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  • Categories: Apple Parts, BIOS EMC, SMC
  • Categories: BGA Reballing Kits, Stencils
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AM950BADY23AB Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000694
€9.97

AM950BADY23AB Stencil Template 90*90

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New Keyboard Screw Set Replacement For MacBook Pro A1278 A1286 A1297 A1398 A1502 Keyboard Screws

Item specifics

model no.:

For MacBook Pro A1278 A1286 A1297 A1398

quantity:

about 100 pcs/set

Return policy details

Buyers can receive a partial refund, and keep the item(s) if they are not as described or with quality issues by negotiating directly with seller within 30 days from the day the item(s) were received.

Description

Product Name: New Keyboard Screw Set Replacement For MacBook Pro A1278 A1286 A1297 A1398 A1502 Keyboard Screws

Item Code: 397790549

Category: Other Computer Components

Short Description:

Product Type: Keyboard screw set Model no.: For macbook Pro A1278 A1286 A1297 A1398 A1502 Quantity: about 100 pcs/set Condition: New

Quantity: 1 Piece

Package Size: 10.0 * 5.0 * 3.0 ( cm )

Gross Weight/Package: 0.1 ( kg )

CH003881
€8.00

New Keyboard Screw Set Replacement For MacBook Pro A1278 A1286 A1297 A1398 A1502 Keyboard Screws

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BD82HM75 SLJ8F Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000696
€9.97

BD82HM75 SLJ8F Stencil Template 90*90

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216MQA6AVA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000697
€5.40

216MQA6AVA12FG Stencil Template

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5931657A Trackpad Touchpad for MacBook Pro 13 A1502 2013 2014 Retina2

Item Specification:

Product Name

Trackpad Touchpad Mouse Flex Cable for Apple MacBook Pro 13" A1502 2013 2014 Retina

Product Condition

NEW

Compatible Models:

Compatible Model

MacBook Pro A1425 13" 2012 2013 Retina

MacBook Pro A1502 13" 2013 Retina

Compatible Subfamily

A1502

MacBook Pro "Core i5" 2.4 13" Late 2013 Retina

MacBook Pro "Core i5" 2.6 13" Late 2013 Retina

MacBook Pro "Core i7" 2.8 13" Late 2013 Retina

MacBook Pro "Core i5" 2.8 13" Mid-2014 Retina

MacBook Pro "Core i5" 2.6 13" Mid-2014 Retina

MacBook Pro "Core i7" 3.0 13" Mid-2014 Retina

Compatible Model No

MD212LL/A*, ME662LL/A, ME864LL/A* ME866LL/A MGX92LL/A

CH003911
€48.49

593-1657-A Trackpad Touchpad for MacBook Pro 13 A1502 2013 2014 Retina+2

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GF116400A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000698
€5.40

GF116-400-A1 Stencil Template

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GL82HM175 SR30W Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000709
€4.35

GL82HM175 SR30W Stencil Template

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Apple BIOS MBA13 2017 A1466 82000165 EMC3178

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003920
€32.08

Apple BIOS MBA13 2017 A1466 820-00165 EMC3178

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Apple BIOS MBP15 2013 A1398 8203662 EMC2674

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003926
€30.71

Apple BIOS MBP15 2013 A1398 820-3662 EMC2674

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N13PGT1A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000718
€5.40

N13P-GT1-A2 Stencil Template

AM950BADY23AB Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000694
€9.97

AM950BADY23AB Stencil Template 90*90

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New Keyboard Screw Set Replacement For MacBook Pro A1278 A1286 A1297 A1398 A1502 Keyboard Screws

Item specifics

model no.:

For MacBook Pro A1278 A1286 A1297 A1398

quantity:

about 100 pcs/set

Return policy details

Buyers can receive a partial refund, and keep the item(s) if they are not as described or with quality issues by negotiating directly with seller within 30 days from the day the item(s) were received.

Description

Product Name: New Keyboard Screw Set Replacement For MacBook Pro A1278 A1286 A1297 A1398 A1502 Keyboard Screws

Item Code: 397790549

Category: Other Computer Components

Short Description:

Product Type: Keyboard screw set Model no.: For macbook Pro A1278 A1286 A1297 A1398 A1502 Quantity: about 100 pcs/set Condition: New

Quantity: 1 Piece

Package Size: 10.0 * 5.0 * 3.0 ( cm )

Gross Weight/Package: 0.1 ( kg )

CH003881
€8.00

New Keyboard Screw Set Replacement For MacBook Pro A1278 A1286 A1297 A1398 A1502 Keyboard Screws

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BD82HM75 SLJ8F Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000696
€9.97

BD82HM75 SLJ8F Stencil Template 90*90

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Compare

216MQA6AVA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000697
€5.40

216MQA6AVA12FG Stencil Template

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5931657A Trackpad Touchpad for MacBook Pro 13 A1502 2013 2014 Retina2

Item Specification:

Product Name

Trackpad Touchpad Mouse Flex Cable for Apple MacBook Pro 13" A1502 2013 2014 Retina

Product Condition

NEW

Compatible Models:

Compatible Model

MacBook Pro A1425 13" 2012 2013 Retina

MacBook Pro A1502 13" 2013 Retina

Compatible Subfamily

A1502

MacBook Pro "Core i5" 2.4 13" Late 2013 Retina

MacBook Pro "Core i5" 2.6 13" Late 2013 Retina

MacBook Pro "Core i7" 2.8 13" Late 2013 Retina

MacBook Pro "Core i5" 2.8 13" Mid-2014 Retina

MacBook Pro "Core i5" 2.6 13" Mid-2014 Retina

MacBook Pro "Core i7" 3.0 13" Mid-2014 Retina

Compatible Model No

MD212LL/A*, ME662LL/A, ME864LL/A* ME866LL/A MGX92LL/A

CH003911
€48.49

593-1657-A Trackpad Touchpad for MacBook Pro 13 A1502 2013 2014 Retina+2

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GF116400A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000698
€5.40

GF116-400-A1 Stencil Template

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GL82HM175 SR30W Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000709
€4.35

GL82HM175 SR30W Stencil Template

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Compare

Apple BIOS MBA13 2017 A1466 82000165 EMC3178

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003920
€32.08

Apple BIOS MBA13 2017 A1466 820-00165 EMC3178

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Apple BIOS MBP15 2013 A1398 8203662 EMC2674

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003926
€30.71

Apple BIOS MBP15 2013 A1398 820-3662 EMC2674

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Compare

N13PGT1A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000718
€5.40

N13P-GT1-A2 Stencil Template

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