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  • Categories: BGA Reballing Kits, Stencils
  • Categories: Bios Chip Programming
  • Categories: Programmer Spare Part

AM950BADY23AB Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000694
€9.97

AM950BADY23AB Stencil Template 90*90

A1706 EMC 3071 Bios Chip EFI Firmware 820-00239 Late 2016 13 Core i5 I56287U BTOCTO

PO000103
€18.00 €22.50

A1706 EMC 3071 Bios EFI Firmware 820-00239 Late 2016 13 Core i5 I5-6287U BTO/CTO

BD82HM75 SLJ8F Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000696
€9.97

BD82HM75 SLJ8F Stencil Template 90*90

A1706 EMC 3071 Bios Chip EFI Firmware 820-00239 Late 2016 13 Core i7 I76567U BTOCTO

PO000104
€18.00 €22.50

A1706 EMC 3071 Bios EFI Firmware 820-00239 Late 2016 13 Core i7 I7-6567U BTO/CTO

216MQA6AVA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000697
€5.40

216MQA6AVA12FG Stencil Template

A1708 EMC 3164 Bios Chip EFI Firmware 820-00840 Mid2017 13 Core i5 I57360U MPXQ2LLA

PO000105
€18.00 €22.50

A1708 EMC 3164 Bios EFI Firmware 820-00840 Mid-2017 13 Core i5 I5-7360U MPXQ2LL/A

GF116400A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000698
€5.40

GF116-400-A1 Stencil Template

A1708 EMC 3164 Bios Chip EFI Firmware 820-00840 Mid2017 13 Core i7 I77660U BTOCTO

PO000106
€18.00 €22.50

A1708 EMC 3164 Bios EFI Firmware 820-00840 Mid-2017 13 Core i7 I7-7660U BTO/CTO

GL82HM175 SR30W Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000709
€4.35

GL82HM175 SR30W Stencil Template

A1706 EMC 3163 Bios Chip EFI Firmware 820-00923 Mid2017 13 Core i5 I57267U MPXV2LLA

PO000107
€18.00 €22.50

A1706 EMC 3163 Bios EFI Firmware 820-00923 Mid-2017 13 Core i5 I5-7267U MPXV2LL/A

A1706 EMC 3163 Bios Chip EFI Firmware 820-00923 Mid2017 13 Core i5 I57287U BTOCTO

PO000108
€18.00 €22.50

A1706 EMC 3163 Bios EFI Firmware 820-00923 Mid-2017 13 Core i5 I5-7287U BTO/CTO

N13PGT1A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000718
€5.40

N13P-GT1-A2 Stencil Template

AM950BADY23AB Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000694
€9.97

AM950BADY23AB Stencil Template 90*90

  • -20%

A1706 EMC 3071 Bios Chip EFI Firmware 820-00239 Late 2016 13 Core i5 I56287U BTOCTO

PO000103
€18.00 €22.50

A1706 EMC 3071 Bios EFI Firmware 820-00239 Late 2016 13 Core i5 I5-6287U BTO/CTO

BD82HM75 SLJ8F Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000696
€9.97

BD82HM75 SLJ8F Stencil Template 90*90

  • -20%

A1706 EMC 3071 Bios Chip EFI Firmware 820-00239 Late 2016 13 Core i7 I76567U BTOCTO

PO000104
€18.00 €22.50

A1706 EMC 3071 Bios EFI Firmware 820-00239 Late 2016 13 Core i7 I7-6567U BTO/CTO

216MQA6AVA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000697
€5.40

216MQA6AVA12FG Stencil Template

  • -20%

A1708 EMC 3164 Bios Chip EFI Firmware 820-00840 Mid2017 13 Core i5 I57360U MPXQ2LLA

PO000105
€18.00 €22.50

A1708 EMC 3164 Bios EFI Firmware 820-00840 Mid-2017 13 Core i5 I5-7360U MPXQ2LL/A

GF116400A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000698
€5.40

GF116-400-A1 Stencil Template

  • -20%

A1708 EMC 3164 Bios Chip EFI Firmware 820-00840 Mid2017 13 Core i7 I77660U BTOCTO

PO000106
€18.00 €22.50

A1708 EMC 3164 Bios EFI Firmware 820-00840 Mid-2017 13 Core i7 I7-7660U BTO/CTO

GL82HM175 SR30W Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000709
€4.35

GL82HM175 SR30W Stencil Template

  • -20%

A1706 EMC 3163 Bios Chip EFI Firmware 820-00923 Mid2017 13 Core i5 I57267U MPXV2LLA

PO000107
€18.00 €22.50

A1706 EMC 3163 Bios EFI Firmware 820-00923 Mid-2017 13 Core i5 I5-7267U MPXV2LL/A

  • -20%

A1706 EMC 3163 Bios Chip EFI Firmware 820-00923 Mid2017 13 Core i5 I57287U BTOCTO

PO000108
€18.00 €22.50

A1706 EMC 3163 Bios EFI Firmware 820-00923 Mid-2017 13 Core i5 I5-7287U BTO/CTO

N13PGT1A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000718
€5.40

N13P-GT1-A2 Stencil Template