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MCP79MVLB2

MCP79MVL-B2

Part Number MCP79MVL-B2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001359
€25.93

MCP79MVL-B2

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DC Power Jack Part PJ081

Samsung NP R60 Series DC Power Jack Connector: NP R60, NP R60-xxxxx, NP R60-T2130, NP R60-T2330, NP R60-T2370, NP R60-T2390, NP R60-T5250, NP R60-T5450, NP R60-T5550, NP R60-T5750, NP R60-T7250, NP R60-X002, NP R60-X003, for motherboard BA92-04779B

Samsung NP R70 Series DC Power Jack Connector: NP R70, NP R70-xxxxx, NP R70-T5250, NP R70-T7100, NP R70-T7250, NP R70-T7300, NP R70-T7500, NP R70-T8300, for motherboards BA92-04575A, BA92-04575B, BA92-04804A

Samsung NP R700 Series DC Power Jack Connector: NP R700, NP R700-xxxxx, NP R700-A000xx, NP R700-A001xx, NP R700-A002xx, NP R700-A003xx, NP R700-A004xx, NP R700-A005xx, NP R700-A006xx, NP R700-A008xx, NP R700-A009xx, NP R700-A00Axx, NP R700-A00Bxx, NP R700-A00Cxx, NP R700-A00Dxx, NP R700-A00Exx, NP R700-A00Fxx, NP R700-A00Gxx, NP R700-A00Hxx, NP R700-AA01xx, NP R700-AA02xx, NP R700-AA0Axx, NP R700-AAA0xx, NP R700-AA01xx, NP R700-AA02xx, NP R700-AS01xx, NP R700-AS02xx, NP R700-AS03xx, NP R700-AS04xx, NP R700-AS05xx, NP R700-AS06xx, NP R700-AS07xx, NP R700-ASS0xx, NP R700-ASS1xx, NP R700-Aura, NP R700-B000xx, NP R700-B001xx, NP R700-BA01xx, NP R700-FA00xx, NP R700-FA01xx, NP R700-FA02xx, NP R700-FAA0xx, NP R700-FS01xx, NP R700-FS02xx, NP R700-FSS0xx, NP R700-XAA0xx, NP R700-XEV 2390, NP R700BMxx, for motherboards BA41-00862A, BA41-00863A, BA41-008621A

Samsung NT R700 Series DC Power Jack Connector: NT R700, NT R700-xxxxx, NT R700, NT R700-xxxxx, NT R700/A1, NT R700/A1G, NT R700-AA210, NT R700-AS240, NT R700-AS241, NT R700A-A1

CH003091
€7.21

DC Power Jack, Part #PJ081

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SR32Q i77700HQ

SR32Q i7-7700HQ

Part Number i7-7700HQ SR32Q Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1440 Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001372
€205.13

SR32Q i7-7700HQ

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DC Power Jack Part PJ086

Samsung Series 5 Chromebook DC Power Jack Connector: XE500C21, XE500C21-AZ2, XE500C21-A01xx, XE500C21-A03xx, XE500C21-A04xx, XE500C21-HZ3, XE500C21-HZ3, XE500C21-H01xx, XE500C21-H03xx, XE500C21-H04xx, Motherboard BA92-08314A, BA92-09334A, BA92-09664B

CH003094
€7.21

DC Power Jack, Part #PJ086

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SR0HR

SR0HR

Part Number SR0HR Manufacturer INTEL

Socket Type rPGA988B Date Code 13+

Package/Case 1 PCS Description Brand new

SR0HR FF8062700848702 B830 Mobile Celeron Dual-Core 1.8 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001381
€10.50

SR0HR

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N10MNESA3

N10M-NE-S-A3

Part Number N1N10M-NE-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001400
€16.71

N10M-NE-S-A3

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GF116200KAA1 GTS450

GF116-200-KA-A1 GTS450

Part Number GF116-200-KA-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1238

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001403
€65.64

GF116-200-KA-A1 GTS450

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2160841000

216-0841000

Part Number 216-0841000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001432
€21.77

