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BD82HM75 SLJ8F Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000696
€9.97

BD82HM75 SLJ8F Stencil Template 90*90

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216MQA6AVA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000697
€5.40

216MQA6AVA12FG Stencil Template

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GF116400A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000698
€5.40

GF116-400-A1 Stencil Template

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GL82HM175 SR30W Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000709
€4.35

GL82HM175 SR30W Stencil Template

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DDK FUJIKURA FPC FLEXIBLE PRINTED CIRCUIT CONNECTOR 30 PIN FF14A30CR11DLB3H

Description:

1 - Flat printed circuit connector (30 Pin)

COMPATIBILITY:

MacBook Unibody 13" A1278

MacBook5,1 Late 2008: MB466LL/A (2.0 GHz Core 2 Duo)

MacBook5,1 Late 2008: MB467LL/A (2.4 GHz Core 2 Duo)

MacBook Unibody 13" A1342

MacBook6,1 Late 2009: MC207LL/A (2.26 GHz Core 2 Duo)

MacBook7,1 Mid 2010: MC516LL/A (2.4 GHz Core 2 Duo)

MacBook Pro Unibody 13" A1278

MacBookPro5,5 Mid 2009: MB990LL/A (2.26 GHz Core 2 Duo)

MacBookPro5,5 Mid 2009: MB991LL/A (2.53 GHz Core 2 Duo)

MacBookPro7,1 Mid 2010: MC374LL/A (2.4 GHz Core 2 Duo)

MacBookPro7,1 Mid 2010: MC375LL/A (2.66 GHz Core 2 Duo)

MacBookPro8,1 Early 2011: MC700LL/A (2.3 GHz Core i5)

MacBookPro8,1 Early 2011: MC724LL/A (2.7 GHz Core i7)

MacBookPro8,1 Late 2011: MD313LL/A (2.4 GHz Core i5)

MacBookPro8,1 Late 2011: MD314LL/A (2.8 GHz Core i7)

MacBookPro9,2 Mid 2012: MD101LL/A (2.5 GHz Core i5)

MacBookPro9,2 Mid 2012: MD102LL/A (2.9 GHz Core i7)

MacBook Pro Unibody 15" A1286

MacBookPro5,1 Late 2008: MB470LL/A (2.4 GHz Core 2 Duo)

MacBookPro5,1 Late 2008: MB471LL/A (2.53 GHz Core 2 Duo)

MacBookPro5,1 Late 2008: MB471LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,1 Early 2009: MC026LL/A (2.66 GHz Core 2 Duo)

MacBookPro5,1 Early 2009: MC026LL/A (2.93 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB985LL/A (2.66 Ghz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB986LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB986LL/A (3.06 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MC406LL/A (2.8 GHz Core 2 Duo) (Anti-Glare Display)

MacBookPro5,3 Mid 2009: MC406LL/A (3.06 GHz Core 2 Duo) (Anti-Glare Display)

MacBookPro5,4 Mid 2009: MC118LL/A (2.53 GHz Core 2 Duo)

MacBookPro6,2 Mid 2010: MC371LL/A (2.4 GHz Core i5)

MacBookPro6,2 Mid 2010: MC372LL/A (2.53 GHz Core i5)

MacBookPro6,2 Mid 2010: MC373LL/A (2.66 GHz Core i7)

MacBookPro6,2 Mid 2010: MC373LL/A (2.8 GHZ Core i7)

MacBookPro8,2 Early 2011: MC721LL/A (2.0 GHz Core i7)

MacBookPro8,2 Early 2011: MC723LL/A (2.2 GHz Core i7)

MacBookPro8,2 Early 2011: MD035LL/A (2.3 GHz Core i7)

MacBookPro8,2 Late 2011: MD318LL/A (2.2 GHz Core i7)

MacBookPro8,2 Late 2011: MD322LL/A (2.4 GHz Core i7)

MacBookPro8,2 Late 2011: MD322LL/A (2.5 GHz Core i7)

MacBookPro9,1 Mid 2012: MD103LL/A (2.3 GHz Core i7)

MacBookPro9,1 Mid 2012: MD104LL/A (2.6 GHz Core i7)

