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  • Categories: BGA Reballing Kits, Stencils
  • Categories: Laptop Parts, Repair tool
  • Categories: PCI, CPU Socket Tester
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SR2W8 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000671
€9.97

SR2W8 Stencil Template 90*90

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GF110375A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000675
€5.59

GF110-375-A1 Stencil Template

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N3510 SR1LV Stencil Template

N3510 SR1LV Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000676
€6.22

N3510 SR1LV Stencil Template

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9V20V Universal CCFL LCD Display Screen Inverter Board INPUT

Features:

Voltage:9V-20V

A small interface

Interface Definition:VIN(power) On/Off(switch) ADJ(brightness control)GND(ground)

Size:9*1*0.43cm

Suitable for laptop repair and modification-small valum-super wide votage design- support 9V-12V-15V-16V-26V and 20V , every voltage conected to three wires , will be lighted up convenient necessary accessories of laptop maintenance.

Package includes:

1*inverter

CH000925
€2.70

9V-20V Universal CCFL LCD Display Screen Inverter Board INPUT

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i32350M SR0DQ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000682
€9.97

i3-2350M SR0DQ Stencil Template 90*90

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G84602A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000686
€5.40

G84-602-A2 Stencil Template

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Pentium DualCore Mobile 987 SR0V4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000688
€5.40

Pentium Dual-Core Mobile 987 SR0V4 Stencil Template

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800pcs AntiStatic ESD Rubber Finger Cot Protector Cover

Latex Finger Cots are comfortably be worn all day for improved performance in assembly.

It can reduce static that widely use in industrial, such as electronic repair or electronic DIY.

Product Name : Finger Cots;Material : Latex

Quantity : 100Pcs;Folded Size (Approx.) : 2 x 0.3cm/ 0.79" x 0.12"(D*H)

Unfolded Size (Approx.) : 1.5 x 6.5cm/ 0.59" x 2.56"(D*L);Color : Off White

Weight : 500g

Package Content : 800(+/- 2%) x Finger Cots

CH000935
€7.34

800pcs Anti-Static ESD Rubber Finger Cot Protector Cover

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BD82HM65 SLH9D Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000689
€5.40

BD82HM65 SLH9D Stencil Template

SR2W8 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000671
€9.97

SR2W8 Stencil Template 90*90

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GF110375A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000675
€5.59

GF110-375-A1 Stencil Template

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Compare

N3510 SR1LV Stencil Template

N3510 SR1LV Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000676
€6.22

N3510 SR1LV Stencil Template

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Compare

9V20V Universal CCFL LCD Display Screen Inverter Board INPUT

Features:

Voltage:9V-20V

A small interface

Interface Definition:VIN(power) On/Off(switch) ADJ(brightness control)GND(ground)

Size:9*1*0.43cm

Suitable for laptop repair and modification-small valum-super wide votage design- support 9V-12V-15V-16V-26V and 20V , every voltage conected to three wires , will be lighted up convenient necessary accessories of laptop maintenance.

Package includes:

1*inverter

CH000925
€2.70

9V-20V Universal CCFL LCD Display Screen Inverter Board INPUT

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i32350M SR0DQ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000682
€9.97

i3-2350M SR0DQ Stencil Template 90*90

wishlist
Compare

G84602A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000686
€5.40

G84-602-A2 Stencil Template

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Compare

Pentium DualCore Mobile 987 SR0V4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000688
€5.40

Pentium Dual-Core Mobile 987 SR0V4 Stencil Template

wishlist
Compare

800pcs AntiStatic ESD Rubber Finger Cot Protector Cover

Latex Finger Cots are comfortably be worn all day for improved performance in assembly.

It can reduce static that widely use in industrial, such as electronic repair or electronic DIY.

Product Name : Finger Cots;Material : Latex

Quantity : 100Pcs;Folded Size (Approx.) : 2 x 0.3cm/ 0.79" x 0.12"(D*H)

Unfolded Size (Approx.) : 1.5 x 6.5cm/ 0.59" x 2.56"(D*L);Color : Off White

Weight : 500g

Package Content : 800(+/- 2%) x Finger Cots

CH000935
€7.34

800pcs Anti-Static ESD Rubber Finger Cot Protector Cover

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Compare

BD82HM65 SLH9D Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000689
€5.40

BD82HM65 SLH9D Stencil Template

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Compare
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