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  • Categories: Bios Chip Programming
  • Categories: Other BGA Chips & ICs
  • Categories: Programmer socket
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A1706 EMC 3071 Bios Chip EFI Firmware 820-00239 Late 2016 13 Core i7 I76567U BTOCTO

PO000104
€18.00 €22.50

A1706 EMC 3071 Bios EFI Firmware 820-00239 Late 2016 13 Core i7 I7-6567U BTO/CTO

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RICHTEK RT8015A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000643
€3.45

RICHTEK RT8015A

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A1708 EMC 3164 Bios Chip EFI Firmware 820-00840 Mid2017 13 Core i5 I57360U MPXQ2LLA

PO000105
€18.00 €22.50

A1708 EMC 3164 Bios EFI Firmware 820-00840 Mid-2017 13 Core i5 I5-7360U MPXQ2LL/A

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MT5389FHNU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000645
€15.89

MT5389FHNU

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A1708 EMC 3164 Bios Chip EFI Firmware 820-00840 Mid2017 13 Core i7 I77660U BTOCTO

PO000106
€18.00 €22.50

A1708 EMC 3164 Bios EFI Firmware 820-00840 Mid-2017 13 Core i7 I7-7660U BTO/CTO

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SILEGO SLG8SP513V

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000648
€3.45

SILEGO SLG8SP513V

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TI TPS51427TI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000650
€3.45

TI TPS51427TI

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A1706 EMC 3163 Bios Chip EFI Firmware 820-00923 Mid2017 13 Core i5 I57267U MPXV2LLA

PO000107
€18.00 €22.50

A1706 EMC 3163 Bios EFI Firmware 820-00923 Mid-2017 13 Core i5 I5-7267U MPXV2LL/A

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QUALCOMM SMB347ET1699Y

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000651
€3.45

QUALCOMM SMB347ET-1699Y

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A1706 EMC 3163 Bios Chip EFI Firmware 820-00923 Mid2017 13 Core i5 I57287U BTOCTO

PO000108
€18.00 €22.50

A1706 EMC 3163 Bios EFI Firmware 820-00923 Mid-2017 13 Core i5 I5-7287U BTO/CTO

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A1706 EMC 3163 Bios Chip EFI Firmware 820-00923 Mid2017 13 Core i7 I77567U BTOCTO

PO000109
€18.00 €22.50

A1706 EMC 3163 Bios EFI Firmware 820-00923 Mid-2017 13 Core i7 I7-7567U BTO/CTO

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ITE IT8502E KXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000652
€3.45

ITE IT8502E (KXO)

  • -20%

A1706 EMC 3071 Bios Chip EFI Firmware 820-00239 Late 2016 13 Core i7 I76567U BTOCTO

PO000104
€18.00 €22.50

A1706 EMC 3071 Bios EFI Firmware 820-00239 Late 2016 13 Core i7 I7-6567U BTO/CTO

wishlist
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RICHTEK RT8015A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000643
€3.45

RICHTEK RT8015A

wishlist
Compare
  • -20%

A1708 EMC 3164 Bios Chip EFI Firmware 820-00840 Mid2017 13 Core i5 I57360U MPXQ2LLA

PO000105
€18.00 €22.50

A1708 EMC 3164 Bios EFI Firmware 820-00840 Mid-2017 13 Core i5 I5-7360U MPXQ2LL/A

wishlist
Compare

MT5389FHNU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000645
€15.89

MT5389FHNU

wishlist
Compare
  • -20%

A1708 EMC 3164 Bios Chip EFI Firmware 820-00840 Mid2017 13 Core i7 I77660U BTOCTO

PO000106
€18.00 €22.50

A1708 EMC 3164 Bios EFI Firmware 820-00840 Mid-2017 13 Core i7 I7-7660U BTO/CTO

wishlist
Compare

SILEGO SLG8SP513V

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000648
€3.45

SILEGO SLG8SP513V

wishlist
Compare

TI TPS51427TI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000650
€3.45

TI TPS51427TI

wishlist
Compare
  • -20%

A1706 EMC 3163 Bios Chip EFI Firmware 820-00923 Mid2017 13 Core i5 I57267U MPXV2LLA

PO000107
€18.00 €22.50

A1706 EMC 3163 Bios EFI Firmware 820-00923 Mid-2017 13 Core i5 I5-7267U MPXV2LL/A

wishlist
Compare

QUALCOMM SMB347ET1699Y

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000651
€3.45

QUALCOMM SMB347ET-1699Y

wishlist
Compare
  • -20%

A1706 EMC 3163 Bios Chip EFI Firmware 820-00923 Mid2017 13 Core i5 I57287U BTOCTO

PO000108
€18.00 €22.50

A1706 EMC 3163 Bios EFI Firmware 820-00923 Mid-2017 13 Core i5 I5-7287U BTO/CTO

wishlist
Compare
  • -20%

A1706 EMC 3163 Bios Chip EFI Firmware 820-00923 Mid2017 13 Core i7 I77567U BTOCTO

PO000109
€18.00 €22.50

A1706 EMC 3163 Bios EFI Firmware 820-00923 Mid-2017 13 Core i7 I7-7567U BTO/CTO

wishlist
Compare

ITE IT8502E KXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000652
€3.45

ITE IT8502E (KXO)

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