MacBookPro9,1 Mid 2012: MD104LL/A (2.7 GHz Core i7)

MacBook Pro Unibody 17" A1297

MacBookPro5,2 Early 2009: MB604LL/A (2.66 GHz Core 2 Duo)

MacBookPro5,2 Early 2009: MB604LL/A (2.93 GHz Core 2 Duo)

MacBookPro5,2 Mid 2009: MC226LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,2 Mid 2009: MC226LL/A (3.06 GHz Core 2 Duo)

MacBookPro6,1 Mid 2010: MC024LL/A (2.53 GHz Core i5)

MacBookPro6,1 Mid 2010: MC024LL/A (2.66 GHz Core i7)

MacBookPro6,1 Mid 2010: MC024LL/A (2.8 GHz Core i7)

MacBookPro8,3 Early 2011: MC725LL/A (2.2 GHz Core i7)

MacBookPro8,3 Early 2011: MC725LL/A (2.3 GHz Core i7)

MacBookPro8,3 Late 2011: MD311LL/A (2.4 GHz Core i7)

CH000962
€4.35

DDK FUJIKURA FPC FLEXIBLE PRINTED CIRCUIT CONNECTOR 30 PIN FF14A-30C-R11DL-B-3H

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N13PGT1A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000718
€5.40

N13P-GT1-A2 Stencil Template

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1.0m OMEGA KTYPE Thermocouple TTK30SLE

OMEGA thermocouple line

Model: temperature range: -200? ~260? (PTFE material) -200-500? (glass fiber material)

Wire diameter: 2*F0.127mm 2*0.255MM

Core material: nickel chromium / nickel silicon (K) copper / constantan (T) iron / copper nickel (J)

Color mark: red is negative / yellow is positive

The thermocouple temperature line for any K type imported and domestic use temperature recording instrument, used in the laboratory, aerospace engineering, shipbuilding, petrochemical, machinery fittings (reflow) etc.

CH000967
€5.59

1.0m OMEGA K-TYPE Thermocouple TT-K-30-SLE

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2150848004 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000734
€9.97

215-0848004 Stencil Template 90*90

BD82HM75 SLJ8F Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000696
€9.97

BD82HM75 SLJ8F Stencil Template 90*90

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Compare

216MQA6AVA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000697
€5.40

216MQA6AVA12FG Stencil Template

wishlist
Compare

GF116400A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000698
€5.40

GF116-400-A1 Stencil Template

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GL82HM175 SR30W Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000709
€4.35

GL82HM175 SR30W Stencil Template

wishlist
Compare

DDK FUJIKURA FPC FLEXIBLE PRINTED CIRCUIT CONNECTOR 30 PIN FF14A30CR11DLB3H

Description:

1 - Flat printed circuit connector (30 Pin)

COMPATIBILITY:

MacBook Unibody 13" A1278

MacBook5,1 Late 2008: MB466LL/A (2.0 GHz Core 2 Duo)

MacBook5,1 Late 2008: MB467LL/A (2.4 GHz Core 2 Duo)

MacBook Unibody 13" A1342

MacBook6,1 Late 2009: MC207LL/A (2.26 GHz Core 2 Duo)

MacBook7,1 Mid 2010: MC516LL/A (2.4 GHz Core 2 Duo)

MacBook Pro Unibody 13" A1278

MacBookPro5,5 Mid 2009: MB990LL/A (2.26 GHz Core 2 Duo)

MacBookPro5,5 Mid 2009: MB991LL/A (2.53 GHz Core 2 Duo)

MacBookPro7,1 Mid 2010: MC374LL/A (2.4 GHz Core 2 Duo)

MacBookPro7,1 Mid 2010: MC375LL/A (2.66 GHz Core 2 Duo)

MacBookPro8,1 Early 2011: MC700LL/A (2.3 GHz Core i5)

MacBookPro8,1 Early 2011: MC724LL/A (2.7 GHz Core i7)

MacBookPro8,1 Late 2011: MD313LL/A (2.4 GHz Core i5)

MacBookPro8,1 Late 2011: MD314LL/A (2.8 GHz Core i7)

MacBookPro9,2 Mid 2012: MD101LL/A (2.5 GHz Core i5)

