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  • Categories: Bios Chip Programming
  • Categories: Other BGA Chips & ICs
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NUVOTON NPCE783LA0DX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000587
€3.45

NUVOTON NPCE783LA0DX

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A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i5 I53230M ME662LLA

PO000082
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i5 I5-3230M ME662LL/A

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A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i7 I73540M BTOCTO

PO000083
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i7 I7-3540M BTO/CTO

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A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i5 I53230M ME662LLA

PO000084
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i5 I5-3230M ME662LL/A

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TI TPS51116RG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000590
€3.45

TI TPS51116RG

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ACTIONS ATC2603A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000591
€3.45

ACTIONS ATC2603A

  • -20%
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A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i5 I53230M ME662LLA

PO000086
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i5 I5-3230M ME662LL/A

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PANASONIC ANX3110

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000592
€3.45

PANASONIC ANX3110

  • -20%
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A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i7 I73540M BTOCTO

PO000087
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i7 I7-3540M BTO/CTO

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ITE IT8517E HXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000594
€3.45

ITE IT8517E (HXA)

  • -20%
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A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I54258U ME864LLA

PO000088
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I5-4258U ME864LL/A

NUVOTON NPCE783LA0DX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000587
€3.45

NUVOTON NPCE783LA0DX

wishlist
Compare
  • -20%

A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i5 I53230M ME662LLA

PO000082
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i5 I5-3230M ME662LL/A

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  • -20%

A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i7 I73540M BTOCTO

PO000083
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i7 I7-3540M BTO/CTO

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  • -20%

A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i5 I53230M ME662LLA

PO000084
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i5 I5-3230M ME662LL/A

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TI TPS51116RG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000590
€3.45

TI TPS51116RG

wishlist
Compare

ACTIONS ATC2603A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000591
€3.45

ACTIONS ATC2603A

wishlist
Compare
  • -20%

A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i5 I53230M ME662LLA

PO000086
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i5 I5-3230M ME662LL/A

wishlist
Compare

PANASONIC ANX3110

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000592
€3.45

PANASONIC ANX3110

wishlist
Compare
  • -20%

A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i7 I73540M BTOCTO

PO000087
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i7 I7-3540M BTO/CTO

wishlist
Compare

ITE IT8517E HXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000594
€3.45

ITE IT8517E (HXA)

wishlist
Compare
  • -20%

A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I54258U ME864LLA

PO000088
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I5-4258U ME864LL/A

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Compare
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