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TI TPS720105_son

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000476
€3.45

TI TPS720105_son

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NFG6150NA2

NF-G6150-N-A2

Part Number NF-G6150-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1027

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000878
€27.87

NF-G6150-N-A2

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UNIT UT890C Digital True RMS Multimeter Multimeter Tester With Test Lead Cable

Description:

UNI-T UT890C+ Digital True RMS Multimeter Multimetro Multimeter With Test Lead Cable

Features:

Overload protection up to 600V.

Data hold and True RMS function.

Low battery indicating protection.

High accuracy and resolution up to 6,000 counts.

Add to unique MAX-MIN value calculate function.

Basic functions Range Basic accuracy

Model UNI-T UT890C + UT890D

DC voltage V : 600.0mV (0.5% + 4) (0.5% + 4)

6.000V / 60.00V / 600.0V (0.5% + 2) (0.5% + 2)

1000V (0.7% + 10) (0.7% + 10)

AC voltage V : 6.000V / 60.00V / 600.0V (0.8% + 3) (0.8% + 3)

750V (1.0% + 10) (1.0% + 10)

AC current A : 6.000mA / 60.00mA (1.0% + 12) (1.0% + 12)

600.0mA (2.0% + 3) (2.0% + 3)

20.00A (3.0% + 5) (3.0% + 5)

A direct current : 60.00A / 6.000mA / 60.00mA (0.8% + 8) (0.8% + 8)

600.0mA (1.2% + 5) (1.2% + 5)

20.00A (2.0% + 5) (2.0% + 5)

Resistance : 600 (0.8% + 5) (0.8% + 5)

6.000k / 60.00k / 600.0k / 6.000M (0.8% + 3) (0.8% + 3)

60.00M (1.0% + 25) (1.0% + 25)

Temperature ? : -400 ? ~ 1000 ? (1.0% + 3)

Temperature ? : -40 ? ~ 1832 ? (1.5% + 5)

Capacitance F : 6.000nF (5.0% + 35) (5.0% + 35)

60.00nF ~ 600.0F (2.5% + 20) (2.5% + 20)

6000F (5.0% + 10) (5.0% + 10)

Frequency Hz : 9.999Hz ~ 9.999MHz (0.1% + 5) (0.1% + 5)

Measuring range: 10Hz ~ 10MHz (auto range), 100kHz:100mVrms input amplitude 30Vrms,

> 100kHz ~ 1MHz:200mVrms input amplitude 30Vrms, > 1MHz:600mVrms input amplitude 30Vrms

Special features:

Max / Min :

True RMS measurement TRMS :

Frequency response : Applicable sine wave and triangular wave, 40Hz ~ 1kHz

200Hz other waveforms for reference

Diode test

Continuity Buzzer hFE REL Data Hold

LCD backlight

Battery voltage tips

Automatic shutdown : About 15 minutes

Input impedance : 10M

General Characteristics

Environment : 18 C ~ 28 C (64 F ~ 82 F); relative humidity: 75%

Battery : 9V battery (6F22)(Not included)

LCD size : 63mm 29mm

Colors : Red + Grey

Body weight : 300g

Dimensions : 186mm 91mm 39mm

Standard accessories : Table pen, temperature probe (onlyUT890C +)

Standard Package : Outer box, manual, warranty card

Standard Pack Quantity : 40

Standard package size : 645mm 450mm 340mm

Standard Gross Weight : 22.8 Kg

Packing included:

1 x UNI-T UT890C+ Digital Auto Range True RMS Multimeter

1 x Table Pen

1 x Temperature Probe

1 x English User munual

CH003278
€21.76

UNI-T UT890C+ Digital True RMS Multimeter Multimeter Tester With Test Lead Cable

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BROADCOM BCM5784MKMLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000477
€3.45

BROADCOM BCM5784MKMLG

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N15SGTSA2

N15S-GT-S-A2

Part Number N15S-GT-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000890
€27.08

N15S-GT-S-A2

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Intersil ISL6532

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000478
€3.45

Intersil ISL6532

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VT1311MF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000481
€3.45

VT1311MF

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BD82Z77 SLJC7

BD82Z77 SLJC7

Part Number BD82Z77 SLJC7 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000922
€32.82

BD82Z77 SLJC7

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SR0HZ

SR0HZ

Part Number SR0HZ Manufacturer INTEL

Socket Type rPGA988B Date Code 12+

Package/Case 1 PCS Description Brand new

SR0HZ FF8062701159901 B815 Mobile Celeron Dual-Core 1.6 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000943
€10.50

SR0HZ

TI TPS720105_son

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000476
€3.45

TI TPS720105_son

wishlist
Compare

NFG6150NA2

NF-G6150-N-A2

Part Number NF-G6150-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1027

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000878
€27.87

NF-G6150-N-A2

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Compare

UNIT UT890C Digital True RMS Multimeter Multimeter Tester With Test Lead Cable

Description:

UNI-T UT890C+ Digital True RMS Multimeter Multimetro Multimeter With Test Lead Cable

Features:

Overload protection up to 600V.