216-0841000

MCP79MVLB2

MCP79MVL-B2

Part Number MCP79MVL-B2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001359
€25.93

MCP79MVL-B2

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DC Power Jack Part PJ081

Samsung NP R60 Series DC Power Jack Connector: NP R60, NP R60-xxxxx, NP R60-T2130, NP R60-T2330, NP R60-T2370, NP R60-T2390, NP R60-T5250, NP R60-T5450, NP R60-T5550, NP R60-T5750, NP R60-T7250, NP R60-X002, NP R60-X003, for motherboard BA92-04779B

Samsung NP R70 Series DC Power Jack Connector: NP R70, NP R70-xxxxx, NP R70-T5250, NP R70-T7100, NP R70-T7250, NP R70-T7300, NP R70-T7500, NP R70-T8300, for motherboards BA92-04575A, BA92-04575B, BA92-04804A

Samsung NP R700 Series DC Power Jack Connector: NP R700, NP R700-xxxxx, NP R700-A000xx, NP R700-A001xx, NP R700-A002xx, NP R700-A003xx, NP R700-A004xx, NP R700-A005xx, NP R700-A006xx, NP R700-A008xx, NP R700-A009xx, NP R700-A00Axx, NP R700-A00Bxx, NP R700-A00Cxx, NP R700-A00Dxx, NP R700-A00Exx, NP R700-A00Fxx, NP R700-A00Gxx, NP R700-A00Hxx, NP R700-AA01xx, NP R700-AA02xx, NP R700-AA0Axx, NP R700-AAA0xx, NP R700-AA01xx, NP R700-AA02xx, NP R700-AS01xx, NP R700-AS02xx, NP R700-AS03xx, NP R700-AS04xx, NP R700-AS05xx, NP R700-AS06xx, NP R700-AS07xx, NP R700-ASS0xx, NP R700-ASS1xx, NP R700-Aura, NP R700-B000xx, NP R700-B001xx, NP R700-BA01xx, NP R700-FA00xx, NP R700-FA01xx, NP R700-FA02xx, NP R700-FAA0xx, NP R700-FS01xx, NP R700-FS02xx, NP R700-FSS0xx, NP R700-XAA0xx, NP R700-XEV 2390, NP R700BMxx, for motherboards BA41-00862A, BA41-00863A, BA41-008621A

Samsung NT R700 Series DC Power Jack Connector: NT R700, NT R700-xxxxx, NT R700, NT R700-xxxxx, NT R700/A1, NT R700/A1G, NT R700-AA210, NT R700-AS240, NT R700-AS241, NT R700A-A1

CH003091
€7.21

DC Power Jack, Part #PJ081

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SR32Q i77700HQ

SR32Q i7-7700HQ

Part Number i7-7700HQ SR32Q Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1440 Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001372
€205.13

SR32Q i7-7700HQ

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DC Power Jack Part PJ086

Samsung Series 5 Chromebook DC Power Jack Connector: XE500C21, XE500C21-AZ2, XE500C21-A01xx, XE500C21-A03xx, XE500C21-A04xx, XE500C21-HZ3, XE500C21-HZ3, XE500C21-H01xx, XE500C21-H03xx, XE500C21-H04xx, Motherboard BA92-08314A, BA92-09334A, BA92-09664B

CH003094
€7.21

DC Power Jack, Part #PJ086

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SR0HR

SR0HR

Part Number SR0HR Manufacturer INTEL

Socket Type rPGA988B Date Code 13+

Package/Case 1 PCS Description Brand new

SR0HR FF8062700848702 B830 Mobile Celeron Dual-Core 1.8 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001381
€10.50

SR0HR

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N10MNESA3

N10M-NE-S-A3

Part Number N1N10M-NE-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001400
€16.71

N10M-NE-S-A3

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GF116200KAA1 GTS450

GF116-200-KA-A1 GTS450

Part Number GF116-200-KA-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1238

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001403
€65.64

GF116-200-KA-A1 GTS450

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Compare

2160841000

216-0841000

Part Number 216-0841000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001432
€21.77

216-0841000

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