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Maxim MAX1715

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002985
€3.45

Maxim MAX1715

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N14EGEA1 GTX765M

N14E-GE-A1 GTX765M

Part Number N14E-GE-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1413

Package/Case 240 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002986
€116.51

N14E-GE-A1 GTX765M

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AM5545HE44SHL A85545M

AM5545HE44SHL A8-5545M

Part Number AM5545HE44SHL Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

AM5545HE44SHL A8-5545M Processor for Laptop AMD A-Series BGA827 1.7 GHz CPU 4 cores

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002987
€46.67

AM5545HE44SHL A8-5545M

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i57300U SR340 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002989
€17.14

i5-7300U SR340 Stencil Template 90*90

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RICHTEK RT8204L J8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002991
€3.45

RICHTEK RT8204L (J8=)

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48V05A Wall Plug POE Injector Ethernet Adapter IP PhoneCamera Power Supply

48V-0.5A Wall Plug POE Injector Ethernet Adapter IP Phone/Camera Power Supply

A perfect solution for applications where an electrical outlet may not be available, the injector adapter can be used to power PoE-enabled devices such as IP cameras or Wireless Access Points (WAPs). The compact, wall-mountable design makes it easy to install the adapter into areas where space is limited, and can be installed in seconds with no configuration required.

Applications:

IP Phone

Wireless Access Point and Client Devices

Security Camera Systems

Specifications:

Output 48V DC 500mA - Please do not order if your unit requires more than 500 MilliAmps

Input 100-240V 50/60HZ

Output 48V-0.5A

Input Current 1A

Efficiency 80% Min

Line / Load Regulation 3% / 5%

Ripple / Noise 200mV p-p

Turn-On Delay 2 Seconds Max

Rise Time 40 mS Max

Protections Auto Recover Over-Voltage, Short Circuit, Over-Current

Safety and EMC Standards UL 60950, CE

Environmental Standards RoHs

Operating Temperature -10 to +40C (14 to +104F)

Operating Humidity (RH) 5% - 90%

Storage Temperature -20 to +85C (-4 to +185F)

Network Connector Type RJ45 Shielded

POE Type Passive POE ( Pins 4,5 V+, Pins 7,8 V-)

Technical Specifications:

Provides remote power to equipment through CAT 5 Ethernet cable up to 100M

Autoranging switching power supply 100~240V AC

Short circuit, over-current, and over-voltage protection

Reliable 24W passive POE output

Compact, portable size with convenient wall plug design

CH002992
€6.09

48V-0.5A Wall Plug POE Injector Ethernet Adapter IP Phone/Camera Power Supply

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G86300A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002993
€5.40

G86-300-A2 Stencil Template

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i33110M QC4V Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002994
€5.40

i3-3110M QC4V Stencil Template

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NFSPP190NA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002995
€5.40

NF-SPP-190-N-A2 Stencil Template

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NXP PTN3360BBS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002996
€3.45

NXP PTN3360BBS

Maxim MAX1715

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002985
€3.45

Maxim MAX1715

wishlist
Compare

N14EGEA1 GTX765M

N14E-GE-A1 GTX765M

Part Number N14E-GE-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1413

Package/Case 240 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002986
€116.51

N14E-GE-A1 GTX765M

wishlist
Compare

AM5545HE44SHL A85545M

AM5545HE44SHL A8-5545M

Part Number AM5545HE44SHL Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

AM5545HE44SHL A8-5545M Processor for Laptop AMD A-Series BGA827 1.7 GHz CPU 4 cores

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002987
€46.67

AM5545HE44SHL A8-5545M

wishlist
Compare

i57300U SR340 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002989
€17.14

i5-7300U SR340 Stencil Template 90*90

wishlist
Compare

RICHTEK RT8204L J8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002991
€3.45

RICHTEK RT8204L (J8=)

wishlist
Compare

48V05A Wall Plug POE Injector Ethernet Adapter IP PhoneCamera Power Supply

48V-0.5A Wall Plug POE Injector Ethernet Adapter IP Phone/Camera Power Supply

A perfect solution for applications where an electrical outlet may not be available, the injector adapter can be used to power PoE-enabled devices such as IP cameras or Wireless Access Points (WAPs). The compact, wall-mountable design makes it easy to install the adapter into areas where space is limited, and can be installed in seconds with no configuration required.

Applications:

IP Phone

Wireless Access Point and Client Devices

Security Camera Systems

Specifications:

Output 48V DC 500mA - Please do not order if your unit requires more than 500 MilliAmps

Input 100-240V 50/60HZ

Output 48V-0.5A

Input Current 1A

Efficiency 80% Min

Line / Load Regulation 3% / 5%

Ripple / Noise 200mV p-p

Turn-On Delay 2 Seconds Max

Rise Time 40 mS Max

Protections Auto Recover Over-Voltage, Short Circuit, Over-Current

Safety and EMC Standards UL 60950, CE

Environmental Standards RoHs

Operating Temperature -10 to +40C (14 to +104F)

Operating Humidity (RH) 5% - 90%

Storage Temperature -20 to +85C (-4 to +185F)

Network Connector Type RJ45 Shielded

POE Type Passive POE ( Pins 4,5 V+, Pins 7,8 V-)

Technical Specifications:

Provides remote power to equipment through CAT 5 Ethernet cable up to 100M

Autoranging switching power supply 100~240V AC

Short circuit, over-current, and over-voltage protection

Reliable 24W passive POE output

Compact, portable size with convenient wall plug design

CH002992
€6.09

48V-0.5A Wall Plug POE Injector Ethernet Adapter IP Phone/Camera Power Supply

wishlist
Compare

G86300A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002993
€5.40

G86-300-A2 Stencil Template

wishlist
Compare

i33110M QC4V Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002994
€5.40

i3-3110M QC4V Stencil Template

wishlist
Compare

NFSPP190NA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002995
€5.40

NF-SPP-190-N-A2 Stencil Template

wishlist
Compare

NXP PTN3360BBS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002996
€3.45

NXP PTN3360BBS

wishlist
Compare
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