• Show Sidebar

There are 5250 products.

Active filters

wishlist
Compare
Quickview

N12PGTA1 GT540M

N12P-GT-A1 GT540M

Part Number N12P-GT-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1341

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002779
€35.77

N12P-GT-A1 GT540M

wishlist
Compare
Quickview

AM870PAAY43KA Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002780
€4.35

AM870PAAY43KA Stencil Template

wishlist
Compare
Quickview

N13MGSSA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002781
€5.40

N13M-GS-S-A2 Stencil Template

wishlist
Compare
Quickview

FM980PADY44AB Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002782
€17.14

FM980PADY44AB Stencil Template 90*90

wishlist
Compare
Quickview

Intersil ISL62883CHRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002783
€3.45

Intersil ISL62883CHRTZ

wishlist
Compare
Quickview

M5Y51 SR23L Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002784
€7.46

M-5Y51 SR23L Stencil Template

wishlist
Compare
Quickview

Intersil ISL62882CHRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002785
€3.45

Intersil ISL62882CHRTZ

wishlist
Compare
Quickview

ITE IT8568E AXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002786
€4.77

ITE IT8568E AXS

wishlist
Compare
Quickview

SMSC MEC5035

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002788
€3.45

SMSC MEC5035

wishlist
Compare
Quickview

BGA24 to DIP8 Adapters for RT80x809F TL866CS TL866A TL866II EZP2010 EZP2013 Sofi

adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

the scope of delivery.

packing list:

1 * adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

BGA24 / TFBGA24 to DIP8 ic socket / adapter / Adaptor for 8X6 mm body width BGA chips

this adapter can be used on all long-term, such as willem, SKYPRO, TL866, TNM, SuperPro and so on.RT809H RT809F TL966CS TL866A TL866II EZP2010 EZP2013 willem SKYPRO TNM, SuperPro and so on.

size: 1.0 mm

applicable ic dimensions (REF.) 8X6 mm (4x6 & 5x5 size of the standards)

applicable body chip, BGA 24

BGA 24 can support the body of spi flash, for example, W25Q16, W25Q32, W25Q64, W25Q128, W25Q256 and so on.

CH002789
€48.00

BGA24 to DIP8 Adapters for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 Sofi

wishlist
Compare
Quickview

SSM6N15FEAPEMOSFET FDC638APZ SOT563

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002790
€3.45

SSM6N15FEAPE=MOSFET FDC638APZ SOT563

N12PGTA1 GT540M

N12P-GT-A1 GT540M

Part Number N12P-GT-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1341

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002779
€35.77

N12P-GT-A1 GT540M

wishlist
Compare

AM870PAAY43KA Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002780
€4.35

AM870PAAY43KA Stencil Template

wishlist
Compare

N13MGSSA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002781
€5.40

N13M-GS-S-A2 Stencil Template

wishlist
Compare

FM980PADY44AB Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002782
€17.14

FM980PADY44AB Stencil Template 90*90

wishlist
Compare

Intersil ISL62883CHRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002783
€3.45

Intersil ISL62883CHRTZ

wishlist
Compare

M5Y51 SR23L Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002784
€7.46

M-5Y51 SR23L Stencil Template

wishlist
Compare

Intersil ISL62882CHRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002785
€3.45

Intersil ISL62882CHRTZ

wishlist
Compare

ITE IT8568E AXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002786
€4.77

ITE IT8568E AXS

wishlist
Compare

SMSC MEC5035

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002788
€3.45

SMSC MEC5035

wishlist
Compare

BGA24 to DIP8 Adapters for RT80x809F TL866CS TL866A TL866II EZP2010 EZP2013 Sofi

adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

the scope of delivery.

packing list:

1 * adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

adapter TFBGA / BGA24 to DIP8 ic socket adapter for 8x6 mm body width BGA chips

BGA24 / TFBGA24 to DIP8 ic socket / adapter / Adaptor for 8X6 mm body width BGA chips

this adapter can be used on all long-term, such as willem, SKYPRO, TL866, TNM, SuperPro and so on.RT809H RT809F TL966CS TL866A TL866II EZP2010 EZP2013 willem SKYPRO TNM, SuperPro and so on.

size: 1.0 mm

applicable ic dimensions (REF.) 8X6 mm (4x6 & 5x5 size of the standards)

applicable body chip, BGA 24

BGA 24 can support the body of spi flash, for example, W25Q16, W25Q32, W25Q64, W25Q128, W25Q256 and so on.

CH002789
€48.00

BGA24 to DIP8 Adapters for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 Sofi

wishlist
Compare

SSM6N15FEAPEMOSFET FDC638APZ SOT563

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002790
€3.45

SSM6N15FEAPE=MOSFET FDC638APZ SOT563

wishlist
Compare
Back to top