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Maxim MAX1908

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002852
€3.45

Maxim MAX1908

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G84603A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002853
€5.40

G84-603-A2 Stencil Template

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NIKOS P1203BVA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002854
€3.45

NIKOS P1203BVA

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SR27G i35005U

SR27G i3-5005U

Part Number i3-5005U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002855
€122.75

SR27G i3-5005U

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Intersil ISL6327

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002856
€3.45

Intersil ISL6327

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J4005 SR3S5 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002858
€14.92

J4005 SR3S5 Stencil Template 90*90

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170 Models 8500pcs RC1206 SMD FR07 Series YAGEO Resistor 1 Accuracy Sample Book Assortment Kit

SMD YAGEO Resistor kit: * RC0201 RC0402 RC0603 RC0805 RC1206

Taiwan YAGEO (SMD) RC0805 FR-07 series 1206 SMD resistor book

1206 package 1% precision full range!!!

170 models, 50 for each, 8500 in total. The list of resistances is as follows:

There are 50 kinds of resistance inside and outside, 170 kinds, the precision is 1% (except 0 Euro)

CH002859
€66.56

170 Models 8500pcs RC1206 SMD FR-07 Series YAGEO Resistor 1% Accuracy Sample Book Assortment Kit

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8211254A Apple MacBook Pro 24 i5 13 Late 2011 Trackpad Flex Cable A1278

Trackpad Flex Ribbon cable for MacBook Pro 13" A1278 2009 2010 2011 2012

Description:

Perfect replacement trackpad cable for your Macbook Pro 13.3"

Compatible with Macbook Pro A1278 13.3"

Perfect fitting & functionality of OEM Part is guaranteed.

High quality brand new replacement

Manufacter Part Number: 821-0831-A/821-1254-A

Year: 2009 2010 2011 2012

Compatible Subfamily:

YEAR TIME NAME SIZE MOUDEL MATERIAL# CPU

Mid-2009 20090608 MB Pro 13.3 A1278 MB990xx/A "Core 2 Duo" 2.26 13" (SD/FW)

2.26 GHz Core 2 Duo (P8400)

Mid-2009 20090608 MB Pro 13.3 A1278 MB991xx/A "Core 2 Duo" 2.53 13" (SD/FW)

2.53 GHz Core 2 Duo (P8700)

Mid-2010 20100413 MB Pro 13.3 A1278 MC374xx/A "Core 2 Duo" 2.4 13"

2.4 GHz Core 2 Duo (P8600)

Mid-2010 20100413 MB Pro 13.3 A1278 MC375xx/A "Core 2 Duo" 2.66 13"

2.66 GHz Core 2 Duo (P8800)

Early 2011 20110224 MB Pro 13.3 A1278 MC700xx/A "Core i5" 2.3 13"

2.3 GHz Core i5 (I5-2415M)

Early 2011 20110224 MB Pro 13.3 A1278 MC724xx/A "Core i7" 2.7 13"

2.7 GHz Core i7 (I7-2620M)

Late 2011 20111024 MB Pro 13.3 A1278 MD313xx/A "Core i5" 2.4 13"

2.4 GHz Core i5 (I5-2435M)

Late 2011 20111024 MB Pro 13.3 A1278 MD314xx/A "Core i7" 2.8 13"

2.8 GHz Core i7 (I7-2640M)

Mid-2012 20120611 MB Pro 13.3 A1278 MD101xx/A "Core i5" 2.5 13"

2.5 GHz Core i5 (I5-3210M)

Mid-2012 20120611 MB Pro 13.3 A1278 MD102xx/A "Core i7" 2.9 13"

2.9 GHz Core i7 (I7-3520M)

Package Include:

1X A1278 touchpad Flex Cable 821-0831-A(821-1254-01/821-0890-A)

Remark:821-0831-A, 821-1254-01, 821-0890-A are same working cable,the parts number is different only.

