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TI TPS51427TI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000650
€3.45

TI TPS51427TI

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DDK FUJIKURA FPC FLEXIBLE PRINTED CIRCUIT CONNECTOR 30 PIN FF14A30CR11DLB3H

Description:

1 - Flat printed circuit connector (30 Pin)

COMPATIBILITY:

MacBook Unibody 13" A1278

MacBook5,1 Late 2008: MB466LL/A (2.0 GHz Core 2 Duo)

MacBook5,1 Late 2008: MB467LL/A (2.4 GHz Core 2 Duo)

MacBook Unibody 13" A1342

MacBook6,1 Late 2009: MC207LL/A (2.26 GHz Core 2 Duo)

MacBook7,1 Mid 2010: MC516LL/A (2.4 GHz Core 2 Duo)

MacBook Pro Unibody 13" A1278

MacBookPro5,5 Mid 2009: MB990LL/A (2.26 GHz Core 2 Duo)

MacBookPro5,5 Mid 2009: MB991LL/A (2.53 GHz Core 2 Duo)

MacBookPro7,1 Mid 2010: MC374LL/A (2.4 GHz Core 2 Duo)

MacBookPro7,1 Mid 2010: MC375LL/A (2.66 GHz Core 2 Duo)

MacBookPro8,1 Early 2011: MC700LL/A (2.3 GHz Core i5)

MacBookPro8,1 Early 2011: MC724LL/A (2.7 GHz Core i7)

MacBookPro8,1 Late 2011: MD313LL/A (2.4 GHz Core i5)

MacBookPro8,1 Late 2011: MD314LL/A (2.8 GHz Core i7)

MacBookPro9,2 Mid 2012: MD101LL/A (2.5 GHz Core i5)

MacBookPro9,2 Mid 2012: MD102LL/A (2.9 GHz Core i7)

MacBook Pro Unibody 15" A1286

MacBookPro5,1 Late 2008: MB470LL/A (2.4 GHz Core 2 Duo)

MacBookPro5,1 Late 2008: MB471LL/A (2.53 GHz Core 2 Duo)

MacBookPro5,1 Late 2008: MB471LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,1 Early 2009: MC026LL/A (2.66 GHz Core 2 Duo)

MacBookPro5,1 Early 2009: MC026LL/A (2.93 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB985LL/A (2.66 Ghz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB986LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB986LL/A (3.06 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MC406LL/A (2.8 GHz Core 2 Duo) (Anti-Glare Display)

MacBookPro5,3 Mid 2009: MC406LL/A (3.06 GHz Core 2 Duo) (Anti-Glare Display)

MacBookPro5,4 Mid 2009: MC118LL/A (2.53 GHz Core 2 Duo)

MacBookPro6,2 Mid 2010: MC371LL/A (2.4 GHz Core i5)

MacBookPro6,2 Mid 2010: MC372LL/A (2.53 GHz Core i5)

MacBookPro6,2 Mid 2010: MC373LL/A (2.66 GHz Core i7)

MacBookPro6,2 Mid 2010: MC373LL/A (2.8 GHZ Core i7)

MacBookPro8,2 Early 2011: MC721LL/A (2.0 GHz Core i7)

MacBookPro8,2 Early 2011: MC723LL/A (2.2 GHz Core i7)

MacBookPro8,2 Early 2011: MD035LL/A (2.3 GHz Core i7)

MacBookPro8,2 Late 2011: MD318LL/A (2.2 GHz Core i7)

MacBookPro8,2 Late 2011: MD322LL/A (2.4 GHz Core i7)

MacBookPro8,2 Late 2011: MD322LL/A (2.5 GHz Core i7)

MacBookPro9,1 Mid 2012: MD103LL/A (2.3 GHz Core i7)

MacBookPro9,1 Mid 2012: MD104LL/A (2.6 GHz Core i7)

MacBookPro9,1 Mid 2012: MD104LL/A (2.7 GHz Core i7)

MacBook Pro Unibody 17" A1297

MacBookPro5,2 Early 2009: MB604LL/A (2.66 GHz Core 2 Duo)

MacBookPro5,2 Early 2009: MB604LL/A (2.93 GHz Core 2 Duo)

MacBookPro5,2 Mid 2009: MC226LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,2 Mid 2009: MC226LL/A (3.06 GHz Core 2 Duo)

MacBookPro6,1 Mid 2010: MC024LL/A (2.53 GHz Core i5)

MacBookPro6,1 Mid 2010: MC024LL/A (2.66 GHz Core i7)

MacBookPro6,1 Mid 2010: MC024LL/A (2.8 GHz Core i7)

