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Realtek RTL8309SB

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002997
€5.56

Realtek RTL8309SB

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i75700HQ SR2BP Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002998
€6.47

i7-5700HQ SR2BP Stencil Template

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Realtek RTL8111DL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002999
€3.45

Realtek RTL8111DL

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SR1EQ i34025U

SR1EQ i3-4025U

Part Number i3-4025U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003000
€100.10

SR1EQ i3-4025U

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i56360U SR2JM Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003001
€17.14

i5-6360U SR2JM Stencil Template 90*90

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Hantek DSO5072P USB Digital Oscilloscope 70MHz 2 Channels 1GSas Length 24K

Hantek DSO5072P Digital Oscilloscope 70MHz 1GSa/s 2 Channels 7.0-inch WVGA(800x480)

Buy Probe Accessories: * PP-80 PP-150 PP-200 PP-150 T3100 Probe Accessories

Feature:

70MHz bandwidths

1GSa/s Real Time sample rate

Large (7.0-inch) color display,WVGA(800x480)

Record length up to 40K

Trigger mode: edge/pulse width/line selectable video/slop/overtime etc.

USB host and device connectivity, standard

Multiple automatic measurements

Four math functions, including FFTs standard

Provides software for PC real-time analysis

VGA Optional

Specifications

Model DSO5072P

Bandwidth 70MHz

Channel 2

Real-Time Sample 1GSa/s

Equivalent Sample 25GSa/s

Memory Depth 40K

Rise Time 5ns

Time Base Accuracy 50ppm

Time Base Range 8ns/div-40s/div

Input Impendance 1MO

VOLTS/DIV Range 2mV/div~5V/div

A/D Converter 8 bit

Position Range 50V(5V/div), 40V(2V/div~500mV/div),

2V(200mV/div~50mV/div),400mV(20mV/div~2mV/div)

DC Gain Accuracy 3% for Normal or Average acquisition mode, 5V/div to 10mV/div;

4% for Normal or Average acquisition mode, 5mV/div to 2mV/div

Bandwidth Limit 20MHz

Trigger Types Edge, Video, Pulse, Slope, Over time, Alternative

Trigger Source CH1, CH2, EXT, EXT/5, AC Line

Math +,-,x,,FFT

Cursor Measurement Voltage difference between cursors: ?V;

Time difference between cursors: ?T;

Reciprocal of ?T in Hertz (1/?T);

Auto Measuerment Frequency, Period, Mean, Pk-Pk, Cycli RMS, Minimum, Maximum, Rise time, Fall Time, +Pulse Width, -Pulse Width, Delay1-2Rise, Delay1-2Fall, +Duty, -Duty, Vbase, Vtop, Vmid, Vamp, Overshoot, Preshoot, Preiod Mean, Preiod RMS, FOVShoot, RPREShoot, BWIDTH?FRF

Display 7"TFT 16K Color LCD, 800*480 dots

Size 313mm x 108mm x 142mm

Weight 2.08KG

Standard Probe PP90

Package including

1 x DSO5072P Digital Oscilloscope

2 x Probes

1 x Power Line

1 x USB Cord

1 x CD

CH003003
€242.42

Hantek DSO5072P USB Digital Oscilloscope 70MHz 2 Channels 1GSa/s Length 24K

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N11MGE1SA3 GT210M

N11M-GE1-S-A3 GT210M

Part Number N11M-GE1-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003006
€16.87

N11M-GE1-S-A3 GT210M

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GM200400A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003007
€6.22

GM200-400-A1 Stencil Template

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PS8625 PARADE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003008
€3.45

PS8625 PARADE

Realtek RTL8309SB

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002997
€5.56

Realtek RTL8309SB

wishlist
Compare

i75700HQ SR2BP Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002998
€6.47

i7-5700HQ SR2BP Stencil Template

wishlist
Compare

Realtek RTL8111DL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002999
€3.45

Realtek RTL8111DL

wishlist
Compare

SR1EQ i34025U

SR1EQ i3-4025U

Part Number i3-4025U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003000
€100.10

SR1EQ i3-4025U

wishlist
Compare

i56360U SR2JM Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003001
€17.14

i5-6360U SR2JM Stencil Template 90*90

wishlist
Compare

Hantek DSO5072P USB Digital Oscilloscope 70MHz 2 Channels 1GSas Length 24K

Hantek DSO5072P Digital Oscilloscope 70MHz 1GSa/s 2 Channels 7.0-inch WVGA(800x480)

Buy Probe Accessories: * PP-80 PP-150 PP-200 PP-150 T3100 Probe Accessories

Feature:

70MHz bandwidths

1GSa/s Real Time sample rate

Large (7.0-inch) color display,WVGA(800x480)

Record length up to 40K

Trigger mode: edge/pulse width/line selectable video/slop/overtime etc.

USB host and device connectivity, standard

Multiple automatic measurements

Four math functions, including FFTs standard

Provides software for PC real-time analysis

VGA Optional

Specifications

Model DSO5072P

Bandwidth 70MHz

Channel 2

Real-Time Sample 1GSa/s

Equivalent Sample 25GSa/s

Memory Depth 40K

Rise Time 5ns

Time Base Accuracy 50ppm

Time Base Range 8ns/div-40s/div

Input Impendance 1MO

VOLTS/DIV Range 2mV/div~5V/div

A/D Converter 8 bit

Position Range 50V(5V/div), 40V(2V/div~500mV/div),

2V(200mV/div~50mV/div),400mV(20mV/div~2mV/div)

DC Gain Accuracy 3% for Normal or Average acquisition mode, 5V/div to 10mV/div;

4% for Normal or Average acquisition mode, 5mV/div to 2mV/div

Bandwidth Limit 20MHz

Trigger Types Edge, Video, Pulse, Slope, Over time, Alternative

Trigger Source CH1, CH2, EXT, EXT/5, AC Line

Math +,-,x,,FFT

Cursor Measurement Voltage difference between cursors: ?V;

Time difference between cursors: ?T;

Reciprocal of ?T in Hertz (1/?T);

Auto Measuerment Frequency, Period, Mean, Pk-Pk, Cycli RMS, Minimum, Maximum, Rise time, Fall Time, +Pulse Width, -Pulse Width, Delay1-2Rise, Delay1-2Fall, +Duty, -Duty, Vbase, Vtop, Vmid, Vamp, Overshoot, Preshoot, Preiod Mean, Preiod RMS, FOVShoot, RPREShoot, BWIDTH?FRF

Display 7"TFT 16K Color LCD, 800*480 dots

Size 313mm x 108mm x 142mm

Weight 2.08KG

Standard Probe PP90

Package including

1 x DSO5072P Digital Oscilloscope

2 x Probes

1 x Power Line

1 x USB Cord

1 x CD

CH003003
€242.42

Hantek DSO5072P USB Digital Oscilloscope 70MHz 2 Channels 1GSa/s Length 24K

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Compare

N11MGE1SA3 GT210M

N11M-GE1-S-A3 GT210M

Part Number N11M-GE1-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003006
€16.87

N11M-GE1-S-A3 GT210M

wishlist
Compare

GM200400A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003007
€6.22

GM200-400-A1 Stencil Template

wishlist
Compare

PS8625 PARADE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003008
€3.45

PS8625 PARADE

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Compare
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