Repair Tool Set CPU Scraper Removal: * Chip Repair Tool Set CPU Scraper Removal Chip

SR0HR

Part Number SR0HR Manufacturer INTEL

Socket Type rPGA988B Date Code 13+

Package/Case 1 PCS Description Brand new

SR0HR FF8062700848702 B830 Mobile Celeron Dual-Core 1.8 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N10M-NE-S-A3

Part Number N1N10M-NE-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

LVDS Cable for screen HP G7-2000 p/n: DD0R39LC000 DD0R39LC010 DD0R39LC020 630495-001 682743-00

This is mainly a hdmi camera, if you need it get higher image quality for usb output pls choose the professional usb camera or contact us before place the order so we will give you some suggestion.

For USB output, the white balance, exposure and color adjustment are automatic, they can't be adjusted.

Specification:

Image sensor: SONY CMOS 1/2.9

Pexil size: 2.85 2.85m

Video output: full hd 1080p ( via HDMI), 720P( via USB)

Image resolution: 4608*3456( via HDMI)

Video recording: 1080p ( via HDMI )

Image format: jpeg

Lens: C/CS

Resolution:1920*1080@30fos, 720p 160@fps

TF card interface: max 64G

Pc support: windows XP/7/8/10 system, HAYEAR measure software ( gift )

Digital zoom: 4 times digital zoom

Language: English, Chinese, Japanese, French, Germany, Italy, Korean, Turkey, Russia

Camera dimension: 50mm*50mm*43mm

Package dimension:16cm*10cm*8cm / 0.3kg

Supply USB2.0,HDMI HD video,Two output ports

We sell much to the industry factory, they can see the problems directly in the Monitor via the camera.

C-MOUNT Lens:

Zoom c-mount Lens

Magnification Power by 0.12 - 2X (about 8 - 120X on the display)

Work distance:55mm-200mm

Visual field :2.4mm-32mm

Size: 115mm(L) * 40mm(DIA)

Package Including:

1 x 16 MP Camera

1 x power supply

1 x USB line

1 x HDMI line

1 x Software DISC

1 x 120x Zoom C-mount Lens

1 x Camera Stand

GF116-200-KA-A1 GTS450

Part Number GF116-200-KA-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1238

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

216-0841000

Part Number 216-0841000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Key Features:

Provides intense and focused shadow-free illumination

2.5" (62.5mm) inside and 3.64" (92.5mm) overall outside diameters

Power input: 110-240V, 50-60HZ, auto switching

1-7/8" (48 mm in diameter) ring adapter included

One YEAR WARRANTY from AmScope Including Parts & Labor!

Brand Name: AmScope Model No: LED-144W-ZK

This is a 144-LED intensity adjustable ring light for stereo microscopes with mounting size 2.4" (61mm) in diameter. The ring light has 2.5" (62.5mm) inside and 3.64" (92.5mm) overall outside diameters. It works with power supplies from a 100-240V and comes with a 1-7/8" (48 mm in diameter) ring adapter. With variable intensity control, it provides cool, even, intense and focused shadow-free illumination. It is an ideal durable cool light source for all stereo microscopes. This kit comes with one year warranty against manufacturing defects./p>

Features & Specifications:

144 bright white LED bulbs

6000K color temperature

Variable intensity control

Intense and focused shadow-free illumination

Power input: 100-240V, 50-60HZ, auto switching

Fits up to 2.4" (61mm) mount rings

Inside diameter of the ring light: 2.5" (62.5mm)

Mounting flange has.63" (16mm) depth

48mm threaded mounting ring has 53.75mm outer diameter

Overall outside diameter: 4" (100mm)

Packing List:

One 144-LED Ring Light

One Power Adapter

One 48mm Ring Adapter

N13M-GS-B-A2

Part Number N13M-GS-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1428

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Aluminium Foil Tape 50mm*40m Roll Ideal For Heat Reflection

Part Number Aluminum foil tape Material Foil

Weight 380g Color Silver

Package/Case 1 PCS Width & Length 50mm*40m

SR1EF i5-4210U

Part Number SR1EF i5-4210U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1339

Package/Case 440 PCS Description Original new

SR1EF i5-4210U CL8064701477802 Intel Core i5 Mobile CPU BGA1168 1.7 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

218-0844012 FCH Hudson M1

Part Number 218-0844012 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1247

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock