spudger Pry tool

CH002689
€2.70

6in1 Repair Opening Metal Spudger Pry Tools Disassemble Set for Cell Phone GPS

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Intersil ISL6553

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002690
€3.45

Intersil ISL6553

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ACHI IR6500 BGA rework station

ACHI IR6500 infrared BGA Soldering Rework Station IR 6500 For Motherboard Chip PCB Refurbished Repair System Solder Welding 220V

Buy BGA repaired Nozzle: * BGA repaired Nozzle

IR6500 infrared BGA Soldering Rework Station IR 6000 For Motherboard Chip PCB Refurbished Repair System

1. USB interface.

2. 2 temperature zones

3. With tempering glass,more uniform heating

4. Hot sale model, praised by many customers.

5. Low cost.

6. Technical support is always available

7. Original Factory, look for worldwide distributors

Where this IR6500 DIY IR BGA Reflow Rework Station Price Good can be used for ?

1. For repairing Mobile phones

2. For repairing Notebooks/ Laptops/computers

3. For repairing game consoles, especially for XBOX360/PS3/WII

4. For repairing any other mainboards with size from 22x22mm to 500x400mm

5. For preheating chips or mainboards before soldering to improve rework efficiency.

Specifications of this IR6500 DIY IR BGA Reflow Rework Station Price Good

Total power 1250W

Voltage AC220V10% 50/60Hz

Top heater IR 400W

Size of topr heater 80mm*80mm

Bottom heater IR 800W

Size of bottom heating 180mm*180mm

PCB size Max. 400*305 mm

BGA chip size Max. 70*70 mm

Positioning V-groove PCB

Temperature control K Type temperature Sensor and Closed loop

Temperature accuracy 2C

Dimension 475*480*420mm

Net weight 20.5 KG

CH002691
€794.41

ACHI IR6500 BGA rework station

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GFGO7600NA2

GF-GO7600-N-A2

Part Number GF-GO7600-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1017

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002692
€24.62

GF-GO7600-N-A2

PMC PM6640

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002682
€3.45

PMC PM6640

wishlist
Compare

SR1US J2900

SR1US J2900

Part Number SR1US J2900 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1429

Package/Case 240 PCS Description Original new

SR1US J2900 FH8065301614904 Intel Pentium CPU BGA1170 2 41 GHz Cores4

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002683
€44.80

SR1US J2900

wishlist
Compare

N5000 SR3RZ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002684
€14.92

N5000 SR3RZ Stencil Template 90*90

wishlist
Compare

G84603A2 8600MGT 64Bit 128Mb

G84-603-A2 8600MGT 64Bit 128Mb

Part Number G84-603-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1244

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002686
€16.38

G84-603-A2 8600MGT 64Bit 128Mb

wishlist
Compare

6in1 Repair Opening Metal Spudger Pry Tools Disassemble Set for Cell Phone GPS

Features:

1. Brand new 6in1 Repair Opening Pry Tools Set

2. Light weight,convenient to carry

3. With these repair tools, you'll be able to easily disassemble your phones

4. Quick disassemble and install your Phone without any damage

5. Can be reused for many times

Package include:

5 x Plastic Pry Tools

1 x Metal Spudger Pry tool

CH002689
€2.70

6in1 Repair Opening Metal Spudger Pry Tools Disassemble Set for Cell Phone GPS

wishlist
Compare

Intersil ISL6553

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002690
€3.45

Intersil ISL6553

wishlist
Compare

ACHI IR6500 BGA rework station

ACHI IR6500 infrared BGA Soldering Rework Station IR 6500 For Motherboard Chip PCB Refurbished Repair System Solder Welding 220V

Buy BGA repaired Nozzle: * BGA repaired Nozzle

IR6500 infrared BGA Soldering Rework Station IR 6000 For Motherboard Chip PCB Refurbished Repair System

1. USB interface.

2. 2 temperature zones

3. With tempering glass,more uniform heating

4. Hot sale model, praised by many customers.

5. Low cost.

6. Technical support is always available

7. Original Factory, look for worldwide distributors

Where this IR6500 DIY IR BGA Reflow Rework Station Price Good can be used for ?

1. For repairing Mobile phones

2. For repairing Notebooks/ Laptops/computers

3. For repairing game consoles, especially for XBOX360/PS3/WII

4. For repairing any other mainboards with size from 22x22mm to 500x400mm

5. For preheating chips or mainboards before soldering to improve rework efficiency.

Specifications of this IR6500 DIY IR BGA Reflow Rework Station Price Good

Total power 1250W

Voltage AC220V10% 50/60Hz

Top heater IR 400W

Size of topr heater 80mm*80mm

Bottom heater IR 800W

Size of bottom heating 180mm*180mm

PCB size Max. 400*305 mm

BGA chip size Max. 70*70 mm

Positioning V-groove PCB

Temperature control K Type temperature Sensor and Closed loop

Temperature accuracy 2C

Dimension 475*480*420mm

Net weight 20.5 KG

CH002691
€794.41

ACHI IR6500 BGA rework station

wishlist
Compare

GFGO7600NA2

GF-GO7600-N-A2

Part Number GF-GO7600-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1017

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002692
€24.62

GF-GO7600-N-A2

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Compare
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