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  • Brand: Winbond & Macronix
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RT BGA130 01 POS NAND MCP Adapter For RT809H Programmer

In package included: 

1pcs x socket RT-BGA130-01 V1.1

1pcs x Frame 

 

Technical information:

1. Life span: ≥30,000 times

2. Material: PEI & PES

3. Temperature: -55°C~+170°C

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:
  
 If you are not from Europe, please inquire about customs tax, VAT of your country.
 We send products in Russia only via registered POST (12-20 days).
 Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
 
 Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
 Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000347
€76.00

RT-BGA130-01 POS NAND MCP Adapter For RT809H Programmer

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N2920 SR1SF Stencil Template

N2920 SR1SF Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000348
€6.22

N2920 SR1SF Stencil Template

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DH82HM87 SR17D

DH82HM87 SR17D

Part Number DH82HM87 SR17D Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000349
€62.36

DH82HM87 SR17D

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RICHTEK RT8166BZQW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000351
€3.45

RICHTEK RT8166BZQW

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DC Power Jack Part PJ089

Acer Aspire 1430 1430G 1430Z Series DC Power Jack Connector: 1430 AS1430, 1430-xxxx AS1430-xxxx, 1430-4857 AS1430-4857, 1430G AS1430G, 1430G-xxxx AS1430G-xxxx, 1430Z AS1430Z, 1430Z-xxxx AS1430Z-xxxx, 1430Z-4677 AS1430Z-4677

Acer Aspire TimelineX 1830 Series DC Power Jack Connector: 1830 AS1830, 1830-xxxx AS1830-xxxx, 1830-3595 AS1830-3595, 1830T-3337 AS1830T-3337, 1830T-3425 AS1830T-3425, 1830T-3505 AS1830T-3505, 1830T-3721 AS1830T-3721, 1830T-3927 AS1830T-3927, 1830T-4549 AS1830T-4549, 1830T-6478 AS1830T-6478, 1830T-6651 AS1830T-6651, 1830T-7618 AS1830T-7618

CH000352
€14.42

DC Power Jack, Part #PJ089

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Lenovo IdeaPad Flex 10 Series TouchScreen DC Power Jack Socket Connector

For sale, a brand new DC Power Jack Socket Connector for Lenovo Flex IdeaPad 10 Series laptops.

Fixes issues caused by faulty Socket :

Device does not power on or receives intermittent power

You have to "hold" or move the AC adapter plug tip to gain a power connection

Device randomly shuts down without any warning

The power jack wiggles & feels loose

The device runs only on a charged battery

The battery will not charge

CH000353
€7.46

Lenovo IdeaPad Flex 10 Series TouchScreen DC Power Jack Socket Connector

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TI BQ24753ATI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000355
€3.45

TI BQ24753ATI

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GK106220A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000357
€6.47

GK106-220-A1 Stencil Template

RT BGA130 01 POS NAND MCP Adapter For RT809H Programmer

In package included: 

1pcs x socket RT-BGA130-01 V1.1

1pcs x Frame 

 

Technical information:

1. Life span: ≥30,000 times

2. Material: PEI & PES

3. Temperature: -55°C~+170°C

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:
  
 If you are not from Europe, please inquire about customs tax, VAT of your country.
 We send products in Russia only via registered POST (12-20 days).
 Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
 
 Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
 Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000347
€76.00

RT-BGA130-01 POS NAND MCP Adapter For RT809H Programmer

wishlist
Compare

N2920 SR1SF Stencil Template

N2920 SR1SF Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000348
€6.22

N2920 SR1SF Stencil Template

wishlist
Compare

DH82HM87 SR17D

DH82HM87 SR17D

Part Number DH82HM87 SR17D Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000349
€62.36

DH82HM87 SR17D

wishlist
Compare

RICHTEK RT8166BZQW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000351
€3.45

RICHTEK RT8166BZQW

wishlist
Compare

DC Power Jack Part PJ089

Acer Aspire 1430 1430G 1430Z Series DC Power Jack Connector: 1430 AS1430, 1430-xxxx AS1430-xxxx, 1430-4857 AS1430-4857, 1430G AS1430G, 1430G-xxxx AS1430G-xxxx, 1430Z AS1430Z, 1430Z-xxxx AS1430Z-xxxx, 1430Z-4677 AS1430Z-4677

Acer Aspire TimelineX 1830 Series DC Power Jack Connector: 1830 AS1830, 1830-xxxx AS1830-xxxx, 1830-3595 AS1830-3595, 1830T-3337 AS1830T-3337, 1830T-3425 AS1830T-3425, 1830T-3505 AS1830T-3505, 1830T-3721 AS1830T-3721, 1830T-3927 AS1830T-3927, 1830T-4549 AS1830T-4549, 1830T-6478 AS1830T-6478, 1830T-6651 AS1830T-6651, 1830T-7618 AS1830T-7618

CH000352
€14.42

DC Power Jack, Part #PJ089

wishlist
Compare

Lenovo IdeaPad Flex 10 Series TouchScreen DC Power Jack Socket Connector

For sale, a brand new DC Power Jack Socket Connector for Lenovo Flex IdeaPad 10 Series laptops.

Fixes issues caused by faulty Socket :

Device does not power on or receives intermittent power

You have to "hold" or move the AC adapter plug tip to gain a power connection

Device randomly shuts down without any warning

The power jack wiggles & feels loose

The device runs only on a charged battery

The battery will not charge

CH000353
€7.46

Lenovo IdeaPad Flex 10 Series TouchScreen DC Power Jack Socket Connector

wishlist
Compare

TI BQ24753ATI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000355
€3.45

TI BQ24753ATI

wishlist
Compare

GK106220A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000357
€6.47

GK106-220-A1 Stencil Template

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Compare
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