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Realtek ALC3234

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002913
€3.45

Realtek ALC3234

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iphone6S PLUS Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002915
€5.72

iphone6S PLUS Stencil Template

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AM5745SIE44HL A105745M

AM5745SIE44HL A10-5745M

Part Number AM5745SIE44HL Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1339

Package/Case 1 PCS Description Brand new

AM5745SIE44HL A10-5745M Processor for Laptop AMD A-Series BGA827 2.1 GHz CPU 4 cores

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002916
€47.37

AM5745SIE44HL A10-5745M

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LEAP LER121A EPROM Eraser with Timer for ATMEL Microcontroller Programmes PI

EPROM Eraser LER-121A (220V)

Features:

? Equipped with electronic starter, extend the product life.

? Mechanical timer can be set from 0 to 60 minutes.

? All ICs are ensured for maximum UV exposure.

? Protect users from UV exposure by equipped with automatic UV shut off switch when

opening the device drawer.

? LED on the top panel to indicate the status of UV tube.

? Provide almost completely erase area.

? Light, rugged metal construction.

? Erase time is approximately 15 minutes.

Specifications:

Erase Quantity 12 pcs (24 PIN)

Dimension 9.5 x 3.3 x 3.7 (24cm x 8.5cm x 9.5cm)

Weight 2.6 Lbs. (1.2 Kg)

Operating Altitude up to 5000m

Operating Humidity 90% (non-condensing)

Temperature +41F ~ +113F (+5C ~ +45C)

Warranty Support:

Both LER-121A and LER-123A are warranted to be free of manufacturing or workmanship

defects for one year from the date of purchase. Online Technical Supportis also available 24

hours or you may call us during our business hours through Friday 8:30am to 5:30pm (PST).

Items Included:

? EPROM Eraser LER-121A (220V)

? Power Adapter 9V/500mA

? User Manual

EPROM Eraser w/ Electronic starter, Powerful UV tube,Erase time is approximately 15

minutes

CH002917
€185.24

LEAP LER-121A EPROM Eraser with Timer for ATMEL Microcontroller Programmes, PI

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SEMTECH SC471MLTRT

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002919
€3.45

SEMTECH SC471MLTRT

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N14EGTXA2 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002920
€17.14

N14E-GTX-A2 Stencil Template 90*90

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Realtek RTS5117

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002921
€3.45

Realtek RTS5117

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i33110M SR0T4 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002922
€17.14

i3-3110M SR0T4 Stencil Template 90*90

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N11MGE2SB1 G310M

N11M-GE2-S-B1 G310M

Part Number N11M-GE2-S-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1332

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002923
€15.59

N11M-GE2-S-B1 G310M

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i33217U SR0N9 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002924
€5.40

i3-3217U SR0N9 Stencil Template

Realtek ALC3234

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002913
€3.45

Realtek ALC3234

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Compare

iphone6S PLUS Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002915
€5.72

iphone6S PLUS Stencil Template

wishlist
Compare

AM5745SIE44HL A105745M

AM5745SIE44HL A10-5745M

Part Number AM5745SIE44HL Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1339

Package/Case 1 PCS Description Brand new

AM5745SIE44HL A10-5745M Processor for Laptop AMD A-Series BGA827 2.1 GHz CPU 4 cores

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002916
€47.37

AM5745SIE44HL A10-5745M

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Compare

LEAP LER121A EPROM Eraser with Timer for ATMEL Microcontroller Programmes PI

EPROM Eraser LER-121A (220V)

Features:

? Equipped with electronic starter, extend the product life.

? Mechanical timer can be set from 0 to 60 minutes.

? All ICs are ensured for maximum UV exposure.

? Protect users from UV exposure by equipped with automatic UV shut off switch when

opening the device drawer.

? LED on the top panel to indicate the status of UV tube.

? Provide almost completely erase area.

? Light, rugged metal construction.

? Erase time is approximately 15 minutes.

Specifications:

Erase Quantity 12 pcs (24 PIN)

Dimension 9.5 x 3.3 x 3.7 (24cm x 8.5cm x 9.5cm)

Weight 2.6 Lbs. (1.2 Kg)

Operating Altitude up to 5000m

Operating Humidity 90% (non-condensing)

Temperature +41F ~ +113F (+5C ~ +45C)

Warranty Support:

Both LER-121A and LER-123A are warranted to be free of manufacturing or workmanship

defects for one year from the date of purchase. Online Technical Supportis also available 24

hours or you may call us during our business hours through Friday 8:30am to 5:30pm (PST).

Items Included:

? EPROM Eraser LER-121A (220V)

? Power Adapter 9V/500mA

? User Manual

EPROM Eraser w/ Electronic starter, Powerful UV tube,Erase time is approximately 15

minutes

CH002917
€185.24

LEAP LER-121A EPROM Eraser with Timer for ATMEL Microcontroller Programmes, PI

wishlist
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SEMTECH SC471MLTRT

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002919
€3.45

SEMTECH SC471MLTRT

wishlist
Compare

N14EGTXA2 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002920
€17.14

N14E-GTX-A2 Stencil Template 90*90

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Compare

Realtek RTS5117

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002921
€3.45

Realtek RTS5117

wishlist
Compare

i33110M SR0T4 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002922
€17.14

i3-3110M SR0T4 Stencil Template 90*90

wishlist
Compare

N11MGE2SB1 G310M

N11M-GE2-S-B1 G310M

Part Number N11M-GE2-S-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1332

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002923
€15.59

N11M-GE2-S-B1 G310M

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Compare

i33217U SR0N9 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002924
€5.40

i3-3217U SR0N9 Stencil Template

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Compare
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