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  • Categories: Other BGA Chips & ICs

2150669065 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000501
€5.40

215-0669065 Stencil Template

Realtek ALC3223

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000527
€3.45

Realtek ALC3223

UNIT UT58E LCR Meter Digital Multimeters w Frequency Temperature test Ammeter

DC Voltage:200mV/2V/20V/200V/1000V (0.05%+3)

AC Voltage:2V/20V/200V/1000V(0.5%+10)

DC Current:2mA/200mA/20A (0.5%+5)

AC Current:20mA/200mA/20A (0.8%+10)

Resistance:200W/2kW/20kW/2MW/200MW (0.5%+10)

Capacitance:2nF/20nF/2mF/20mF (3%+40)

Temperature(Degrees Celsius):40Degrees Celsius ~ 1000Degrees Celsius (1%+30)

Frequency:20kHz(1.5%+5)

Diode

Continuity Buzzer

Transistor

Data Hold

Full Icon Display

Sleep Mode

Low Battery Display

Input Impedance for DC

Voltage Measurement:Around 10MW

Max Display:19999

Power:9V Battery (6F22)(not include)

LCD Size:60 x 54mm

Product Colour:Grey Red

Product Net Weight :350g (including holster)

Product Size:180mm*80mm*40mm

Material:plastic metal

packing include:1*UT58E Multimeters(with test red black pen),1*Test Lead, 1*Battery, 1*English Manual, 1*Point Contact Temperature Probe, 1*Test Clip, 1*Multi-Purpose Socket, 1*Holster,1*Gift Box

Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.

CH003802
€58.31

UNI-T UT58E LCR Meter Digital Multimeters w/ Frequency Temperature test Ammeter

Intersil ISL62881HRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000528
€3.45

Intersil ISL62881HRTZ

2160810084 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000507
€5.40

216-0810084 Stencil Template

N11PGEA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000509
€5.40

N11P-GE-A1 Stencil Template

ITE IT8572E AXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000532
€3.45

ITE IT8572E (AXS)

N3150 SR2A8 Stencil Template

N3150 SR2A8 Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000514
€6.22

N3150 SR2A8 Stencil Template

SW63163VB14 SYMWAVE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000535
€11.12

SW6316-3VB14 SYMWAVE

TVPCVGAHDMIUSB Keypad LVDS Cable V29V56V59 RR850303C Universal TV Controller Driver Board

Description:

- Universal LCD TV driver board, TV board

- VGA interface: can be connected to a computer

- HDMI HD interface: can play 1080P

- AV interface: can be connected to the set-top box

- Audio input: can be connected to a computer

- Audio output: can be connected to headphones, audio

- USB interface: play pictures, MP3, video, text

- TV interface: can connect to cable TV

CH003878
€22.25

TV/PC/VGA/HDMI/USB Keypad LVDS Cable V29V56V59 RR8503-03C Universal TV Controller Driver Board

2150669065 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000501
€5.40

215-0669065 Stencil Template

Realtek ALC3223

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000527
€3.45

Realtek ALC3223

UNIT UT58E LCR Meter Digital Multimeters w Frequency Temperature test Ammeter

DC Voltage:200mV/2V/20V/200V/1000V (0.05%+3)

AC Voltage:2V/20V/200V/1000V(0.5%+10)

DC Current:2mA/200mA/20A (0.5%+5)

AC Current:20mA/200mA/20A (0.8%+10)

Resistance:200W/2kW/20kW/2MW/200MW (0.5%+10)

Capacitance:2nF/20nF/2mF/20mF (3%+40)

Temperature(Degrees Celsius):40Degrees Celsius ~ 1000Degrees Celsius (1%+30)

Frequency:20kHz(1.5%+5)

Diode

Continuity Buzzer

Transistor

Data Hold

Full Icon Display

Sleep Mode

Low Battery Display

Input Impedance for DC

Voltage Measurement:Around 10MW

Max Display:19999

Power:9V Battery (6F22)(not include)

LCD Size:60 x 54mm

Product Colour:Grey Red

Product Net Weight :350g (including holster)

Product Size:180mm*80mm*40mm

Material:plastic metal

packing include:1*UT58E Multimeters(with test red black pen),1*Test Lead, 1*Battery, 1*English Manual, 1*Point Contact Temperature Probe, 1*Test Clip, 1*Multi-Purpose Socket, 1*Holster,1*Gift Box

Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.

CH003802
€58.31

UNI-T UT58E LCR Meter Digital Multimeters w/ Frequency Temperature test Ammeter

Intersil ISL62881HRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000528
€3.45

Intersil ISL62881HRTZ

2160810084 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000507
€5.40

216-0810084 Stencil Template

N11PGEA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000509
€5.40

N11P-GE-A1 Stencil Template

ITE IT8572E AXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000532
€3.45

ITE IT8572E (AXS)

N3150 SR2A8 Stencil Template

N3150 SR2A8 Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000514
€6.22

N3150 SR2A8 Stencil Template

SW63163VB14 SYMWAVE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000535
€11.12

SW6316-3VB14 SYMWAVE

TVPCVGAHDMIUSB Keypad LVDS Cable V29V56V59 RR850303C Universal TV Controller Driver Board

Description:

- Universal LCD TV driver board, TV board

- VGA interface: can be connected to a computer

- HDMI HD interface: can play 1080P

- AV interface: can be connected to the set-top box

- Audio input: can be connected to a computer

- Audio output: can be connected to headphones, audio

- USB interface: play pictures, MP3, video, text

- TV interface: can connect to cable TV

CH003878
€22.25

TV/PC/VGA/HDMI/USB Keypad LVDS Cable V29V56V59 RR8503-03C Universal TV Controller Driver Board