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Mastech MS8910 SMD RC Resistance Capacitance Meter Tester Auto Scanning

Features:

3000 counts LCD display

Full automatic measurement

Auto scanning the Resistance/Capacitance/Diode

Function selection by one FUNC Push Button

Data Hold function

Continuity checking function

Over Load Indication (?OL)

Low Battery Indication

Power Supply: 3V Lithium Battery CR2032 1PC (included)

Auto power-off. If the Tester is idle for more than 10 minutes, the tester will automatically turn off the power.

Operating temperature & Humidity: 0 ~ 40C (32 ~104F) & < 80% RH

Storage temperature & Humidity: -10 ~ 50C (14 ~ 122 F) & <70%RH

Safety Class: IEC1010-1, CAT II

EMC: According to CE regulation 89/336.

Dimension(L x W x H): 170 *31* 17mm/6.89 *1.26 *0.79in

Packing size: 20.4 * 5.8 * 2.8cm/ 8 * 2.2 * 1.1in

Weight: Approx. 50g/1.76oz (Not include battery)

Packing weight: Approx 100g/ 3.5oz

Specifications:

Function Range Resolution Accuracy

300O (1.0% of rdg + 2 digits)

3KO

Resistance 30KO 0.1O

300KO

3MO

30MO (1.2% of rdg + 3 digits)

3n F (2.5% of rdg + 3 digits)

30n F

300n F 1p F

Capacitance 3F

30F

300F (3.0% of rdg + 3 digits)

3m F

30m F

Diode Open Circuit Voltage: 2.8 V

Check Testing Current: 2mA

Continuity Check The buzzer will sound if the resistance is less than 30O

Package includes:

1x SMD tester

2 x Backup test pins

1 x Storage box

1 x User manual

1 x battery

CH004732
€34.69

Mastech MS8910 SMD RC Resistance Capacitance Meter Tester Auto Scanning

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SOIC8 SOP8 To DIP8 CLIP for RT80x809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

Multi-function SOIC16 SOP16 SOP8 To DIP8 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000 SoFi-SP8 SoFi-SP16

Cable Size: 40CM

SPI FLASH chip SOP8 and SOP16 connection

A lot of new types of notebook and router is currently using 25 SPI memory chip, SOP16 chip package, such as MX25L3205 chip; although many programmers can support MX25L3205 chip, but it is the MX25L3205 chip supports SOP8 package, the MX25L3205 chip does not directly support the SOP16 package; and the adapter chip are not the same. One is 8 feet, one is 16 feet. So, is it possible to program SOP15 MX25L3205 chips in a simple way? In fact, the process is simple, because the 25 SPI chip SOP8 and SOP16 package chip, the definition of the corresponding foot is the same, as long as the corresponding SOP16 feet and SOP8 feet corresponding connection, the operating process can be used SOP8 MX25L3205 chip to operate on SOP16 MX25L3205 chip. (as long as 25 SPI chip models are identical, SOP8 and SOP16 chips can be used in this way)

25 SPI chip, SOP8 and SOP16 chip is interchangeable, as long as the chip pin corresponding to the line

Specifications for SOP8 packages and SOP16 packages:

SOP8 and SOP16 package, the foot spacing is the same, are 1.27, but the chip width is different. And chip definition of the corresponding pin is exactly the same, but the SOP16 chip packaging more than 8 feet NC empty feet (for future expansion as a basis), refer to the following figure, you can easily determine the SOP and SOP 25 SPI chip foot definition:

25 SPI SOP16 and SOP8 chip pins define the relationship:

The program can be programmed as long as the SOP16 pin is connected to the SOP8 adapter or directly to the programmer's seat.

In addition, MX25L3205 also has a TSSOP14 chip, the foot corresponding to the following picture:

CH001842
€7.42

SOIC8 SOP8 To DIP8 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

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eMMC FBGA169 BGA153 Adapter 11513 to SD

Buy Limit Frame: * 11.5*13mm, 12*16mm, 12*18mm, 14*18mm

Product Characteristics

1. Using standard SD interface mode, the corresponding operation such as test or burning can be realized by connecting card reader with computer or through SD interface of programmer.

2. Compatible with ball-and-ball testing, IC limit frame is molded in one. It can be replaced by different size limit frame according to IC, so that IC of different size can be used universally.

3. Supporting hot plug-in and testing for PIN connection through SD interface or through connection with board row;

4. PCB adopts four-layer circuit structure to reduce the instability of test caused by signal interference. The golden finger is plated with thick gold to ensure durability and contact.

5. At the same time compatible: Toshiba, Samsung, Hynix, Intel, Sandisk and other brand IC;

6. Compatible with 153-FBGA 169-FBGA;

7. The shrapnel is stamped by imported beryllium copper through high precision die, the head-shaped probe is designed, and the later stage is hardened and plated with thick gold layer to ensure the stability and durability of the product.

8. The whole structure of the contact module reduces the repetitive positioning problem, ensures the precise alignment between the contact point and the IC PAD, and has a high pass rate in one test.

9. The through-hole welding structure is adopted to ensure good contact, and the positioning holes of SOCKET and PCBA are precisely positioned to facilitate replacement.

10. The top-window structure is adopted, which is compatible with manual and automatic testing and easy to operate.

11. Pressure IC adopts self-adapting structure of integral moulding and spring, which ensures that IC with different thickness does not need any adjustment to ensure good contact and wide universality of IC for testing.

12. The structure is formed by injection moulding, with precise positioning, easy access to IC and higher working efficiency.

