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  • Categories: CPU and Graphic Chips
  • Categories: DC Jacks, Connector
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N10MNESA3

N10M-NE-S-A3

Part Number N1N10M-NE-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001400
€16.71

N10M-NE-S-A3

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GF116200KAA1 GTS450

GF116-200-KA-A1 GTS450

Part Number GF116-200-KA-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1238

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001403
€65.64

GF116-200-KA-A1 GTS450

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2160841000

216-0841000

Part Number 216-0841000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001432
€21.77

216-0841000

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DC Power Jack Part PJ055

Compaq Presario DC Power Jack Connector: 900, 903, 904, 905, 906, 907, 908, 909, 910, 911, 912, 914, 915, 916, 917, 918, 919, 920, 921, 922, 925, 927, 930, 935, 940, 943, 945, 950, 955, 1500, 1505, 1507, 1508, 1510, 1515, 1522, 1523, 1525, 1527

Compaq EVO DC Power Jack Connector: N1000C, N1000V, N1005V, N1015V, N1020V

Note: This Jack is for use with AC adapter tips that are 4.75mm in diameter only. Some systems only require 2 pins of the outer Shield, all you need to do is clip off or bend up the outer shield pins you do not need.

CH003273
€7.21

DC Power Jack, Part #PJ055

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N13MGSBA2

N13M-GS-B-A2

Part Number N13M-GS-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1428

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001445
€25.93

N13M-GS-B-A2

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19 pin HDMI Micro USB Jack Connector for Asus Eee Pad TF300T TF201 tf700t Tablet tf502t t100ta micro HDMI Jack

Products Status: Inventory

Type: Cable Adapter

Package: yes

Model Number: for Asus Eee Pad TF300T t100ta TF201 tf502t tf700t

19 pin HDMI Connector, micro USB Port

Jack: HDMI for Asus Eee Pad TF300T t100ta TF201 tf502t tf700t Tablet

HDMI USB Female socket Connector: for Tablet Asus Eee Pad PCB

Cable length: 10.5x6.5x2.8mm

CH003304
€6.53

19 pin HDMI Micro USB Jack Connector for Asus Eee Pad TF300T TF201 tf700t Tablet tf502t t100ta micro HDMI Jack

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SR1EF i54210U

SR1EF i5-4210U

Part Number SR1EF i5-4210U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1339

Package/Case 440 PCS Description Original new

SR1EF i5-4210U CL8064701477802 Intel Core i5 Mobile CPU BGA1168 1.7 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001446
€211.69

SR1EF i5-4210U

N10MNESA3

N10M-NE-S-A3

Part Number N1N10M-NE-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001400
€16.71

N10M-NE-S-A3

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GF116200KAA1 GTS450

GF116-200-KA-A1 GTS450

Part Number GF116-200-KA-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1238

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001403
€65.64

GF116-200-KA-A1 GTS450

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2160841000

216-0841000

Part Number 216-0841000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001432
€21.77

216-0841000

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DC Power Jack Part PJ055

Compaq Presario DC Power Jack Connector: 900, 903, 904, 905, 906, 907, 908, 909, 910, 911, 912, 914, 915, 916, 917, 918, 919, 920, 921, 922, 925, 927, 930, 935, 940, 943, 945, 950, 955, 1500, 1505, 1507, 1508, 1510, 1515, 1522, 1523, 1525, 1527

Compaq EVO DC Power Jack Connector: N1000C, N1000V, N1005V, N1015V, N1020V

Note: This Jack is for use with AC adapter tips that are 4.75mm in diameter only. Some systems only require 2 pins of the outer Shield, all you need to do is clip off or bend up the outer shield pins you do not need.

CH003273
€7.21

DC Power Jack, Part #PJ055

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N13MGSBA2

N13M-GS-B-A2

Part Number N13M-GS-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1428

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001445
€25.93

N13M-GS-B-A2

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19 pin HDMI Micro USB Jack Connector for Asus Eee Pad TF300T TF201 tf700t Tablet tf502t t100ta micro HDMI Jack

Products Status: Inventory

Type: Cable Adapter

Package: yes

Model Number: for Asus Eee Pad TF300T t100ta TF201 tf502t tf700t

19 pin HDMI Connector, micro USB Port

Jack: HDMI for Asus Eee Pad TF300T t100ta TF201 tf502t tf700t Tablet

HDMI USB Female socket Connector: for Tablet Asus Eee Pad PCB

Cable length: 10.5x6.5x2.8mm

CH003304
€6.53

19 pin HDMI Micro USB Jack Connector for Asus Eee Pad TF300T TF201 tf700t Tablet tf502t t100ta micro HDMI Jack

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SR1EF i54210U

SR1EF i5-4210U

Part Number SR1EF i5-4210U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1339

Package/Case 440 PCS Description Original new

SR1EF i5-4210U CL8064701477802 Intel Core i5 Mobile CPU BGA1168 1.7 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001446
€211.69

SR1EF i5-4210U

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