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N13MGSBA2

N13M-GS-B-A2

Part Number N13M-GS-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1428

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001445
€25.93

N13M-GS-B-A2

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SR1EF i54210U

SR1EF i5-4210U

Part Number SR1EF i5-4210U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1339

Package/Case 440 PCS Description Original new

SR1EF i5-4210U CL8064701477802 Intel Core i5 Mobile CPU BGA1168 1.7 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001446
€211.69

SR1EF i5-4210U

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2180844012 FCH Hudson M1

218-0844012 FCH Hudson M1

Part Number 218-0844012 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1247

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001458
€26.96

218-0844012 FCH Hudson M1

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eMMC FBGA169 BGA153 Adapter 11513 to SD

Buy Limit Frame: * 11.5*13mm, 12*16mm, 12*18mm, 14*18mm

Product Characteristics

1. Using standard SD interface mode, the corresponding operation such as test or burning can be realized by connecting card reader with computer or through SD interface of programmer.

2. Compatible with ball-and-ball testing, IC limit frame is molded in one. It can be replaced by different size limit frame according to IC, so that IC of different size can be used universally.

3. Supporting hot plug-in and testing for PIN connection through SD interface or through connection with board row;

4. PCB adopts four-layer circuit structure to reduce the instability of test caused by signal interference. The golden finger is plated with thick gold to ensure durability and contact.

5. At the same time compatible: Toshiba, Samsung, Hynix, Intel, Sandisk and other brand IC;

6. Compatible with 153-FBGA 169-FBGA;

7. The shrapnel is stamped by imported beryllium copper through high precision die, the head-shaped probe is designed, and the later stage is hardened and plated with thick gold layer to ensure the stability and durability of the product.

8. The whole structure of the contact module reduces the repetitive positioning problem, ensures the precise alignment between the contact point and the IC PAD, and has a high pass rate in one test.

9. The through-hole welding structure is adopted to ensure good contact, and the positioning holes of SOCKET and PCBA are precisely positioned to facilitate replacement.

10. The top-window structure is adopted, which is compatible with manual and automatic testing and easy to operate.

11. Pressure IC adopts self-adapting structure of integral moulding and spring, which ensures that IC with different thickness does not need any adjustment to ensure good contact and wide universality of IC for testing.

12. The structure is formed by injection moulding, with precise positioning, easy access to IC and higher working efficiency.

CH001879
€92.00

eMMC FBGA169/BGA153 Adapter 11.5*13 to SD

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NF7050620IA2

NF-050-620I-A2

Part Number NF-7050-620I-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001472
€18.46

NF-7050-620I-A2

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G84750A2 8700MGT 64bit 128MB

G84-750-A2 8700MGT 64bit 128MB

Part Number G84-750-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1323

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001478
€17.39

G84-750-A2 8700MGT 64bit 128MB

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TQFP44 to DIP44 Programmer Adapter Socket for RT809H XELTEK USB programmer

CHIP PROGRAMMER SOCKET TQFP44 TO DIP44 adapter socket support ATMEGA8 series

Description:

Best quality, QFP44 to 44Dip Adapter

Suitable for QFP44 IC

patch size : 0.8mm 10mm * 10mm

Feature:

Support Atmel Atmega TQFP44 device

eg.mega328 mega8A mega48 mega8 mega88 mega16 mega162 mega168

Comes with AVRISP header, directly connect to AVRISP, USBASP, MkII, for direct burning of firmware or arduino bootloaders

Crysal header so that crystal can be replaced easily

Convert to DIP44 Atmega328 format, Pin to pin comptabile with Atmega DIP44 MCU format

Package included:

Programmer Adapter QFP44 to DIP44

Note:

Type A: Use for XELTEK USB Programmer - Overlapping

Type B: Use for TNM5000 Programmer - Pin to Pin

CH001885
€28.00

TQFP44 to DIP44 Programmer Adapter Socket for RT809H XELTEK USB programmer

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2160810005 HD6750

216-0810005 HD6750

Part Number 216-0810005 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001487
€60.95

