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  • Categories: CPU and Graphic Chips
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A1398 EMC 2673 Bios Chip EFI Firmware 820-3332 Retina Early 2013 Core i7 I73840QM ME698LLA

PO000115
€18.00 €22.50

A1398 EMC 2673 Bios EFI Firmware 820-3332 Retina Early 2013 Core i7 I7-3840QM ME698LL/A

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G73NB1

G73-N-B1

Part Number G73-N-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001582
€21.33

G73-N-B1

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A1398 EMC 2674 Bios Chip EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I74750HQ ME293LLA

PO000116
€18.00 €22.50

A1398 EMC 2674 Bios EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I7-4750HQ ME293LL/A

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SR1UU J1800

SR1UU J1800

Part Number SR1UU J1800 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code

Package/Case 240 PCS Description Original new

SR1UU J1800 FH8065301615104 Intel Celeron CPU BGA1170 2 41 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001585
€41.52

SR1UU J1800

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A1398 EMC 2674 Bios Chip EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I74850HQ BTOCTO

PO000117
€18.00 €22.50

A1398 EMC 2674 Bios EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I7-4850HQ BTO/CTO

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N14PGTWA2

N14P-GT-W-A2

Part Number N14P-GT-W-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001624
€57.44

N14P-GT-W-A2

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A1398 EMC 2674 Bios Chip EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I74960HQ BTOCTO

PO000118
€18.00 €22.50

A1398 EMC 2674 Bios EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I7-4960HQ BTO/CTO

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SR23Q M5Y71

SR23Q M-5Y71

Part Number SR23Q M-5Y71 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 08+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001644
€57.44

SR23Q M-5Y71

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2160810084

216-0810084

Part Number 216-0810084 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 360 pcs Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001661
€40.05

216-0810084

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N10MGSSA3

N10M-GS-S-A3

Part Number N10M-GS-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001664
€16.89

N10M-GS-S-A3

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A1398 EMC 2876 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74770HQ MGXA2LLA

PO000121
€18.00 €22.50

A1398 EMC 2876 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4770HQ MGXA2LL/A

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DH82HM86 SR17E

DH82HM86 SR17E

Part Number DH82HM86 SR17E Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1436

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001667
€45.95

DH82HM86 SR17E

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A1398 EMC 2673 Bios Chip EFI Firmware 820-3332 Retina Early 2013 Core i7 I73840QM ME698LLA

PO000115
€18.00 €22.50

A1398 EMC 2673 Bios EFI Firmware 820-3332 Retina Early 2013 Core i7 I7-3840QM ME698LL/A

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G73NB1

G73-N-B1

Part Number G73-N-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001582
€21.33

G73-N-B1

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A1398 EMC 2674 Bios Chip EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I74750HQ ME293LLA

PO000116
€18.00 €22.50

A1398 EMC 2674 Bios EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I7-4750HQ ME293LL/A

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SR1UU J1800

SR1UU J1800

Part Number SR1UU J1800 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code

Package/Case 240 PCS Description Original new

SR1UU J1800 FH8065301615104 Intel Celeron CPU BGA1170 2 41 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001585
€41.52

SR1UU J1800

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A1398 EMC 2674 Bios Chip EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I74850HQ BTOCTO

PO000117
€18.00 €22.50

A1398 EMC 2674 Bios EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I7-4850HQ BTO/CTO

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N14PGTWA2

N14P-GT-W-A2

Part Number N14P-GT-W-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001624
€57.44

N14P-GT-W-A2

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A1398 EMC 2674 Bios Chip EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I74960HQ BTOCTO

PO000118
€18.00 €22.50

A1398 EMC 2674 Bios EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I7-4960HQ BTO/CTO

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SR23Q M5Y71

SR23Q M-5Y71

Part Number SR23Q M-5Y71 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 08+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001644
€57.44

SR23Q M-5Y71

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2160810084

216-0810084

Part Number 216-0810084 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 360 pcs Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001661
€40.05

216-0810084

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N10MGSSA3

N10M-GS-S-A3

Part Number N10M-GS-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001664
€16.89

N10M-GS-S-A3

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A1398 EMC 2876 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74770HQ MGXA2LLA

PO000121
€18.00 €22.50

A1398 EMC 2876 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4770HQ MGXA2LL/A

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DH82HM86 SR17E

DH82HM86 SR17E

Part Number DH82HM86 SR17E Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1436

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001667
€45.95

DH82HM86 SR17E

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