MacBookPro9,2 Mid 2012: MD102LL/A (2.9 GHz Core i7)

MacBook Pro Unibody 15" A1286

MacBookPro5,1 Late 2008: MB470LL/A (2.4 GHz Core 2 Duo)

MacBookPro5,1 Late 2008: MB471LL/A (2.53 GHz Core 2 Duo)

MacBookPro5,1 Late 2008: MB471LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,1 Early 2009: MC026LL/A (2.66 GHz Core 2 Duo)

MacBookPro5,1 Early 2009: MC026LL/A (2.93 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB985LL/A (2.66 Ghz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB986LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB986LL/A (3.06 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MC406LL/A (2.8 GHz Core 2 Duo) (Anti-Glare Display)

MacBookPro5,3 Mid 2009: MC406LL/A (3.06 GHz Core 2 Duo) (Anti-Glare Display)

MacBookPro5,4 Mid 2009: MC118LL/A (2.53 GHz Core 2 Duo)

MacBookPro6,2 Mid 2010: MC371LL/A (2.4 GHz Core i5)

MacBookPro6,2 Mid 2010: MC372LL/A (2.53 GHz Core i5)

MacBookPro6,2 Mid 2010: MC373LL/A (2.66 GHz Core i7)

MacBookPro6,2 Mid 2010: MC373LL/A (2.8 GHZ Core i7)

MacBookPro8,2 Early 2011: MC721LL/A (2.0 GHz Core i7)

MacBookPro8,2 Early 2011: MC723LL/A (2.2 GHz Core i7)

MacBookPro8,2 Early 2011: MD035LL/A (2.3 GHz Core i7)

MacBookPro8,2 Late 2011: MD318LL/A (2.2 GHz Core i7)

MacBookPro8,2 Late 2011: MD322LL/A (2.4 GHz Core i7)

MacBookPro8,2 Late 2011: MD322LL/A (2.5 GHz Core i7)

MacBookPro9,1 Mid 2012: MD103LL/A (2.3 GHz Core i7)

MacBookPro9,1 Mid 2012: MD104LL/A (2.6 GHz Core i7)

MacBookPro9,1 Mid 2012: MD104LL/A (2.7 GHz Core i7)

MacBook Pro Unibody 17" A1297

MacBookPro5,2 Early 2009: MB604LL/A (2.66 GHz Core 2 Duo)

MacBookPro5,2 Early 2009: MB604LL/A (2.93 GHz Core 2 Duo)

MacBookPro5,2 Mid 2009: MC226LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,2 Mid 2009: MC226LL/A (3.06 GHz Core 2 Duo)

MacBookPro6,1 Mid 2010: MC024LL/A (2.53 GHz Core i5)

MacBookPro6,1 Mid 2010: MC024LL/A (2.66 GHz Core i7)

MacBookPro6,1 Mid 2010: MC024LL/A (2.8 GHz Core i7)

MacBookPro8,3 Early 2011: MC725LL/A (2.2 GHz Core i7)

MacBookPro8,3 Early 2011: MC725LL/A (2.3 GHz Core i7)

MacBookPro8,3 Late 2011: MD311LL/A (2.4 GHz Core i7)

CH000962
€4.35

DDK FUJIKURA FPC FLEXIBLE PRINTED CIRCUIT CONNECTOR 30 PIN FF14A-30C-R11DL-B-3H

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N13PGT1A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000718
€5.40

N13P-GT1-A2 Stencil Template

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1.0m OMEGA KTYPE Thermocouple TTK30SLE

OMEGA thermocouple line

Model: temperature range: -200? ~260? (PTFE material) -200-500? (glass fiber material)

Wire diameter: 2*F0.127mm 2*0.255MM

Core material: nickel chromium / nickel silicon (K) copper / constantan (T) iron / copper nickel (J)

Color mark: red is negative / yellow is positive

The thermocouple temperature line for any K type imported and domestic use temperature recording instrument, used in the laboratory, aerospace engineering, shipbuilding, petrochemical, machinery fittings (reflow) etc.

CH000967
€5.59

1.0m OMEGA K-TYPE Thermocouple TT-K-30-SLE

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2150848004 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000734
€9.97

215-0848004 Stencil Template 90*90

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