216-0810005 HD6750

N13MGSBA2

N13M-GS-B-A2

Part Number N13M-GS-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1428

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001445
€25.93

N13M-GS-B-A2

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SR1EF i54210U

SR1EF i5-4210U

Part Number SR1EF i5-4210U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1339

Package/Case 440 PCS Description Original new

SR1EF i5-4210U CL8064701477802 Intel Core i5 Mobile CPU BGA1168 1.7 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001446
€211.69

SR1EF i5-4210U

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2180844012 FCH Hudson M1

218-0844012 FCH Hudson M1

Part Number 218-0844012 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1247

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001458
€26.96

218-0844012 FCH Hudson M1

wishlist
Compare

eMMC FBGA169 BGA153 Adapter 11513 to SD

Buy Limit Frame: * 11.5*13mm, 12*16mm, 12*18mm, 14*18mm

Product Characteristics

1. Using standard SD interface mode, the corresponding operation such as test or burning can be realized by connecting card reader with computer or through SD interface of programmer.

2. Compatible with ball-and-ball testing, IC limit frame is molded in one. It can be replaced by different size limit frame according to IC, so that IC of different size can be used universally.

3. Supporting hot plug-in and testing for PIN connection through SD interface or through connection with board row;

4. PCB adopts four-layer circuit structure to reduce the instability of test caused by signal interference. The golden finger is plated with thick gold to ensure durability and contact.

5. At the same time compatible: Toshiba, Samsung, Hynix, Intel, Sandisk and other brand IC;

6. Compatible with 153-FBGA 169-FBGA;

7. The shrapnel is stamped by imported beryllium copper through high precision die, the head-shaped probe is designed, and the later stage is hardened and plated with thick gold layer to ensure the stability and durability of the product.

8. The whole structure of the contact module reduces the repetitive positioning problem, ensures the precise alignment between the contact point and the IC PAD, and has a high pass rate in one test.

9. The through-hole welding structure is adopted to ensure good contact, and the positioning holes of SOCKET and PCBA are precisely positioned to facilitate replacement.

10. The top-window structure is adopted, which is compatible with manual and automatic testing and easy to operate.

11. Pressure IC adopts self-adapting structure of integral moulding and spring, which ensures that IC with different thickness does not need any adjustment to ensure good contact and wide universality of IC for testing.

12. The structure is formed by injection moulding, with precise positioning, easy access to IC and higher working efficiency.

CH001879
€92.00

eMMC FBGA169/BGA153 Adapter 11.5*13 to SD

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NF7050620IA2

NF-050-620I-A2

Part Number NF-7050-620I-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001472
€18.46

NF-7050-620I-A2

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G84750A2 8700MGT 64bit 128MB

G84-750-A2 8700MGT 64bit 128MB

Part Number G84-750-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1323

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001478
€17.39

G84-750-A2 8700MGT 64bit 128MB

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TQFP44 to DIP44 Programmer Adapter Socket for RT809H XELTEK USB programmer

CHIP PROGRAMMER SOCKET TQFP44 TO DIP44 adapter socket support ATMEGA8 series

Description:

Best quality, QFP44 to 44Dip Adapter

Suitable for QFP44 IC

patch size : 0.8mm 10mm * 10mm

Feature:

Support Atmel Atmega TQFP44 device

eg.mega328 mega8A mega48 mega8 mega88 mega16 mega162 mega168

Comes with AVRISP header, directly connect to AVRISP, USBASP, MkII, for direct burning of firmware or arduino bootloaders

Crysal header so that crystal can be replaced easily

Convert to DIP44 Atmega328 format, Pin to pin comptabile with Atmega DIP44 MCU format

Package included:

Programmer Adapter QFP44 to DIP44

Note:

Type A: Use for XELTEK USB Programmer - Overlapping

Type B: Use for TNM5000 Programmer - Pin to Pin

CH001885
€28.00

TQFP44 to DIP44 Programmer Adapter Socket for RT809H XELTEK USB programmer

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2160810005 HD6750

216-0810005 HD6750

Part Number 216-0810005 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001487
€60.95

216-0810005 HD6750

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Compare
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