CH002861
€11.81

821-1254-A Apple MacBook Pro 2.4 i5 13 Late 2011 Trackpad Flex Cable A1278

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i72820QM SR00U Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002862
€5.40

i7-2820QM SR00U Stencil Template

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ATHEROS AR8161BL3AR

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002863
€3.97

ATHEROS AR8161-BL3A-R

Maxim MAX1908

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002852
€3.45

Maxim MAX1908

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Compare

G84603A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002853
€5.40

G84-603-A2 Stencil Template

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Compare

NIKOS P1203BVA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002854
€3.45

NIKOS P1203BVA

wishlist
Compare

SR27G i35005U

SR27G i3-5005U

Part Number i3-5005U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002855
€122.75

SR27G i3-5005U

wishlist
Compare

Intersil ISL6327

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002856
€3.45

Intersil ISL6327

wishlist
Compare

J4005 SR3S5 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002858
€14.92

J4005 SR3S5 Stencil Template 90*90

wishlist
Compare

170 Models 8500pcs RC1206 SMD FR07 Series YAGEO Resistor 1 Accuracy Sample Book Assortment Kit

SMD YAGEO Resistor kit: * RC0201 RC0402 RC0603 RC0805 RC1206

Taiwan YAGEO (SMD) RC0805 FR-07 series 1206 SMD resistor book

1206 package 1% precision full range!!!

170 models, 50 for each, 8500 in total. The list of resistances is as follows:

There are 50 kinds of resistance inside and outside, 170 kinds, the precision is 1% (except 0 Euro)

CH002859
€66.56

170 Models 8500pcs RC1206 SMD FR-07 Series YAGEO Resistor 1% Accuracy Sample Book Assortment Kit

wishlist
Compare

8211254A Apple MacBook Pro 24 i5 13 Late 2011 Trackpad Flex Cable A1278

Trackpad Flex Ribbon cable for MacBook Pro 13" A1278 2009 2010 2011 2012

Description:

Perfect replacement trackpad cable for your Macbook Pro 13.3"

Compatible with Macbook Pro A1278 13.3"

Perfect fitting & functionality of OEM Part is guaranteed.

High quality brand new replacement

Manufacter Part Number: 821-0831-A/821-1254-A

Year: 2009 2010 2011 2012

Compatible Subfamily:

YEAR TIME NAME SIZE MOUDEL MATERIAL# CPU

Mid-2009 20090608 MB Pro 13.3 A1278 MB990xx/A "Core 2 Duo" 2.26 13" (SD/FW)

2.26 GHz Core 2 Duo (P8400)

Mid-2009 20090608 MB Pro 13.3 A1278 MB991xx/A "Core 2 Duo" 2.53 13" (SD/FW)

2.53 GHz Core 2 Duo (P8700)

Mid-2010 20100413 MB Pro 13.3 A1278 MC374xx/A "Core 2 Duo" 2.4 13"

2.4 GHz Core 2 Duo (P8600)

Mid-2010 20100413 MB Pro 13.3 A1278 MC375xx/A "Core 2 Duo" 2.66 13"

2.66 GHz Core 2 Duo (P8800)

Early 2011 20110224 MB Pro 13.3 A1278 MC700xx/A "Core i5" 2.3 13"

2.3 GHz Core i5 (I5-2415M)

Early 2011 20110224 MB Pro 13.3 A1278 MC724xx/A "Core i7" 2.7 13"

2.7 GHz Core i7 (I7-2620M)

Late 2011 20111024 MB Pro 13.3 A1278 MD313xx/A "Core i5" 2.4 13"

2.4 GHz Core i5 (I5-2435M)

Late 2011 20111024 MB Pro 13.3 A1278 MD314xx/A "Core i7" 2.8 13"

2.8 GHz Core i7 (I7-2640M)

Mid-2012 20120611 MB Pro 13.3 A1278 MD101xx/A "Core i5" 2.5 13"

2.5 GHz Core i5 (I5-3210M)

Mid-2012 20120611 MB Pro 13.3 A1278 MD102xx/A "Core i7" 2.9 13"

2.9 GHz Core i7 (I7-3520M)

Package Include:

1X A1278 touchpad Flex Cable 821-0831-A(821-1254-01/821-0890-A)

Remark:821-0831-A, 821-1254-01, 821-0890-A are same working cable,the parts number is different only.

CH002861
€11.81

821-1254-A Apple MacBook Pro 2.4 i5 13 Late 2011 Trackpad Flex Cable A1278

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Compare

i72820QM SR00U Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002862
€5.40

i7-2820QM SR00U Stencil Template

wishlist
Compare

ATHEROS AR8161BL3AR

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002863
€3.97

ATHEROS AR8161-BL3A-R

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