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  • Categories: Other BGA Chips & ICs
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Intersil ISL6236IRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000606
€3.45

Intersil ISL6236IRZ

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MXIC MX25L1005MC

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000608
€3.45

MXIC MX25L1005MC

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DC Power Jack Part PJ081

Samsung NP R60 Series DC Power Jack Connector: NP R60, NP R60-xxxxx, NP R60-T2130, NP R60-T2330, NP R60-T2370, NP R60-T2390, NP R60-T5250, NP R60-T5450, NP R60-T5550, NP R60-T5750, NP R60-T7250, NP R60-X002, NP R60-X003, for motherboard BA92-04779B

Samsung NP R70 Series DC Power Jack Connector: NP R70, NP R70-xxxxx, NP R70-T5250, NP R70-T7100, NP R70-T7250, NP R70-T7300, NP R70-T7500, NP R70-T8300, for motherboards BA92-04575A, BA92-04575B, BA92-04804A

Samsung NP R700 Series DC Power Jack Connector: NP R700, NP R700-xxxxx, NP R700-A000xx, NP R700-A001xx, NP R700-A002xx, NP R700-A003xx, NP R700-A004xx, NP R700-A005xx, NP R700-A006xx, NP R700-A008xx, NP R700-A009xx, NP R700-A00Axx, NP R700-A00Bxx, NP R700-A00Cxx, NP R700-A00Dxx, NP R700-A00Exx, NP R700-A00Fxx, NP R700-A00Gxx, NP R700-A00Hxx, NP R700-AA01xx, NP R700-AA02xx, NP R700-AA0Axx, NP R700-AAA0xx, NP R700-AA01xx, NP R700-AA02xx, NP R700-AS01xx, NP R700-AS02xx, NP R700-AS03xx, NP R700-AS04xx, NP R700-AS05xx, NP R700-AS06xx, NP R700-AS07xx, NP R700-ASS0xx, NP R700-ASS1xx, NP R700-Aura, NP R700-B000xx, NP R700-B001xx, NP R700-BA01xx, NP R700-FA00xx, NP R700-FA01xx, NP R700-FA02xx, NP R700-FAA0xx, NP R700-FS01xx, NP R700-FS02xx, NP R700-FSS0xx, NP R700-XAA0xx, NP R700-XEV 2390, NP R700BMxx, for motherboards BA41-00862A, BA41-00863A, BA41-008621A

Samsung NT R700 Series DC Power Jack Connector: NT R700, NT R700-xxxxx, NT R700, NT R700-xxxxx, NT R700/A1, NT R700/A1G, NT R700-AA210, NT R700-AS240, NT R700-AS241, NT R700A-A1

CH003091
€7.21

DC Power Jack, Part #PJ081

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TI TPS51211

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000610
€3.45

TI TPS51211

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DC Power Jack Part PJ086

Samsung Series 5 Chromebook DC Power Jack Connector: XE500C21, XE500C21-AZ2, XE500C21-A01xx, XE500C21-A03xx, XE500C21-A04xx, XE500C21-HZ3, XE500C21-HZ3, XE500C21-H01xx, XE500C21-H03xx, XE500C21-H04xx, Motherboard BA92-08314A, BA92-09334A, BA92-09664B

CH003094
€7.21

DC Power Jack, Part #PJ086

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Intersil ISL6324ACRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000612
€3.45

Intersil ISL6324ACRZ

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Realtek RTL8211CL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000614
€3.45

Realtek RTL8211CL

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388S1251AZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000619
€3.45

388S1251-AZ

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RICHTEK RT9202PS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000625
€3.45

RICHTEK RT9202PS

Intersil ISL6236IRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000606
€3.45

Intersil ISL6236IRZ

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Compare

MXIC MX25L1005MC

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000608
€3.45

MXIC MX25L1005MC

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DC Power Jack Part PJ081

Samsung NP R60 Series DC Power Jack Connector: NP R60, NP R60-xxxxx, NP R60-T2130, NP R60-T2330, NP R60-T2370, NP R60-T2390, NP R60-T5250, NP R60-T5450, NP R60-T5550, NP R60-T5750, NP R60-T7250, NP R60-X002, NP R60-X003, for motherboard BA92-04779B

Samsung NP R70 Series DC Power Jack Connector: NP R70, NP R70-xxxxx, NP R70-T5250, NP R70-T7100, NP R70-T7250, NP R70-T7300, NP R70-T7500, NP R70-T8300, for motherboards BA92-04575A, BA92-04575B, BA92-04804A

Samsung NP R700 Series DC Power Jack Connector: NP R700, NP R700-xxxxx, NP R700-A000xx, NP R700-A001xx, NP R700-A002xx, NP R700-A003xx, NP R700-A004xx, NP R700-A005xx, NP R700-A006xx, NP R700-A008xx, NP R700-A009xx, NP R700-A00Axx, NP R700-A00Bxx, NP R700-A00Cxx, NP R700-A00Dxx, NP R700-A00Exx, NP R700-A00Fxx, NP R700-A00Gxx, NP R700-A00Hxx, NP R700-AA01xx, NP R700-AA02xx, NP R700-AA0Axx, NP R700-AAA0xx, NP R700-AA01xx, NP R700-AA02xx, NP R700-AS01xx, NP R700-AS02xx, NP R700-AS03xx, NP R700-AS04xx, NP R700-AS05xx, NP R700-AS06xx, NP R700-AS07xx, NP R700-ASS0xx, NP R700-ASS1xx, NP R700-Aura, NP R700-B000xx, NP R700-B001xx, NP R700-BA01xx, NP R700-FA00xx, NP R700-FA01xx, NP R700-FA02xx, NP R700-FAA0xx, NP R700-FS01xx, NP R700-FS02xx, NP R700-FSS0xx, NP R700-XAA0xx, NP R700-XEV 2390, NP R700BMxx, for motherboards BA41-00862A, BA41-00863A, BA41-008621A

Samsung NT R700 Series DC Power Jack Connector: NT R700, NT R700-xxxxx, NT R700, NT R700-xxxxx, NT R700/A1, NT R700/A1G, NT R700-AA210, NT R700-AS240, NT R700-AS241, NT R700A-A1

CH003091
€7.21

DC Power Jack, Part #PJ081

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TI TPS51211

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000610
€3.45

TI TPS51211

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DC Power Jack Part PJ086

Samsung Series 5 Chromebook DC Power Jack Connector: XE500C21, XE500C21-AZ2, XE500C21-A01xx, XE500C21-A03xx, XE500C21-A04xx, XE500C21-HZ3, XE500C21-HZ3, XE500C21-H01xx, XE500C21-H03xx, XE500C21-H04xx, Motherboard BA92-08314A, BA92-09334A, BA92-09664B

CH003094
€7.21

DC Power Jack, Part #PJ086

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Intersil ISL6324ACRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000612
€3.45

Intersil ISL6324ACRZ

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Realtek RTL8211CL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000614
€3.45

Realtek RTL8211CL

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388S1251AZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000619
€3.45

388S1251-AZ

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RICHTEK RT9202PS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000625
€3.45

RICHTEK RT9202PS

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