Data hold and True RMS function.

Low battery indicating protection.

High accuracy and resolution up to 6,000 counts.

Add to unique MAX-MIN value calculate function.

Basic functions Range Basic accuracy

Model UNI-T UT890C + UT890D

DC voltage V : 600.0mV (0.5% + 4) (0.5% + 4)

6.000V / 60.00V / 600.0V (0.5% + 2) (0.5% + 2)

1000V (0.7% + 10) (0.7% + 10)

AC voltage V : 6.000V / 60.00V / 600.0V (0.8% + 3) (0.8% + 3)

750V (1.0% + 10) (1.0% + 10)

AC current A : 6.000mA / 60.00mA (1.0% + 12) (1.0% + 12)

600.0mA (2.0% + 3) (2.0% + 3)

20.00A (3.0% + 5) (3.0% + 5)

A direct current : 60.00A / 6.000mA / 60.00mA (0.8% + 8) (0.8% + 8)

600.0mA (1.2% + 5) (1.2% + 5)

20.00A (2.0% + 5) (2.0% + 5)

Resistance : 600 (0.8% + 5) (0.8% + 5)

6.000k / 60.00k / 600.0k / 6.000M (0.8% + 3) (0.8% + 3)

60.00M (1.0% + 25) (1.0% + 25)

Temperature ? : -400 ? ~ 1000 ? (1.0% + 3)

Temperature ? : -40 ? ~ 1832 ? (1.5% + 5)

Capacitance F : 6.000nF (5.0% + 35) (5.0% + 35)

60.00nF ~ 600.0F (2.5% + 20) (2.5% + 20)

6000F (5.0% + 10) (5.0% + 10)

Frequency Hz : 9.999Hz ~ 9.999MHz (0.1% + 5) (0.1% + 5)

Measuring range: 10Hz ~ 10MHz (auto range), 100kHz:100mVrms input amplitude 30Vrms,

> 100kHz ~ 1MHz:200mVrms input amplitude 30Vrms, > 1MHz:600mVrms input amplitude 30Vrms

Special features:

Max / Min :

True RMS measurement TRMS :

Frequency response : Applicable sine wave and triangular wave, 40Hz ~ 1kHz

200Hz other waveforms for reference

Diode test

Continuity Buzzer hFE REL Data Hold

LCD backlight

Battery voltage tips

Automatic shutdown : About 15 minutes

Input impedance : 10M

General Characteristics

Environment : 18 C ~ 28 C (64 F ~ 82 F); relative humidity: 75%

Battery : 9V battery (6F22)(Not included)

LCD size : 63mm 29mm

Colors : Red + Grey

Body weight : 300g

Dimensions : 186mm 91mm 39mm

Standard accessories : Table pen, temperature probe (onlyUT890C +)

Standard Package : Outer box, manual, warranty card

Standard Pack Quantity : 40

Standard package size : 645mm 450mm 340mm

Standard Gross Weight : 22.8 Kg

Packing included:

1 x UNI-T UT890C+ Digital Auto Range True RMS Multimeter

1 x Table Pen

1 x Temperature Probe

1 x English User munual

CH003278
€21.76

UNI-T UT890C+ Digital True RMS Multimeter Multimeter Tester With Test Lead Cable

wishlist
Compare

BROADCOM BCM5784MKMLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000477
€3.45

BROADCOM BCM5784MKMLG

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Compare

N15SGTSA2

N15S-GT-S-A2

Part Number N15S-GT-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000890
€27.08

N15S-GT-S-A2

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Intersil ISL6532

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000478
€3.45

Intersil ISL6532

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Compare

VT1311MF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000481
€3.45

VT1311MF

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Compare

BD82Z77 SLJC7

BD82Z77 SLJC7

Part Number BD82Z77 SLJC7 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000922
€32.82

BD82Z77 SLJC7

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Compare

SR0HZ

SR0HZ

Part Number SR0HZ Manufacturer INTEL

Socket Type rPGA988B Date Code 12+

Package/Case 1 PCS Description Brand new

SR0HZ FF8062701159901 B815 Mobile Celeron Dual-Core 1.6 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000943
€10.50

SR0HZ

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