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  • Categories: Bios Chip Programming
  • Categories: EFI Rom Cable
  • Categories: Other BGA Chips & ICs
  • Categories: Programmer socket
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A1502 EMC 2835 Bios Chip EFI Firmware 820-4924 Retina Early 2015 13 Core i5 I55257U MF839LLA

PO000097
€18.00 €22.50

A1502 EMC 2835 Bios EFI Firmware 820-4924 Retina Early 2015 13 Core i5 I5-5257U MF839LL/A

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MAX77686

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000629
€4.77

MAX77686

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A1502 EMC 2835 Bios Chip EFI Firmware 820-4924 Retina Early 2015 13 Core i5 I55287U MF841LLA

PO000098
€18.00 €22.50

A1502 EMC 2835 Bios EFI Firmware 820-4924 Retina Early 2015 13 Core i5 I5-5287U MF841LL/A

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98EX125BCD

98EX125-BCD

Part Number 98EX125-BCD Manufacturer MARVELL

BGA Alloy No Pb/Lead Free Date Code 05+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000634
€53.69

98EX125-BCD

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A1502 EMC 2835 Bios Chip EFI Firmware 820-4924 Retina Early 2015 13 Core i7 I75557U MF843LLA

PO000099
€18.00 €22.50

A1502 EMC 2835 Bios EFI Firmware 820-4924 Retina Early 2015 13 Core i7 I7-5557U MF843LL/A

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RICHTEK RT8204C H6

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000635
€3.45

RICHTEK RT8204C (H6=)

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A1708 EMC 2978 Bios Chip EFI Firmware 820-00875 Late 2016 13 Core i5 I56360U MLL42LLA

PO000100
€18.00 €22.50

A1708 EMC 2978 Bios EFI Firmware 820-00875 Late 2016 13 Core i5 I5-6360U MLL42LL/A

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A1708 EMC 2978 Bios Chip EFI Firmware 820-00875 Late 2016 13 Core i7 I76660U BTOCTO

PO000101
€18.00 €22.50

A1708 EMC 2978 Bios EFI Firmware 820-00875 Late 2016 13 Core i7 I7-6660U BTO/CTO

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Maxim MAX4019

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000637
€9.53

Maxim MAX4019

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Diodes AP6680GM

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000638
€3.45

Diodes AP6680GM

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Maxim MAX1987

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000642
€3.45

Maxim MAX1987

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A1706 EMC 3071 Bios Chip EFI Firmware 820-00239 Late 2016 13 Core i5 I56287U BTOCTO

PO000103
€18.00 €22.50

A1706 EMC 3071 Bios EFI Firmware 820-00239 Late 2016 13 Core i5 I5-6287U BTO/CTO

  • -20%

A1502 EMC 2835 Bios Chip EFI Firmware 820-4924 Retina Early 2015 13 Core i5 I55257U MF839LLA

PO000097
€18.00 €22.50

A1502 EMC 2835 Bios EFI Firmware 820-4924 Retina Early 2015 13 Core i5 I5-5257U MF839LL/A

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MAX77686

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000629
€4.77

MAX77686

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  • -20%

A1502 EMC 2835 Bios Chip EFI Firmware 820-4924 Retina Early 2015 13 Core i5 I55287U MF841LLA

PO000098
€18.00 €22.50

A1502 EMC 2835 Bios EFI Firmware 820-4924 Retina Early 2015 13 Core i5 I5-5287U MF841LL/A

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98EX125BCD

98EX125-BCD

Part Number 98EX125-BCD Manufacturer MARVELL

BGA Alloy No Pb/Lead Free Date Code 05+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000634
€53.69

98EX125-BCD

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  • -20%

A1502 EMC 2835 Bios Chip EFI Firmware 820-4924 Retina Early 2015 13 Core i7 I75557U MF843LLA

PO000099
€18.00 €22.50

A1502 EMC 2835 Bios EFI Firmware 820-4924 Retina Early 2015 13 Core i7 I7-5557U MF843LL/A

wishlist
Compare

RICHTEK RT8204C H6

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000635
€3.45

RICHTEK RT8204C (H6=)

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  • -20%

A1708 EMC 2978 Bios Chip EFI Firmware 820-00875 Late 2016 13 Core i5 I56360U MLL42LLA

PO000100
€18.00 €22.50

A1708 EMC 2978 Bios EFI Firmware 820-00875 Late 2016 13 Core i5 I5-6360U MLL42LL/A

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  • -20%

A1708 EMC 2978 Bios Chip EFI Firmware 820-00875 Late 2016 13 Core i7 I76660U BTOCTO

PO000101
€18.00 €22.50

A1708 EMC 2978 Bios EFI Firmware 820-00875 Late 2016 13 Core i7 I7-6660U BTO/CTO

wishlist
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Maxim MAX4019

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000637
€9.53

Maxim MAX4019

wishlist
Compare

Diodes AP6680GM

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000638
€3.45

Diodes AP6680GM

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Maxim MAX1987

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000642
€3.45

Maxim MAX1987

wishlist
Compare
  • -20%

A1706 EMC 3071 Bios Chip EFI Firmware 820-00239 Late 2016 13 Core i5 I56287U BTOCTO

PO000103
€18.00 €22.50

A1706 EMC 3071 Bios EFI Firmware 820-00239 Late 2016 13 Core i5 I5-6287U BTO/CTO

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