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  • Categories: CPU and Graphic Chips
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A1706 EMC 3163 Bios Chip EFI Firmware 820-00923 Mid2017 13 Core i7 I77567U BTOCTO

PO000109
€18.00 €22.50

A1706 EMC 3163 Bios EFI Firmware 820-00923 Mid-2017 13 Core i7 I7-7567U BTO/CTO

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N13MGEBA2

N13M-GE-B-A2

Part Number N13M-GE-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1429

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001530
€25.93

N13M-GE-B-A2

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A1398 EMC 2512 Bios Chip EFI Firmware 820-3332 Retina Mid2012 Core i7 I73615QM MC975LLA

PO000110
€18.00 €22.50

A1398 EMC 2512 Bios EFI Firmware 820-3332 Retina Mid-2012 Core i7 I7-3615QM MC975LL/A

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N13MGSSA2

N13M-GS-S-A2

Part Number N13M-GS-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001531
€16.21

N13M-GS-S-A2

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2160856050

216-0856050

Part Number 216-0856050 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1416

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001542
€20.90

216-0856050

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A1398 EMC 2512 Bios Chip EFI Firmware 820-3332 Retina Mid2012 Core i7 I73720QM MC976LLA

PO000111
€18.00 €22.50

A1398 EMC 2512 Bios EFI Firmware 820-3332 Retina Mid-2012 Core i7 I7-3720QM MC976LL/A

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N12PNS2SA1 GT540M

N12P-NS2-S-A1 GT540M

Part Number N12P-NS2-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001548
€24.62

N12P-NS2-S-A1 GT540M

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N13MGE1SA1

N13M-GE1-S-A1

Part Number N13M-GE1-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1240

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001549
€24.62

N13M-GE1-S-A1

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A1398 EMC 2673 Bios Chip EFI Firmware 820-3332 Retina Early 2013 Core i7 I73635QM ME664LLA

PO000113
€18.00 €22.50

A1398 EMC 2673 Bios EFI Firmware 820-3332 Retina Early 2013 Core i7 I7-3635QM ME664LL/A

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A1398 EMC 2673 Bios Chip EFI Firmware 820-3332 Retina Early 2013 Core i7 I73740QM ME665LLA

PO000114
€18.00 €22.50

A1398 EMC 2673 Bios EFI Firmware 820-3332 Retina Early 2013 Core i7 I7-3740QM ME665LL/A

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2160732025 HD4850M

216-0732025 HD4850M

Part Number 216-0732025 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Manufacturer refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001562
€26.12

216-0732025 HD4850M

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2160728018 HD4570

216-0728018 HD4570

Part Number 216-0728018 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001572
€66.17

216-0728018 HD4570

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A1706 EMC 3163 Bios Chip EFI Firmware 820-00923 Mid2017 13 Core i7 I77567U BTOCTO

PO000109
€18.00 €22.50

A1706 EMC 3163 Bios EFI Firmware 820-00923 Mid-2017 13 Core i7 I7-7567U BTO/CTO

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N13MGEBA2

N13M-GE-B-A2

Part Number N13M-GE-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1429

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001530
€25.93

N13M-GE-B-A2

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A1398 EMC 2512 Bios Chip EFI Firmware 820-3332 Retina Mid2012 Core i7 I73615QM MC975LLA

PO000110
€18.00 €22.50

A1398 EMC 2512 Bios EFI Firmware 820-3332 Retina Mid-2012 Core i7 I7-3615QM MC975LL/A

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N13MGSSA2

N13M-GS-S-A2

Part Number N13M-GS-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001531
€16.21

N13M-GS-S-A2

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2160856050

216-0856050

Part Number 216-0856050 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1416

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001542
€20.90

216-0856050

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A1398 EMC 2512 Bios Chip EFI Firmware 820-3332 Retina Mid2012 Core i7 I73720QM MC976LLA

PO000111
€18.00 €22.50

A1398 EMC 2512 Bios EFI Firmware 820-3332 Retina Mid-2012 Core i7 I7-3720QM MC976LL/A

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N12PNS2SA1 GT540M

N12P-NS2-S-A1 GT540M

Part Number N12P-NS2-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001548
€24.62

N12P-NS2-S-A1 GT540M

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N13MGE1SA1

N13M-GE1-S-A1

Part Number N13M-GE1-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1240

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001549
€24.62

N13M-GE1-S-A1

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A1398 EMC 2673 Bios Chip EFI Firmware 820-3332 Retina Early 2013 Core i7 I73635QM ME664LLA

PO000113
€18.00 €22.50

A1398 EMC 2673 Bios EFI Firmware 820-3332 Retina Early 2013 Core i7 I7-3635QM ME664LL/A

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A1398 EMC 2673 Bios Chip EFI Firmware 820-3332 Retina Early 2013 Core i7 I73740QM ME665LLA

PO000114
€18.00 €22.50

A1398 EMC 2673 Bios EFI Firmware 820-3332 Retina Early 2013 Core i7 I7-3740QM ME665LL/A

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2160732025 HD4850M

216-0732025 HD4850M

Part Number 216-0732025 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Manufacturer refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001562
€26.12

216-0732025 HD4850M

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2160728018 HD4570

216-0728018 HD4570

Part Number 216-0728018 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001572
€66.17

216-0728018 HD4570

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