CH001879
€92.00

eMMC FBGA169/BGA153 Adapter 11.5*13 to SD

Mastech MS8910 SMD RC Resistance Capacitance Meter Tester Auto Scanning

Features:

3000 counts LCD display

Full automatic measurement

Auto scanning the Resistance/Capacitance/Diode

Function selection by one FUNC Push Button

Data Hold function

Continuity checking function

Over Load Indication (?OL)

Low Battery Indication

Power Supply: 3V Lithium Battery CR2032 1PC (included)

Auto power-off. If the Tester is idle for more than 10 minutes, the tester will automatically turn off the power.

Operating temperature & Humidity: 0 ~ 40C (32 ~104F) & < 80% RH

Storage temperature & Humidity: -10 ~ 50C (14 ~ 122 F) & <70%RH

Safety Class: IEC1010-1, CAT II

EMC: According to CE regulation 89/336.

Dimension(L x W x H): 170 *31* 17mm/6.89 *1.26 *0.79in

Packing size: 20.4 * 5.8 * 2.8cm/ 8 * 2.2 * 1.1in

Weight: Approx. 50g/1.76oz (Not include battery)

Packing weight: Approx 100g/ 3.5oz

Specifications:

Function Range Resolution Accuracy

300O (1.0% of rdg + 2 digits)

3KO

Resistance 30KO 0.1O

300KO

3MO

30MO (1.2% of rdg + 3 digits)

3n F (2.5% of rdg + 3 digits)

30n F

300n F 1p F

Capacitance 3F

30F

300F (3.0% of rdg + 3 digits)

3m F

30m F

Diode Open Circuit Voltage: 2.8 V

Check Testing Current: 2mA

Continuity Check The buzzer will sound if the resistance is less than 30O

Package includes:

1x SMD tester

2 x Backup test pins

1 x Storage box

1 x User manual

1 x battery

CH004732
€34.69

Mastech MS8910 SMD RC Resistance Capacitance Meter Tester Auto Scanning

wishlist
Compare

SOIC8 SOP8 To DIP8 CLIP for RT80x809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

Multi-function SOIC16 SOP16 SOP8 To DIP8 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000 SoFi-SP8 SoFi-SP16

Cable Size: 40CM

SPI FLASH chip SOP8 and SOP16 connection

A lot of new types of notebook and router is currently using 25 SPI memory chip, SOP16 chip package, such as MX25L3205 chip; although many programmers can support MX25L3205 chip, but it is the MX25L3205 chip supports SOP8 package, the MX25L3205 chip does not directly support the SOP16 package; and the adapter chip are not the same. One is 8 feet, one is 16 feet. So, is it possible to program SOP15 MX25L3205 chips in a simple way? In fact, the process is simple, because the 25 SPI chip SOP8 and SOP16 package chip, the definition of the corresponding foot is the same, as long as the corresponding SOP16 feet and SOP8 feet corresponding connection, the operating process can be used SOP8 MX25L3205 chip to operate on SOP16 MX25L3205 chip. (as long as 25 SPI chip models are identical, SOP8 and SOP16 chips can be used in this way)

25 SPI chip, SOP8 and SOP16 chip is interchangeable, as long as the chip pin corresponding to the line

Specifications for SOP8 packages and SOP16 packages:

SOP8 and SOP16 package, the foot spacing is the same, are 1.27, but the chip width is different. And chip definition of the corresponding pin is exactly the same, but the SOP16 chip packaging more than 8 feet NC empty feet (for future expansion as a basis), refer to the following figure, you can easily determine the SOP and SOP 25 SPI chip foot definition:

25 SPI SOP16 and SOP8 chip pins define the relationship:

The program can be programmed as long as the SOP16 pin is connected to the SOP8 adapter or directly to the programmer's seat.

In addition, MX25L3205 also has a TSSOP14 chip, the foot corresponding to the following picture:

CH001842
€7.42

SOIC8 SOP8 To DIP8 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

wishlist
Compare

eMMC FBGA169 BGA153 Adapter 11513 to SD

Buy Limit Frame: * 11.5*13mm, 12*16mm, 12*18mm, 14*18mm

Product Characteristics

1. Using standard SD interface mode, the corresponding operation such as test or burning can be realized by connecting card reader with computer or through SD interface of programmer.

2. Compatible with ball-and-ball testing, IC limit frame is molded in one. It can be replaced by different size limit frame according to IC, so that IC of different size can be used universally.

3. Supporting hot plug-in and testing for PIN connection through SD interface or through connection with board row;

4. PCB adopts four-layer circuit structure to reduce the instability of test caused by signal interference. The golden finger is plated with thick gold to ensure durability and contact.

5. At the same time compatible: Toshiba, Samsung, Hynix, Intel, Sandisk and other brand IC;

6. Compatible with 153-FBGA 169-FBGA;

7. The shrapnel is stamped by imported beryllium copper through high precision die, the head-shaped probe is designed, and the later stage is hardened and plated with thick gold layer to ensure the stability and durability of the product.

8. The whole structure of the contact module reduces the repetitive positioning problem, ensures the precise alignment between the contact point and the IC PAD, and has a high pass rate in one test.

9. The through-hole welding structure is adopted to ensure good contact, and the positioning holes of SOCKET and PCBA are precisely positioned to facilitate replacement.

10. The top-window structure is adopted, which is compatible with manual and automatic testing and easy to operate.

11. Pressure IC adopts self-adapting structure of integral moulding and spring, which ensures that IC with different thickness does not need any adjustment to ensure good contact and wide universality of IC for testing.

12. The structure is formed by injection moulding, with precise positioning, easy access to IC and higher working efficiency.

CH001879
€92.00

eMMC FBGA169/BGA153 Adapter 11.5*13 to SD

wishlist
Compare
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