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388S1251AZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000619
€3.45

388S1251-AZ

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Mastech MS8910 SMD RC Resistance Capacitance Meter Tester Auto Scanning

Features:

3000 counts LCD display

Full automatic measurement

Auto scanning the Resistance/Capacitance/Diode

Function selection by one FUNC Push Button

Data Hold function

Continuity checking function

Over Load Indication (?OL)

Low Battery Indication

Power Supply: 3V Lithium Battery CR2032 1PC (included)

Auto power-off. If the Tester is idle for more than 10 minutes, the tester will automatically turn off the power.

Operating temperature & Humidity: 0 ~ 40C (32 ~104F) & < 80% RH

Storage temperature & Humidity: -10 ~ 50C (14 ~ 122 F) & <70%RH

Safety Class: IEC1010-1, CAT II

EMC: According to CE regulation 89/336.

Dimension(L x W x H): 170 *31* 17mm/6.89 *1.26 *0.79in

Packing size: 20.4 * 5.8 * 2.8cm/ 8 * 2.2 * 1.1in

Weight: Approx. 50g/1.76oz (Not include battery)

Packing weight: Approx 100g/ 3.5oz

Specifications:

Function Range Resolution Accuracy

300O (1.0% of rdg + 2 digits)

3KO

Resistance 30KO 0.1O

300KO

3MO

30MO (1.2% of rdg + 3 digits)

3n F (2.5% of rdg + 3 digits)

30n F

300n F 1p F

Capacitance 3F

30F

300F (3.0% of rdg + 3 digits)

3m F

30m F

Diode Open Circuit Voltage: 2.8 V

Check Testing Current: 2mA

Continuity Check The buzzer will sound if the resistance is less than 30O

Package includes:

1x SMD tester

2 x Backup test pins

1 x Storage box

1 x User manual

1 x battery

CH004732
€34.69

Mastech MS8910 SMD RC Resistance Capacitance Meter Tester Auto Scanning

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RICHTEK RT9202PS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000625
€3.45

RICHTEK RT9202PS

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Diodes APL5912

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000626
€3.45

Diodes APL5912

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MAX77686

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000629
€4.77

MAX77686

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98EX125BCD

98EX125-BCD

Part Number 98EX125-BCD Manufacturer MARVELL

BGA Alloy No Pb/Lead Free Date Code 05+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000634
€53.69

98EX125-BCD

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RICHTEK RT8204C H6

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000635
€3.45

RICHTEK RT8204C (H6=)

388S1251AZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000619
€3.45

388S1251-AZ

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Mastech MS8910 SMD RC Resistance Capacitance Meter Tester Auto Scanning

Features:

3000 counts LCD display

Full automatic measurement

Auto scanning the Resistance/Capacitance/Diode

Function selection by one FUNC Push Button

Data Hold function

Continuity checking function

Over Load Indication (?OL)

Low Battery Indication

Power Supply: 3V Lithium Battery CR2032 1PC (included)

Auto power-off. If the Tester is idle for more than 10 minutes, the tester will automatically turn off the power.

Operating temperature & Humidity: 0 ~ 40C (32 ~104F) & < 80% RH

Storage temperature & Humidity: -10 ~ 50C (14 ~ 122 F) & <70%RH

Safety Class: IEC1010-1, CAT II

EMC: According to CE regulation 89/336.

Dimension(L x W x H): 170 *31* 17mm/6.89 *1.26 *0.79in

Packing size: 20.4 * 5.8 * 2.8cm/ 8 * 2.2 * 1.1in

Weight: Approx. 50g/1.76oz (Not include battery)

Packing weight: Approx 100g/ 3.5oz

Specifications:

Function Range Resolution Accuracy

300O (1.0% of rdg + 2 digits)

3KO

Resistance 30KO 0.1O

300KO

3MO

30MO (1.2% of rdg + 3 digits)

3n F (2.5% of rdg + 3 digits)

30n F

300n F 1p F

Capacitance 3F

30F

300F (3.0% of rdg + 3 digits)

3m F

30m F

Diode Open Circuit Voltage: 2.8 V

Check Testing Current: 2mA

Continuity Check The buzzer will sound if the resistance is less than 30O

Package includes:

1x SMD tester

2 x Backup test pins

1 x Storage box

1 x User manual

1 x battery

CH004732
€34.69

Mastech MS8910 SMD RC Resistance Capacitance Meter Tester Auto Scanning

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RICHTEK RT9202PS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000625
€3.45

RICHTEK RT9202PS

wishlist
Compare

Diodes APL5912

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000626
€3.45

Diodes APL5912

wishlist
Compare

MAX77686

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000629
€4.77

MAX77686

wishlist
Compare

98EX125BCD

98EX125-BCD

Part Number 98EX125-BCD Manufacturer MARVELL

BGA Alloy No Pb/Lead Free Date Code 05+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000634
€53.69

98EX125-BCD

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Compare

RICHTEK RT8204C H6

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000635
€3.45

RICHTEK RT8204C (H6=)

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