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PGA 370 FCPGA to CPU Adapter Card

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002067
€11.06

PGA 370 FC-PGA to CPU Adapter Card

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USB HD Support web camera 1080P video microphone resolution BUILTIN

Description:

This USB HD webcam is designed with 12.0M pixels, can provide 1080P video resolution.

The camera angle can be adjusted up and down in 30 degree.

Auto focus design, plug-and-play, easy and convenient to use.

USB 2.0 design, fast data transmission.The webcam is fit for video meeting, video chart, etc..

Compartible with most computer operation system, you don't need to manual install any drivers.

Specification:

Material: ABS.

Color: Show as picture.

Image Sensor: CMOS

Lens: Glass Lens

Pixel: 12.0M Pixels

Resolution: 1920x1080.

Frame Rate: 30fps.

Interface: USB 2.0.

Size: 8x3x11cm.

Note

There might be a bit color distortions due to different computer resolutions.

There might be a slight errors due to different hand measurement.

Package included:

1x Webcam.

1x USB manual.

CH002069
€12.31

USB HD Support web camera 1080P video microphone resolution BUILT-IN

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Battery for Acer Acer TimelineX 3830T 4830T 5830T 111V 4400mAh AS11A5E AS11A3E

Battery for Acer Acer TimelineX 3830T 4830T 5830T (11.1V 4400mAh) AS11A5E AS11A3E

Battery Type Li-ion Product Type Replacement Battery

Voltage 11,1V Color Black

Capacity 4400mAh Condition Original and New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002104
€27.23

Battery for Acer Acer TimelineX 3830T 4830T 5830T (11.1V 4400mAh) AS11A5E AS11A3E

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ASUS X99 BGA2084 PC Connector Foxconn Socket LGA20113 CPU Base

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002112
€19.77

ASUS X99 BGA2084 PC Connector Foxconn Socket LGA2011-3 CPU Base

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Foxconn INTEL i7 PC LGA1366 CPU BGA Socket Base Connector

Foxconn INTEL i7 PC LGA1366 CPU BGA Socket Base Connector

Part Number LGA1366 Manufacturer Foxconn

BGA Alloy No Pb/Lead Free Socket type BGA1366

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002144
€6.09

Foxconn INTEL i7 PC LGA1366 CPU BGA Socket Base Connector

PGA 370 FCPGA to CPU Adapter Card

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002067
€11.06

PGA 370 FC-PGA to CPU Adapter Card

wishlist
Compare

USB HD Support web camera 1080P video microphone resolution BUILTIN

Description:

This USB HD webcam is designed with 12.0M pixels, can provide 1080P video resolution.

The camera angle can be adjusted up and down in 30 degree.

Auto focus design, plug-and-play, easy and convenient to use.

USB 2.0 design, fast data transmission.The webcam is fit for video meeting, video chart, etc..

Compartible with most computer operation system, you don't need to manual install any drivers.

Specification:

Material: ABS.

Color: Show as picture.

Image Sensor: CMOS

Lens: Glass Lens

Pixel: 12.0M Pixels

Resolution: 1920x1080.

Frame Rate: 30fps.

Interface: USB 2.0.

Size: 8x3x11cm.

Note

There might be a bit color distortions due to different computer resolutions.

There might be a slight errors due to different hand measurement.

Package included:

1x Webcam.

1x USB manual.

CH002069
€12.31

USB HD Support web camera 1080P video microphone resolution BUILT-IN

wishlist
Compare

Battery for Acer Acer TimelineX 3830T 4830T 5830T 111V 4400mAh AS11A5E AS11A3E

Battery for Acer Acer TimelineX 3830T 4830T 5830T (11.1V 4400mAh) AS11A5E AS11A3E

Battery Type Li-ion Product Type Replacement Battery

Voltage 11,1V Color Black

Capacity 4400mAh Condition Original and New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002104
€27.23

Battery for Acer Acer TimelineX 3830T 4830T 5830T (11.1V 4400mAh) AS11A5E AS11A3E

wishlist
Compare

ASUS X99 BGA2084 PC Connector Foxconn Socket LGA20113 CPU Base

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002112
€19.77

ASUS X99 BGA2084 PC Connector Foxconn Socket LGA2011-3 CPU Base

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Foxconn INTEL i7 PC LGA1366 CPU BGA Socket Base Connector

Foxconn INTEL i7 PC LGA1366 CPU BGA Socket Base Connector

Part Number LGA1366 Manufacturer Foxconn

BGA Alloy No Pb/Lead Free Socket type BGA1366

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002144
€6.09

Foxconn INTEL i7 PC LGA1366 CPU BGA Socket Base Connector

wishlist
Compare
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