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  • Categories: BGA Reballing Kits, Stencils
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i32350M SR0DQ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000682
€9.97

i3-2350M SR0DQ Stencil Template 90*90

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G84602A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000686
€5.40

G84-602-A2 Stencil Template

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Pentium DualCore Mobile 987 SR0V4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000688
€5.40

Pentium Dual-Core Mobile 987 SR0V4 Stencil Template

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ZOTEK VC17B Automatic Manual Digital Large LCD Screen Display AC DC Multimeter TX

Features:

Auto/manual ranges True RMS measurement

550V protection in resistance and capacitance ranges Large LCD display,MAX display 6000 counts Sample rate: 3 times per second

backlight MAX/MIN data hold Polarity identification Low voltage indication

20A high current measurement is available Auto power off can be cancelled manually

Main measurements:AC/DC Voltage, AC/DC Current, Resistance,Capacitance, Diode and Continuity Testing,Temperature, Frequency and duty cycle.

Frequency:1Hz to 20MHz

Temperature:-20? to 1000?(-4? to 1832?)

Capacitance :10pF to 6000uF

AC volts: 0.1mV to 750V

DC volts:0.1mV to 1000V

AC current:0.1uA to 20A

DC current:0.1uA to 20A

Resistance :0.1O to 60MO

Duty cycle:1% to 99%

Specifications:

1.frequency:5/50/500/5k/50k/500k/5M/20M (0.1+3)

2.Temperature:?400? (1.0%+5),=400?(1.5%+15)?752? (1.0%+5),=752?(1.5%+15)(3)capacitance:10nF(5.0+20),100nF/1uF/10uF/100uF(2.0%+5),1000uF/10000uF(5.0%+5)

3.DC volt:600mV(1.0%+10), 6V/60V/600V/1000V(0.5%+3)

4.AC volt:600mV(3.0%+3),6V/60V/600V/750V(1.0%+3)

5.ACA/DCA:600uA/6000uA(1.5%+3),60mA/600mA/20A(1.5%+3)

6.Resistance:600O(0.5%+3),6K/60K/600K/6M(0.5%+2),60MO(1.5%+3) (8)Duty cycle:1% to 99%(1%)

7. Measurement mode: Double-integral style A/D transform

10.Supply power: 2 x 1.5V AA batteries (not include)

11.Dimension: 180*90.5*45mm

12.Weight: 420g

Package Includes:

1 x Digital Multimeter

1 x User's manual

a pair of test leads

CH004853
€22.75

ZOTEK VC17B+ Automatic Manual Digital Large LCD Screen Display AC DC Multimeter TX

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BD82HM65 SLH9D Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000689
€5.40

BD82HM65 SLH9D Stencil Template

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AM950BADY23AB Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000694
€9.97

AM950BADY23AB Stencil Template 90*90

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BD82HM75 SLJ8F Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000696
€9.97

BD82HM75 SLJ8F Stencil Template 90*90

i32350M SR0DQ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000682
€9.97

i3-2350M SR0DQ Stencil Template 90*90

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Compare

G84602A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000686
€5.40

G84-602-A2 Stencil Template

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Pentium DualCore Mobile 987 SR0V4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000688
€5.40

Pentium Dual-Core Mobile 987 SR0V4 Stencil Template

wishlist
Compare

ZOTEK VC17B Automatic Manual Digital Large LCD Screen Display AC DC Multimeter TX

Features:

Auto/manual ranges True RMS measurement

550V protection in resistance and capacitance ranges Large LCD display,MAX display 6000 counts Sample rate: 3 times per second

backlight MAX/MIN data hold Polarity identification Low voltage indication

20A high current measurement is available Auto power off can be cancelled manually

Main measurements:AC/DC Voltage, AC/DC Current, Resistance,Capacitance, Diode and Continuity Testing,Temperature, Frequency and duty cycle.

Frequency:1Hz to 20MHz

Temperature:-20? to 1000?(-4? to 1832?)

Capacitance :10pF to 6000uF

AC volts: 0.1mV to 750V

DC volts:0.1mV to 1000V

AC current:0.1uA to 20A

DC current:0.1uA to 20A

Resistance :0.1O to 60MO

Duty cycle:1% to 99%

Specifications:

1.frequency:5/50/500/5k/50k/500k/5M/20M (0.1+3)

2.Temperature:?400? (1.0%+5),=400?(1.5%+15)?752? (1.0%+5),=752?(1.5%+15)(3)capacitance:10nF(5.0+20),100nF/1uF/10uF/100uF(2.0%+5),1000uF/10000uF(5.0%+5)

3.DC volt:600mV(1.0%+10), 6V/60V/600V/1000V(0.5%+3)

4.AC volt:600mV(3.0%+3),6V/60V/600V/750V(1.0%+3)

5.ACA/DCA:600uA/6000uA(1.5%+3),60mA/600mA/20A(1.5%+3)

6.Resistance:600O(0.5%+3),6K/60K/600K/6M(0.5%+2),60MO(1.5%+3) (8)Duty cycle:1% to 99%(1%)

7. Measurement mode: Double-integral style A/D transform

10.Supply power: 2 x 1.5V AA batteries (not include)

11.Dimension: 180*90.5*45mm

12.Weight: 420g

Package Includes:

1 x Digital Multimeter

1 x User's manual

a pair of test leads

CH004853
€22.75

ZOTEK VC17B+ Automatic Manual Digital Large LCD Screen Display AC DC Multimeter TX

wishlist
Compare

BD82HM65 SLH9D Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000689
€5.40

BD82HM65 SLH9D Stencil Template

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Compare

AM950BADY23AB Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000694
€9.97

AM950BADY23AB Stencil Template 90*90

wishlist
Compare

BD82HM75 SLJ8F Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000696
€9.97

BD82HM75 SLJ8F Stencil Template 90*90

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Compare
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