• Show Sidebar

There are 1333 products.

Active filters

  • Categories: BGA Reballing Kits, Stencils
  • Categories: DC Jacks, Connector
  • Categories: EFI Rom Cable
  • Condition: New

GF110375A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000675
€5.59

GF110-375-A1 Stencil Template

19 pin HDMI Micro USB Jack Connector for Asus Eee Pad TF300T TF201 tf700t Tablet tf502t t100ta micro HDMI Jack

Products Status: Inventory

Type: Cable Adapter

Package: yes

Model Number: for Asus Eee Pad TF300T t100ta TF201 tf502t tf700t

19 pin HDMI Connector, micro USB Port

Jack: HDMI for Asus Eee Pad TF300T t100ta TF201 tf502t tf700t Tablet

HDMI USB Female socket Connector: for Tablet Asus Eee Pad PCB

Cable length: 10.5x6.5x2.8mm

CH003304
€6.53

19 pin HDMI Micro USB Jack Connector for Asus Eee Pad TF300T TF201 tf700t Tablet tf502t t100ta micro HDMI Jack

N3510 SR1LV Stencil Template

N3510 SR1LV Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000676
€6.22

N3510 SR1LV Stencil Template

i32350M SR0DQ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000682
€9.97

i3-2350M SR0DQ Stencil Template 90*90

Micro USB Charging Port Charger Connector For Asus Transformer Book T100T T100TA

Micro USB Charging Port Charger Connector For Asus Transformer Book T100T T100TA

This high quality Micro USB charging port connector is perfect replacment part for your Asus Transformer Book T100T T100TA. If your device is having problems syncing and charging then this is the part for you. It is used to replace if your device does not power on or receives intermittent power, you have to "hold" or move the AC adapter plug tip to gain a power connection, device shut down without any warning, the power jack feel loose power LED and battery charge LED flicks when the AC adapter tip is moved, the device work only on a charged battery & battery not charging with old connector.

Technical Information:

? Compatible with Asus Transformer Book T100T T100TA.

? Replace your unresponsive, faulty, cracked or damage charging port connector with this new part.

? Perfect fitting & functionality of OEM Part is Guaranteed.

? High quality replacement part

? Soldering Required.

Includes:

1 x Micro USB Charging Connector

CH003399
€9.82

Micro USB Charging Port Charger Connector For Asus Transformer Book T100T T100TA

G84602A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000686
€5.40

G84-602-A2 Stencil Template

Pentium DualCore Mobile 987 SR0V4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000688
€5.40

Pentium Dual-Core Mobile 987 SR0V4 Stencil Template

BD82HM65 SLH9D Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000689
€5.40

BD82HM65 SLH9D Stencil Template

GF110375A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000675
€5.59

GF110-375-A1 Stencil Template

19 pin HDMI Micro USB Jack Connector for Asus Eee Pad TF300T TF201 tf700t Tablet tf502t t100ta micro HDMI Jack

Products Status: Inventory

Type: Cable Adapter

Package: yes

Model Number: for Asus Eee Pad TF300T t100ta TF201 tf502t tf700t

19 pin HDMI Connector, micro USB Port

Jack: HDMI for Asus Eee Pad TF300T t100ta TF201 tf502t tf700t Tablet

HDMI USB Female socket Connector: for Tablet Asus Eee Pad PCB

Cable length: 10.5x6.5x2.8mm

CH003304
€6.53

19 pin HDMI Micro USB Jack Connector for Asus Eee Pad TF300T TF201 tf700t Tablet tf502t t100ta micro HDMI Jack

N3510 SR1LV Stencil Template

N3510 SR1LV Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000676
€6.22

N3510 SR1LV Stencil Template

i32350M SR0DQ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000682
€9.97

i3-2350M SR0DQ Stencil Template 90*90

Micro USB Charging Port Charger Connector For Asus Transformer Book T100T T100TA

Micro USB Charging Port Charger Connector For Asus Transformer Book T100T T100TA

This high quality Micro USB charging port connector is perfect replacment part for your Asus Transformer Book T100T T100TA. If your device is having problems syncing and charging then this is the part for you. It is used to replace if your device does not power on or receives intermittent power, you have to "hold" or move the AC adapter plug tip to gain a power connection, device shut down without any warning, the power jack feel loose power LED and battery charge LED flicks when the AC adapter tip is moved, the device work only on a charged battery & battery not charging with old connector.

Technical Information:

? Compatible with Asus Transformer Book T100T T100TA.

? Replace your unresponsive, faulty, cracked or damage charging port connector with this new part.

? Perfect fitting & functionality of OEM Part is Guaranteed.

? High quality replacement part

? Soldering Required.

Includes:

1 x Micro USB Charging Connector

CH003399
€9.82

Micro USB Charging Port Charger Connector For Asus Transformer Book T100T T100TA

G84602A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000686
€5.40

G84-602-A2 Stencil Template

Pentium DualCore Mobile 987 SR0V4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000688
€5.40

Pentium Dual-Core Mobile 987 SR0V4 Stencil Template

BD82HM65 SLH9D Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000689
€5.40

BD82HM65 SLH9D Stencil Template