MacBookPro8,3 Early 2011: MC725LL/A (2.2 GHz Core i7)

MacBookPro8,3 Early 2011: MC725LL/A (2.3 GHz Core i7)

MacBookPro8,3 Late 2011: MD311LL/A (2.4 GHz Core i7)

CH000962
€4.35

DDK FUJIKURA FPC FLEXIBLE PRINTED CIRCUIT CONNECTOR 30 PIN FF14A-30C-R11DL-B-3H

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QUALCOMM SMB347ET1699Y

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000651
€3.45

QUALCOMM SMB347ET-1699Y

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1.0m OMEGA KTYPE Thermocouple TTK30SLE

OMEGA thermocouple line

Model: temperature range: -200? ~260? (PTFE material) -200-500? (glass fiber material)

Wire diameter: 2*F0.127mm 2*0.255MM

Core material: nickel chromium / nickel silicon (K) copper / constantan (T) iron / copper nickel (J)

Color mark: red is negative / yellow is positive

The thermocouple temperature line for any K type imported and domestic use temperature recording instrument, used in the laboratory, aerospace engineering, shipbuilding, petrochemical, machinery fittings (reflow) etc.

CH000967
€5.59

1.0m OMEGA K-TYPE Thermocouple TT-K-30-SLE

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ITE IT8502E KXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000652
€3.45

ITE IT8502E (KXO)

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ITE IT8585VG FXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000655
€6.35

ITE IT8585VG FXO

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0.3m OMEGA KTYPE Thermocouple TTK30SLE

OMEGA thermocouple line

Model: temperature range: -200? ~260? (PTFE material) -200-500? (glass fiber material)

Wire diameter: 2*F0.127mm 2*0.255MM

Core material: nickel chromium / nickel silicon (K) copper / constantan (T) iron / copper nickel (J)

Color mark: red is negative / yellow is positive

The thermocouple temperature line for any K type imported and domestic use temperature recording instrument, used in the laboratory, aerospace engineering, shipbuilding, petrochemical, machinery fittings (reflow) etc.

CH000993
€4.85

0.3m OMEGA K-TYPE Thermocouple TT-K-30-SLE

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MXIC MX25L1605DM2I

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000659
€3.45

MXIC MX25L1605DM2I

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BGEE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000661
€3.45

BG=EE

TI TPS51427TI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000650
€3.45

TI TPS51427TI

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DDK FUJIKURA FPC FLEXIBLE PRINTED CIRCUIT CONNECTOR 30 PIN FF14A30CR11DLB3H

Description:

1 - Flat printed circuit connector (30 Pin)

COMPATIBILITY:

MacBook Unibody 13" A1278

MacBook5,1 Late 2008: MB466LL/A (2.0 GHz Core 2 Duo)

MacBook5,1 Late 2008: MB467LL/A (2.4 GHz Core 2 Duo)

MacBook Unibody 13" A1342

MacBook6,1 Late 2009: MC207LL/A (2.26 GHz Core 2 Duo)

MacBook7,1 Mid 2010: MC516LL/A (2.4 GHz Core 2 Duo)

MacBook Pro Unibody 13" A1278

MacBookPro5,5 Mid 2009: MB990LL/A (2.26 GHz Core 2 Duo)

MacBookPro5,5 Mid 2009: MB991LL/A (2.53 GHz Core 2 Duo)

MacBookPro7,1 Mid 2010: MC374LL/A (2.4 GHz Core 2 Duo)

MacBookPro7,1 Mid 2010: MC375LL/A (2.66 GHz Core 2 Duo)

MacBookPro8,1 Early 2011: MC700LL/A (2.3 GHz Core i5)

MacBookPro8,1 Early 2011: MC724LL/A (2.7 GHz Core i7)

MacBookPro8,1 Late 2011: MD313LL/A (2.4 GHz Core i5)

MacBookPro8,1 Late 2011: MD314LL/A (2.8 GHz Core i7)

MacBookPro9,2 Mid 2012: MD101LL/A (2.5 GHz Core i5)

MacBookPro9,2 Mid 2012: MD102LL/A (2.9 GHz Core i7)

MacBook Pro Unibody 15" A1286

MacBookPro5,1 Late 2008: MB470LL/A (2.4 GHz Core 2 Duo)

MacBookPro5,1 Late 2008: MB471LL/A (2.53 GHz Core 2 Duo)

MacBookPro5,1 Late 2008: MB471LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,1 Early 2009: MC026LL/A (2.66 GHz Core 2 Duo)

MacBookPro5,1 Early 2009: MC026LL/A (2.93 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB985LL/A (2.66 Ghz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB986LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB986LL/A (3.06 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MC406LL/A (2.8 GHz Core 2 Duo) (Anti-Glare Display)

