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  • Categories: Apple Parts, BIOS EMC, SMC
  • Categories: Other BGA Chips & ICs
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TI TPS51427TI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000650
€3.45

TI TPS51427TI

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QUALCOMM SMB347ET1699Y

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000651
€3.45

QUALCOMM SMB347ET-1699Y

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Apple BIOS MBP15 2013 A1398 8203662 EMC2674

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003926
€30.71

Apple BIOS MBP15 2013 A1398 820-3662 EMC2674

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ITE IT8502E KXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000652
€3.45

ITE IT8502E (KXO)

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ITE IT8585VG FXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000655
€6.35

ITE IT8585VG FXO

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MXIC MX25L1605DM2I

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000659
€3.45

MXIC MX25L1605DM2I

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Wireless Bluetooth Stereo Headset Charging Bunker For iPhone Samsung

Product Description

Features of I7 bluetooth headset:

1. listening to the song correct, support songs and call,

2. remind call number, the last call back, all intelligent Chinese and English voice prompts, boot, pair, shut down the phone power will be low voice prompts;

3. Power capacity will show on your Apple Iphone, you can see the power situation anytime, do not worry about the electricity ,make your life without worry;

4. Can be connected to two mobile phones at the same time

5. Bluetooth headset connected to the phone after the shutdown, and then open the Bluetooth headset will connect back to the phoneautomatically, more convenient;

6. Intelligent compatibility: support all Bluetooth mobile phone, tablet, notebook, singing it, QQ music, movies, etc., universal all mobile phone;

Specification:

1. Driver: 15mm

2. Impedance: 32 OHM

3. Bluetooth version: Bluetooth v4.1 + EDR

4. Bluetooth use band: 2.4GHz

5. Power level: CLASS II

6. Output power: 30mW

7. Bluetooth distance: 10 meters barrier

8. Frequency response: 20-20000Hz

9. Operating voltage range: 3.0V-4.2V

10. Mitou sensitivity: -42dB

11. With A2DP / AVRCP high quality stereo audio transmission and remote control protocol

12. Powerful noise de-noising circuit (active noise reduction)

13. switch between Chinese and English (boot does not connect Bluetooth state, press the switch 2 times, hear the tone switch successfully)

14. Charging time about 1 hour (power indicator charging: red light, full power: red light off (blue light).)

15. Product Size: Length 25MM. Width 15MM. High 35mm

16. Talk time is about 4-5 hours

17. music time about 4-5 hours

18. Standby time is about 120 hours

19. The charging time is about 60 minutes

20. Battery capacity 60MAH

Package Includes:

2*mini Bluetooth Headphones (2pcs)

1*USB Charging Cable

1*Charging Bunker

1*User Manual

CH003981
€37.17

Wireless Bluetooth Stereo Headset + Charging Bunker For iPhone Samsung

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BGEE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000661
€3.45

BG=EE

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SIS 630S

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000664
€15.89

SIS 630S

TI TPS51427TI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000650
€3.45

TI TPS51427TI

wishlist
Compare

QUALCOMM SMB347ET1699Y

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000651
€3.45

QUALCOMM SMB347ET-1699Y

wishlist
Compare

Apple BIOS MBP15 2013 A1398 8203662 EMC2674

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003926
€30.71

Apple BIOS MBP15 2013 A1398 820-3662 EMC2674

wishlist
Compare

ITE IT8502E KXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000652
€3.45

ITE IT8502E (KXO)

wishlist
Compare

ITE IT8585VG FXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000655
€6.35

ITE IT8585VG FXO

wishlist
Compare

MXIC MX25L1605DM2I

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000659
€3.45

MXIC MX25L1605DM2I

wishlist
Compare

Wireless Bluetooth Stereo Headset Charging Bunker For iPhone Samsung

Product Description

Features of I7 bluetooth headset:

1. listening to the song correct, support songs and call,

2. remind call number, the last call back, all intelligent Chinese and English voice prompts, boot, pair, shut down the phone power will be low voice prompts;

3. Power capacity will show on your Apple Iphone, you can see the power situation anytime, do not worry about the electricity ,make your life without worry;

4. Can be connected to two mobile phones at the same time

5. Bluetooth headset connected to the phone after the shutdown, and then open the Bluetooth headset will connect back to the phoneautomatically, more convenient;

6. Intelligent compatibility: support all Bluetooth mobile phone, tablet, notebook, singing it, QQ music, movies, etc., universal all mobile phone;

Specification:

1. Driver: 15mm

2. Impedance: 32 OHM

3. Bluetooth version: Bluetooth v4.1 + EDR

4. Bluetooth use band: 2.4GHz

5. Power level: CLASS II

6. Output power: 30mW

7. Bluetooth distance: 10 meters barrier

8. Frequency response: 20-20000Hz

9. Operating voltage range: 3.0V-4.2V

10. Mitou sensitivity: -42dB

11. With A2DP / AVRCP high quality stereo audio transmission and remote control protocol

12. Powerful noise de-noising circuit (active noise reduction)

13. switch between Chinese and English (boot does not connect Bluetooth state, press the switch 2 times, hear the tone switch successfully)

14. Charging time about 1 hour (power indicator charging: red light, full power: red light off (blue light).)

15. Product Size: Length 25MM. Width 15MM. High 35mm

16. Talk time is about 4-5 hours

17. music time about 4-5 hours

18. Standby time is about 120 hours

19. The charging time is about 60 minutes

20. Battery capacity 60MAH

Package Includes:

2*mini Bluetooth Headphones (2pcs)

1*USB Charging Cable

1*Charging Bunker

1*User Manual

CH003981
€37.17

Wireless Bluetooth Stereo Headset + Charging Bunker For iPhone Samsung

wishlist
Compare

BGEE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000661
€3.45

BG=EE

wishlist
Compare

SIS 630S

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000664
€15.89

SIS 630S

wishlist
Compare
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