MacBookPro5,3 Mid 2009: MC406LL/A (3.06 GHz Core 2 Duo) (Anti-Glare Display)

MacBookPro5,4 Mid 2009: MC118LL/A (2.53 GHz Core 2 Duo)

MacBookPro6,2 Mid 2010: MC371LL/A (2.4 GHz Core i5)

MacBookPro6,2 Mid 2010: MC372LL/A (2.53 GHz Core i5)

MacBookPro6,2 Mid 2010: MC373LL/A (2.66 GHz Core i7)

MacBookPro6,2 Mid 2010: MC373LL/A (2.8 GHZ Core i7)

MacBookPro8,2 Early 2011: MC721LL/A (2.0 GHz Core i7)

MacBookPro8,2 Early 2011: MC723LL/A (2.2 GHz Core i7)

MacBookPro8,2 Early 2011: MD035LL/A (2.3 GHz Core i7)

MacBookPro8,2 Late 2011: MD318LL/A (2.2 GHz Core i7)

MacBookPro8,2 Late 2011: MD322LL/A (2.4 GHz Core i7)

MacBookPro8,2 Late 2011: MD322LL/A (2.5 GHz Core i7)

MacBookPro9,1 Mid 2012: MD103LL/A (2.3 GHz Core i7)

MacBookPro9,1 Mid 2012: MD104LL/A (2.6 GHz Core i7)

MacBookPro9,1 Mid 2012: MD104LL/A (2.7 GHz Core i7)

MacBook Pro Unibody 17" A1297

MacBookPro5,2 Early 2009: MB604LL/A (2.66 GHz Core 2 Duo)

MacBookPro5,2 Early 2009: MB604LL/A (2.93 GHz Core 2 Duo)

MacBookPro5,2 Mid 2009: MC226LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,2 Mid 2009: MC226LL/A (3.06 GHz Core 2 Duo)

MacBookPro6,1 Mid 2010: MC024LL/A (2.53 GHz Core i5)

MacBookPro6,1 Mid 2010: MC024LL/A (2.66 GHz Core i7)

MacBookPro6,1 Mid 2010: MC024LL/A (2.8 GHz Core i7)

MacBookPro8,3 Early 2011: MC725LL/A (2.2 GHz Core i7)

MacBookPro8,3 Early 2011: MC725LL/A (2.3 GHz Core i7)

MacBookPro8,3 Late 2011: MD311LL/A (2.4 GHz Core i7)

CH000962
€4.35

DDK FUJIKURA FPC FLEXIBLE PRINTED CIRCUIT CONNECTOR 30 PIN FF14A-30C-R11DL-B-3H

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QUALCOMM SMB347ET1699Y

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000651
€3.45

QUALCOMM SMB347ET-1699Y

wishlist
Compare

1.0m OMEGA KTYPE Thermocouple TTK30SLE

OMEGA thermocouple line

Model: temperature range: -200? ~260? (PTFE material) -200-500? (glass fiber material)

Wire diameter: 2*F0.127mm 2*0.255MM

Core material: nickel chromium / nickel silicon (K) copper / constantan (T) iron / copper nickel (J)

Color mark: red is negative / yellow is positive

The thermocouple temperature line for any K type imported and domestic use temperature recording instrument, used in the laboratory, aerospace engineering, shipbuilding, petrochemical, machinery fittings (reflow) etc.

CH000967
€5.59

1.0m OMEGA K-TYPE Thermocouple TT-K-30-SLE

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ITE IT8502E KXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000652
€3.45

ITE IT8502E (KXO)

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ITE IT8585VG FXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000655
€6.35

ITE IT8585VG FXO

wishlist
Compare

0.3m OMEGA KTYPE Thermocouple TTK30SLE

OMEGA thermocouple line

Model: temperature range: -200? ~260? (PTFE material) -200-500? (glass fiber material)

Wire diameter: 2*F0.127mm 2*0.255MM

Core material: nickel chromium / nickel silicon (K) copper / constantan (T) iron / copper nickel (J)

Color mark: red is negative / yellow is positive

The thermocouple temperature line for any K type imported and domestic use temperature recording instrument, used in the laboratory, aerospace engineering, shipbuilding, petrochemical, machinery fittings (reflow) etc.

CH000993
€4.85

0.3m OMEGA K-TYPE Thermocouple TT-K-30-SLE

wishlist
Compare

MXIC MX25L1605DM2I

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000659
€3.45

MXIC MX25L1605DM2I

wishlist
Compare

BGEE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000661
€3.45

BG=EE

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Compare
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